Abstract: A medical implant is disclosed. The medical implant includes a body having a first end having a first cross-sectional dimension, a second end having a second cross-sectional dimension, and a tapered portion extending between the first end and the second end. The first cross-sectional dimension is larger than the second cross-sectional dimension. In some embodiments, the body comprises multiple layers.

Abstract: A touch substrate, a display apparatus and a display system are provided. By rearranging and distributing transistors in each shift register, the number of transistors in a lateral direction is less than that of transistors in a longitudinal direction. That is a circuit structure of the shift register is designed to extend longitudinally, so that a size of the shift register in the lateral direction can be reduced, a narrow frame design is realized, and seamless splicing is favorably realized in a large-sized display panel.

Abstract: A method for multi-beam laser scribing of a thin-film solar cell is provided. A laser beam output by a laser is split by an optical path unit or a splitter assembly into multiple sub-beams. The multiple sub-beams are focused by a laser-focusing scribing head assembly to form a laser focus on the thin-film solar cell. The thin-film solar cell is fixed on a bearing platform or clamped by a clamping mechanism, and driven by a drive module to reciprocate in a direction perpendicular to an output direction of the laser-focusing scribing head assembly to create a first scribe line. A position of the laser-focusing scribing head assembly is switched, and the thin-film solar cell is driven to reciprocate again to create a second scribe line. The fume and dust generated during the scribing process are removed through a fume-fume-dust extraction port corresponding to the scribing head assembly.

Abstract: A semiconductor substrate processing method includes: providing a substrate to be processed, where the substrate to be processed has a side to be processed and a bonding side which are opposite to each other; providing a hole supply substrate; and bonding the hole supply substrate to the bonding side of the substrate to be processed by a wafer bonding process so as to obtain a substrate pair, and performing a material process. By the semiconductor substrate processing method, the purpose of rapid electrochemical etching can be achieved.

Abstract: This application discloses a path recovery method and apparatus. The method includes: When an anomaly occurs on a transmission path of a signal, a target adaptive equalization coefficient corresponding to an anomaly type of the transmission path is determined from a plurality of candidate adaptive equalization coefficients that enable an adaptive equalization operation to converge. Then, the adaptive equalization operation is performed on the signal based on the target adaptive equalization coefficient to obtain an adaptive equalized signal. Finally, the transmission path is recovered based on the adaptive equalized signal.

Abstract: A multi-laser beam focusing and scribing device with following function includes a beam splitter module, a focusing lens module, a first shaft, a diffractive optical element (DOE) beam shaping lens, a second adjustment shaft, a coaxial charge-coupled device (CCD) vision module, and a distance-measuring sensor. The first adjustment shaft is configured to adjust a focus position, and the second adjustment shaft is configured to adjust a spacing between scribed lines, and is electrically-powered. The beam splitter module is configured to split an incident laser beam into a plurality of sub-beams.

Abstract: A laser scribing method for perovskite thin-film solar cells is provided, in which a linearly polarized Gaussian beam is emitted by a laser, and converted into a circularly polarized beam through a quarter-wave plate. The circularly polarized beam is expanded to a target diameter by a beam expander system to obtain a target expanded beam. The target expanded beam is adjusted by an optical path adjustment system to enter a diffractive optical element (DOE) shaping module for beam shaping to obtain a shaped beam. The shaped beam is focused by an optical focusing module to obtain a focused beam with the focus on a surface film of a to-be-processed product, and the to-be-processed product is moved such that a groove is scribed thereon. A laser scribing device is also provided.

Abstract: A method and apparatus for renaming a file system object and a storage medium are provided. The method includes: determining a renaming type for a file system object according to a received renaming request; determining, according to the renaming type, data processing operations respectively corresponding to multiple servers, wherein the multiple servers include a first server storing structure information of a directory, a second server storing attribute information and structure information of a file and attribute information of the directory, and a third server storing content data of the file; and executing, through the multiple servers, the data processing operations respectively corresponding to the multiple servers to rename the file system object.

Abstract: The present invention relates to a yeast gene ScFIT3 for regulating and controlling cadmium resistance of an organism and an application thereof. The yeast gene ScFIT3 for regulating and controlling the cadmium resistance of the organism has a nucleotide sequence as shown in SEQ ID NO.1. The present invention discloses, for the first time, the application of the yeast gene ScFIT3 in enhancing cadmium resistance of the organism. The yeast gene ScFIT3 is linked to an expression vector and transformed into a budding yeast, thereby completing construction of a cadmium-resistant yeast. The growth of the budding yeast transformed with the yeast gene ScFIT3 is significantly superior to that of a wild-type budding yeast, indicating that the budding yeast transformed with the yeast gene ScFIT3 has good resistance to cadmium stress, significantly enhances a capability of resisting heavy metal cadmium, and reduces accumulation and absorption of cadmium.

