Abstract: In some embodiments, the present disclosure relates to an image sensor. The image sensor comprises a substrate. A photodetector is in the substrate and includes a semiconductor guard ring extending into a first side of the substrate. A shallow trench isolation (STI) structure extends into the first side of the substrate. An outer isolation structure extends into a second side of the substrate, opposite the first side of the substrate, to the STI structure. The STI structure and the outer isolation structure laterally surround the photodetector. An inner isolation structure extends into the second side of the substrate and overlies the photodetector. The inner isolation structure is vertically separated from the photodetector by the substrate. Further, the outer isolation structure laterally surrounds the inner isolation structure.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. The method comprises forming a plurality of semiconductor devices over a central region of a semiconductor wafer. The semiconductor wafer comprises a peripheral region laterally surrounding the central region and a circumferential edge disposed within the peripheral region. The semiconductor wafer comprises a notch disposed along the circumferential edge. Forming a stack of inter-level dielectric (ILD) layers over the semiconductor devices and laterally within the central region. Forming a bonding support structure over the peripheral region such that the bonding support structure comprises a bonding structure notch disposed along a circumferential edge of the bonding support structure. Forming the bonding support structure includes disposing the semiconductor wafer over a lower plasma exclusion zone (PEZ) ring that comprises a PEZ ring notch disposed along a circumferential edge of the lower PEZ ring.

Abstract: A device and method for fabricating the same is disclosed. For example, the device includes a sensor having a front side and a back side, a metal interconnect layer formed on the front side of the sensor, an anti-reflective coating formed on the back side of the sensor, a composite etch stop mask layer formed on the anti-reflective coating wherein the composite etch stop mask layer includes a hydrogen rich layer and a compressive high density layer, and a light filter formed on the composite etch stop mask layer.

Abstract: A bonded assembly of a first wafer including a first semiconductor substrate and a second wafer including a second semiconductor substrate may be formed. The second semiconductor substrate may be thinned to a first thickness, and an inter-wafer moat trench may be formed at a periphery of the bonded assembly. A protective material layer may be formed in the inter-wafer moat trench and over the backside surface of the second semiconductor substrate. A peripheral portion of the second semiconductor substrate located outside the inter-wafer moat trench may be removed, and a cylindrical portion of the protective material layer laterally surrounds a remaining portion of the bonded assembly. The second semiconductor substrate may be thinned to a second thickness by performing at least one thinning process while the cylindrical portion of the protective material layer protects the remaining portion of the bonded assembly.

Abstract: A backlight module including a substrate, light-emitting elements, an optical element, first microstructures, and second microstructures is provided. The light-emitting elements are disposed on the substrate. The light-emitting elements are located between the optical element and the substrate. The first microstructures are located between the optical element and the light-emitting elements and respectively shield the light-emitting elements. The optical element is located between the second microstructures and the first microstructures. An area of each of the first microstructures is greater than an area of each of the second microstructures. Moreover, a display apparatus including the backlight module is also provided.

Abstract: A method of making a semiconductor arrangement includes forming a first layer of molecular ions in a first wafer interface region of a first wafer, forming a second layer of molecular ions in a second wafer interface region of a second wafer, forming a first molecular bond connecting the first wafer interface region to the second wafer interface region by applying pressure to at least one of the first wafer or the second wafer in a direction toward the first wafer interface region and the second wafer interface region, and annealing the first wafer and the second wafer to form a second molecular bond connecting the first wafer interface region to the second wafer interface region.

Abstract: A pressure gauge contains: a body and a casing. The body includes a scale disc fixed on a top thereof. The casing is transparent and includes a close segment formed on a first end of the casing, an open segment formed on a second end of the casing, and multiple hooks spaced and arranged on an outer wall of the casing proximate to the opening segment.

Abstract: A backlight module includes a back plate, an optical element set, a wavelength conversion film, a light source, and an ink layer. The optical element set is disposed on the back plate and has a first surface, a second surface and at least one end surface. The first surface faces the back plate and is opposite to the second surface. The at least one end surface is connected to the first surface and the second surface. The wavelength conversion film is disposed on the back plate. The light source is adapted to provide light, and the light is transmitted to the wavelength conversion film and the optical element set. The ink layer is disposed on the at least one end surface of the optical element set. A display device is further provided. The backlight module and the display device may reduce the phenomenon of blue edge caused by light leakage.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes: a semiconductor substrate having a front surface and a back surface facing opposite to the front surface; a filling material extending from the front surface into the semiconductor substrate without penetrating through the semiconductor substrate, the filling material including an upper portion and a lower portion, the upper portion being in contact with the semiconductor substrate; and an epitaxial layer lined between the lower portion of the filling material and the semiconductor substrate. An associated manufacturing method is also disclosed.

Abstract: A pressure gauge includes a hollow tube, a drive element, an anti-leak spring, a resilient element, and a cap. The hollow tube includes an accommodation chamber, a connector having a conduit, and a display unit. The drive element includes a protection unit, a first open segment, a second distal segment, a receiving portion, a hollow extension, and a protrusion. An anti-leak spring is received in the hollow extension of the drive element and abuts against the protrusion and the protection unit. The resilient element is received in the receiving portion. The cap includes a seat, a push bolt, and multiple passages. The accommodation chamber has a first fixing section and a second fixing section, a diameter of which is different from that of the first fixing section. The hollow tube further includes a tilted surround section and at least one discharge orifice.

