Abstract: A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and the second surface for blocking water from passing therethrough in a thicknesswise direction of the insulation matrix.

Abstract: In one embodiment, a holder for holding printed circuit boards includes a base plate with a plurality of holding unit formed thereon. Each of the holding units includes a spring member, a securing member, and a blocking structure. The spring member includes a first end and a second end. The first end is attached to the base plate. The securing member is slideably mounted on the base plate. The securing member includes a connecting end and a securing end. The connecting end is connected with the second end of the spring member. The blocking structure is located on the base plate. The spring member is configured for pressing the securing member to move toward the blocking structure such that a printed circuit board is retainable between the securing end of the securing member and the blocking structure on the base plate. The holder is capable of holding printed circuit boards in batches.

Abstract: A method for forming stacked via-holes on a printed circuit board includes the steps of: providing a printed circuit board having a conductive trace formed on a side surface thereof; forming a first copper-clad laminate on the side surface having the conductive trace; forming a number of first copper micro-via in a copper layer of the first copper-clad laminate; forming a second copper-clad laminate on the surface of the copper layer having the first copper micro-via of the first copper-clad laminate; forming a number of second copper micro-via in a copper layer of the second copper-clad laminate by a first laser on the basis of the first copper micro-via, each second copper micro-via being located corresponding to its correspondingly first copper micro-via; and removing corresponding resin layer portions of the first and second copper-clad laminates, using a second laser, to yield the respective stacked via-holes.

Abstract: A method for manufacturing a hollowed printed circuit board includes steps of: providing an electrically conductive layer; laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer; forming a protecting layer on the first surface of the electrically conductive layer in the first opening; creating an electrically conductive pattern in the conductive layer; removing the protecting layer; and laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, thereby a portion of the electrically conductive layer is exposed to exterior through the first through opening and the second through opening.

Abstract: A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.

Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. An exemplary method for manufacturing multilayer printed circuit boards using the inner substrate is also provided. The method can improve efficiency of manufacturing multilayer printed circuit boards.

Abstract: The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.

Abstract: An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.

Abstract: The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.

Abstract: An exemplary method for manufacturing a printed circuit board is provided. In the method, firstly, a circuit substrate having a substrate and a number of soldering pads is provided. Secondly, a protective layer is formed onto the circuit substrate in a manner such that the soldering pads are entirely covered by the protective layer. Fourthly, a laser beam is applied onto portions of the protective layer spatially corresponding to the soldering pads in a manner such that the portions of the protective layer is removed, thereby exposing the soldering pads to an exterior. A printed circuit board having a protective layer with high precision of resolution is also provided.

Abstract: An exemplary method for forming stacked via-holes in a multilayer printed circuit board includes the steps of: providing a base circuit board; attaching a first copper-coated-substrate having a first substrate and a first copper layer thereon and a second copper-coated-substrate having a second substrate and a second copper layer thereon onto the base circuit board in a manner such that; forming at least one first window in the second copper layer, making at least one first hole in the second substrate through the at least one first window, forming at least one second window in the first copper layer through the at least one first hole, and making at least one second hole in the first substrate through the at least one second window, thus forming at least one part-finished stacked via-hole; and plating the at least one part-finished stacked via-hole thereby forming at least one stacked via-hole.

Abstract: A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating the first copper clad laminate, the binder layer and the second copper clad laminate; defining a via hole for establishing electric connection between the first copper clad laminate and the second copper clad laminate; cutting the first copper clad laminate, the binder layer and the second copper clad laminate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract: The present inventions relates to a method for manufacturing a multilayer FPCB. The method includes the steps of providing three copper clad laminates and two binder layers, each of the copper clad laminates includes a dielectric layer and at least one patterned conductive layer formed on the dielectric layer; stacking the copper clad laminates and the binder layers alternately one on another; aligning the copper clad laminates and the binder layers; and compressing the copper clad laminates and the binder layers together thereby obtaining a multilayer flexible printed circuit board.

