Abstract: An I/O circuit placement method. In the I/O circuit placement method, at least two rows of I/O circuits are placed on a first side of the chip, and each I/O circuit has a head section and a tail section. The placement direction of the head section and the tail section is perpendicular to the placement direction of the I/O circuits in the rows. The semiconductor further has a core circuit disposed on the chip, wherein the rows of I/O circuits are disposed outside the core circuit and are at the periphery of the chip. Due to the I/O circuit placement in the semiconductor device, the present invention reduces the area of the semiconductor chip and fabrication cost.

Abstract: A method for forming an electric device having power switches around a logic circuit including: forming a logic circuit on a substrate; forming a plurality of power switches around the logic circuit; and coupling first ends of the power switches to a voltage end, and coupling second ends of the power switches to a power receiver of the logic circuit.

Abstract: A memory test system for peak power reduction. The memory test system includes a plurality of memories, a plurality of memory built-in self-test circuits and a plurality of delay units. Each of the memory built-in self-test circuits comprises a built-in self-test controller for receiving a clock signal and producing a plurality of required control signals to test one of the memories. Each of the delay units is coupled between two adjacent built-in self-test controllers. The clock signal input to one of the built-in self-test controllers is received by the delay unit to produce a delayed clock signal, and the delay unit outputs the delayed clock signal to the other.

Abstract: An I/O circuit placement method. In the I/O circuit placement method, at least two rows of I/O circuits are placed on a first side of the chip, and each I/O circuit has a head section and a tail section. The placement direction of the head section and the tail section is perpendicular to the placement direction of the I/O circuits in the rows. The semiconductor further has a core circuit disposed on the chip, wherein the rows of I/O circuits are disposed outside the core circuit and are at the periphery of the chip. Due to the I/O circuit placement in the semiconductor device, the present invention reduces the area of the semiconductor chip and fabrication cost.

Abstract: A mux scan cell includes a multiplexer having a first input node for receiving raw data, a second input node for receiving test data, an output node, a selection node, and a delay circuit electrically connected between the second input node and the output node for prolonging a traveling time which the test data takes to travel from the second input node to the output node. The mux scan cell also includes a flip-flop connected to the multiplexer. With the delay circuit, the traveling time of the test data is prolonged such that the traveling time which the test data takes to travel from the second input node to the output node simulates a sum of a traveling time in which the raw data travels through a combinational logic and a traveling time in which the raw data travels from the first input node to the output node.

Abstract: A coaxial electrical connector includes a tubular body, first, second and third insulator members, a contact piece, and a central conductor unit. The tubular body defines a through hole, and is formed with a radial hole. The first and second insulator members are mounted in the through hole and are spaced apart from each other. The third insulator member is mounted in the radial hole. The contact piece extends into the third insulator member. The central conductor unit is supported in the through hole by the first and second insulator members, and includes a first conductor component coupled telescopically to a second conductor component. The first conductor component is movable to make or break contact with the contact piece.

Abstract: A coaxial electrical connector includes a tubular body, first, second and third insulator members, a contact piece, and a central conductor unit. The tubular body defines a through hole, and is formed with a radial hole. The first and second insulator members are mounted in the through hole and are spaced apart from each other. The third insulator member is mounted in the radial hole. The contact piece extends into the third insulator member. The central conductor unit is supported in the through hole by the first and second insulator members, and includes a first conductor component coupled telescopically to a second conductor component. The first conductor component is movable to make or break contact with the contact piece.

Abstract: A memory test system for peak power reduction. The memory test system includes a plurality of memories, a plurality of memory built-in self-test circuits and a plurality of delay units. Each of the memory built-in self-test circuits comprises a built-in self-test controller for receiving a clock signal and producing a plurality of required control signals to test one of the memories. Each of the delay units is coupled between two adjacent built-in self-test controllers. The clock signal input to one of the built-in self-test controllers is received by the delay unit to produce a delayed clock signal, and the delay unit outputs the delayed clock signal to the other.

Abstract: A mux scan cell includes a multiplexer having a first input node for receiving raw data, a second input node for receiving test data, an output node, a selection node, and a delay circuit electrically connected between the second input node and the output node for prolonging a traveling time which the test data takes to travel from the second input node to the output node. The mux scan cell also includes a flip-flop connected to the multiplexer. With the delay circuit, the traveling time of the test data is prolonged such that the traveling time which the test data takes to travel from the second input node to the output node simulates a sum of a traveling time in which the raw data travels through a combinational logic and a traveling time in which the raw data travels from the first input node to the output node.

Abstract: A method for preventing redundant events from toggling the core logic during scan data shifting mode is provided. A logic element is controlled by SEL. During scan data shifting mode, no toggled data will interfere with the core logic because the logic element is shut off. Only the scan path (SI-SO-SI) continues toggling. Therefore, redundant events are prevented from toggling the core logic. Therefore the simulation time is reduced and the verification flow is sped up. Additionally, the power consumption during testing is significantly reduced.