Abstract: An anti-spray joint structure of a connection hose of a vehicle air compressor, the vehicle air compressor contains: a box, a sealant supply can, and a connection hose. The box includes a body accommodated in the box and started by a power supply to produce compressed airs. The sealant supply can includes an open segment for accommodating chemical sealant, and the sealant supply can includes a supply tube arranged on the open segment. The connection hose includes a front connector and a rear connector. The rear connector is an anti-spray joint structure and includes a first segment and a second segment removed from and connected with the first segment, and the first segment is connected with the second segment which has a channel of different sizes and shapes so as to be applicable for different tires and to avoid eruption of the chemical sealant.

Abstract: A device and method for fabricating the same is disclosed. For example, the device includes a sensor having a front side and a back side, a metal interconnect layer formed on the front side of the sensor, an anti-reflective coating formed on the back side of the sensor, a composite etch stop mask layer formed on the anti-reflective coating wherein the composite etch stop mask layer includes a hydrogen rich layer and a compressive high density layer, and a light filter formed on the composite etch stop mask layer.

Abstract: A method includes performing an anisotropic etching on a semiconductor substrate to form a trench. The trench has vertical sidewalls and a rounded bottom connected to the vertical sidewalls. A damage removal step is performed to remove a surface layer of the semiconductor substrate, with the surface layer exposed to the trench. The rounded bottom of the trench is etched to form a slant straight bottom surface. The trench is filled to form a trench isolation region in the trench.

Abstract: A cigarette lighter plug of an automobile tire repairing device, the tire repairing device contains: a box for receiving an air pump. The cigarette lighter plug is inserted into a power supply. The cigarette lighter plug includes a first housing, a second housing, and a power cord. The power cord includes a positive-electrode power part and a negative-electrode power part, the second housing includes a post, a first accommodation chamber, a column, a second accommodation chamber, a semi-arch flexible element. The second housing further includes a wing, a third accommodation chamber defined between the wing and the column, and a fourth accommodation chamber defined between a conductive foot of the semi-arch flexible element and the column so as to receive the power cord. The first housing is engaged with the second housing, and the power cord is not winded or is bent in an S shape.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a first substrate having an upper surface and a recessed surface extending in a closed loop around the upper surface. The recessed surface is vertically between the upper surface and a lower surface of the first substrate opposing the upper surface. A first plurality of interconnects are disposed within a first dielectric structure on the upper surface. A dielectric protection layer is over the recessed surface, along a sidewall of the first dielectric structure, and along a sidewall of the first substrate. The first substrate extends from directly below the dielectric protection layer to laterally outside of the dielectric protection layer.

Abstract: An anti-jet joint structure of a connection hose of a vehicle air compressor contains: an accommodation box, an adhesive supply can, and a connection hose. The accommodation box accommodates the vehicle air compressor started by a power to produce air. The adhesive supply can accommodates chemical adhesive for repairing a tire, and the adhesive supply can includes an open segment and a supply hose. The connection hose includes a first joint and a second joint opposite to the first joint. The first joint is engaged with the supply hose, and the second joint is screwed with a gas nozzle of the tire. The second joint is the anti-jet joint structure and has a first connection assembly and a second assembly. The first connection assembly is connected with or is removed from the second connection assembly having different interior structures and volumes so as to mate with various tires.

Abstract: An air inflator device contains: an accommodation box and an air compressor. The accommodation box includes a cap and a case, and the air compressor and an air guiding mechanism are received in the cap and the case. The air guiding mechanism is configured to frame a cooling fan which is rotatably with a motor of the air compressor. A flowing orifice is defined by the first directing portion and the second directing portion, and a first semicircular cover and a second semicircular cover of the air guiding mechanism are configured to collect and guide airs so that the cooling fan rotates to guide the airs to the air compressor quickly, thus dissipating heat and prolonging a service life of the air compressor.

Abstract: An air pipe device of an air compressor contains a connector of an air pipe configured to output fluid pressure so as to inflate airs and to feed sealant when the air compressor operates. The air pipe device contains a connection pipe, and the connection pipe includes an open segment defined on a first end thereof and configured to connect with the connector of the air pipe of the air compressor. In addition, the connection pipe includes a stop segment formed on a second end thereof, such that the connection pipe is configured to connect a twin tire with the connector of the air compressor so as to inflate airs and feed sealant.

Abstract: A method includes performing an anisotropic etching on a semiconductor substrate to form a trench. The trench has vertical sidewalls and a rounded bottom connected to the vertical sidewalls. A damage removal step is performed to remove a surface layer of the semiconductor substrate, with the surface layer exposed to the trench. The rounded bottom of the trench is etched to form a slant straight bottom surface. The trench is filled to form a trench isolation region in the trench.

Abstract: A positioning structure of a motor of an air compressor contains: a base, a cylinder, the motor, and a transmission mechanism. The base includes a first locating orifice and a second locating orifice. The cylinder includes an air storage seat. A small-diameter gear is fitted on the motor via the first locating orifice. A bearing housing of the motor is accommodated in the first locating orifice. The transmission mechanism actuates a piston to move in the cylinder reciprocately. The base includes two symmetrical elongated plates having two hooks respectively and includes two symmetrical arcuate retainers. An outer wall of the motor is retained by the two symmetrical arcuate retainers, and the two hooks are engaged with the magnetic coil.