Abstract: The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which having a first copper clad laminate structure and a second copper clad laminate structure disposed on two opposite sides of the binder layer respectively using the binder layer; cutting the first copper clad laminate structure; cutting the multilayer FPCB in manner that a portion of first copper clad laminate structure that is exposed to the opening is separated from the first copper clad structure thereby obtain a multilayer FPCB having different number of layers in different areas.

Abstract: An exemplary surface mounted electronic component has block body including a bottom soldering surface, a top surface and a peripheral wall having a first peripheral wall portion and a second peripheral wall portion. The bottom soldering surface defines a first soldering area and a second soldering area. The first peripheral wall portion adjoins the first soldering area and has at least a first cutout defined between the first peripheral wall portion and the first soldering area. The second peripheral wall portion adjoins the second soldering area and has at least a second cutout defined between the second peripheral wall portion and the second soldering area. When the surface mounted electronic component is soldered, the melting solder can climb up the cutouts of the sidewall due to capillary effect and ‘chimney effect’, thereby avoiding ‘tombstoning’.

Abstract: An exemplary surface mounted electronic component has block body including a bottom soldering surface, a top surface and a peripheral wall having a first peripheral wall portion and a second peripheral wall portion. The bottom soldering surface defines a first soldering area and a second soldering area. The first peripheral wall portion adjoins the first soldering area and has at least a first cutout defined between the first peripheral wall portion and the first soldering area. The second peripheral wall portion adjoins the second soldering area and has at least a second cutout defined between the second peripheral wall portion and the second soldering area. When the surface mounted electronic component is soldered, the melting solder can climb up the cutouts of the sidewall due to capillary effect and ‘chimney effect’, thereby avoiding ‘tombstoning’.

Abstract: The present invention relates to an apparatus for spraying an etchant and a method for manufacturing a printed circuit board. In one exemplary embodiment the apparatus includes a manifold, a plurality of feed pipes in fluid communication with the manifold, each of the feed pipes having a plurality of spray nozzles mounted thereon, the feed pipes cooperatively constitute a spray region, and a pressure-boosting device configured for increasing a spray pressure of the spray nozzles which are located at a central area of the spray region. The apparatus can overcome “the puddle effect” on an upper surface of the printed circuit board.

Abstract: An apparatus (100) for spraying an etchant solution on a preformed printed circuit board (30) includes a number of feed pipes (40) for supplying the etchant solution and a number of nozzles (45) mounted on the feed pipes. Each of the feed pipes has a middle portion (402) and two end portions (401). The middle portions of the feed pipes are located on a first plane and the end portions of the feed pipes are located on a second plane parallel to the first plane. The number of nozzles are mounted on the middle portion and the two end portions of each feed pipe. The number of nozzles are in fluid communication with the feed pipes.

Abstract: A method for forming stacked via-holes on a printed circuit board includes the steps of: providing a printed circuit board having a conductive trace formed on a side surface thereof; forming a first copper-clad laminate on the side surface having the conductive trace; forming a number of first copper micro-via in a copper layer of the first copper-clad laminate; forming a second copper-clad laminate on the surface of the copper layer having the first copper micro-via of the first copper-clad laminate; forming a number of second copper micro-via in a copper layer of the second copper-clad laminate by a first laser on the basis of the first copper micro-via, each second copper micro-via being located corresponding to its correspondingly first copper micro-via; and removing corresponding resin layer portions of the first and second copper-clad laminates, using a second laser, to yield the respective stacked via-holes.

Abstract: An exemplary method for forming stacked via-holes in a multilayer printed circuit board includes the steps of: providing a base circuit board; attaching a first copper-coated-substrate having a first substrate and a first copper layer thereon and a second copper-coated-substrate having a second substrate and a second copper layer thereon onto the base circuit board in a manner such that; forming at least one first window in the second copper layer, making at least one first hole in the second substrate through the at least one first window, forming at least one second window in the first copper layer through the at least one first hole, and making at least one second hole in the first substrate though the at least one second window, thus forming at least one part-finished stacked via-hole; and plating the at least one part-finished stacked via-hole thereby forming at least one stacked via-hole.