Abstract: A medical implant is disclosed. The medical implant includes a body having a first end having a first cross-sectional dimension, a second end having a second cross-sectional dimension, and a tapered portion extending between the first end and the second end. The first cross-sectional dimension is larger than the second cross-sectional dimension. In some embodiments, the body comprises multiple layers.

Abstract: An electrical connector includes a conductive housing, a first terminal module and a first ground sheet. The conductive housing defines a receiving slot configured to at least partially receive a mating module along a first direction. The first terminal module includes a first conductive terminal. The first conductive terminal includes a first contact arm. The first contact arm includes a first contact portion protruding into the receiving slot. The first conductive terminal is not in contact with the conductive housing. The first ground sheet includes a first grounding elastic arm. The first grounding elastic arm includes a first intermediate portion, a first elastic arm portion and a second elastic arm portion. At least one of the first intermediate portion, the first elastic arm portion and the second elastic arm portion is configured to be in electrical contact with the mating module.

Abstract: Systems and methods described herein may enable user equipment to confirm and/or change a multiple input, multiple output (MIMO) communication configuration selected by a network, such as to change a number of data layers used in the MIMO communication and/or to change one or more antennas used in the MIMO communication. The user equipment may confirm and/or change the MIMO communication configuration based on transmit power levels associated with the one or more antennas, a distance between power amplifiers and respective antennas, or the like, as described herein.

Abstract: An electrical connector includes a conductive housing and a first terminal module. The conductive housing is an integrally formed component. The conductive housing includes a receiving slot for receiving a mating module and a first terminal module installation slot communicating with the receiving slot. The first terminal module is received in the first terminal module installation slot. The first terminal module includes a number of first conductive terminals. Each first conductive terminal includes a first fixing portion and a first contact arm connected to the first fixing portion. The first fixing portion is at least partially located in the first terminal module installation slot. The first conductive terminal is not in contact with the conductive housing. By using the conductive housing to replace an insulating housing in the related art, the shielding effect and the quality of signal transmission are improved.

Abstract: An electrical connector includes a housing, a number of first conductive terminals, a number of second conductive terminals and a mounting block. Each first conductive terminal includes a first fixing portion and a second fixing portion. Each second conductive terminal includes a third fixing portion and a fourth fixing portion. The mounting block is mounted to the housing. The mounting block includes a base and a convex block protruding from the base. The base includes a number of first receiving grooves and a number of second receiving grooves. The second fixing portion is at least partially located in a corresponding first receiving groove. The fourth fixing portion is at least partially located in a corresponding second receiving groove. The convex block is located between the second fixing portion and the fourth fixing portion.

Abstract: A display substrate includes: a base substrate; and a driving structure layer on a side of the base substrate. The display substrate includes a display region and a non-display region. The driving structure layer includes: an electrode layer including at least one first electrode and at least one second electrode adjacent to each other in the non-display region, wherein a potential of the first electrode is lower than that of the second electrode; and a conductor layer, where the conductor layer and the electrode layer are in different layers. The conductor layer includes a first conductor portion electrically connected to the first electrode and a second conductor portion electrically connected to the second electrode. An area of an orthographic projection of the first conductor portion on the base substrate is greater than that of the second conductor portion on the base substrate.

Abstract: An electrical connector includes a housing, a first terminal module and a first ground sheet. The housing includes a receiving slot. The first terminal module includes two first conductive terminals which are a first signal terminal and a second signal terminal, respectively. Each first conductive terminal includes a first contact arm. The first ground sheet includes a first grounding elastic arm. The first grounding elastic arm is located on one side of the first contact arm of the first signal terminal and the first contact arm of the second signal terminal along a second direction. The first grounding elastic arm at least partially protrudes into the receiving slot. One end of the first grounding elastic arm is fixed; and the other end of the first grounding elastic arm moves along a first direction after a mating module is inserted into the receiving slot.

Abstract: A circuit board includes a first signal conductive area, a second signal conductive area, a first ground conductive area and a second ground conductive area. The first signal conductive area and the second signal conductive area both extend along a first direction. The first ground conductive area and the second ground conductive area are located on two sides of the first signal conductive area and the second signal conductive area, respectively, thereby improving shielding effect. A connector assembly including the circuit board is also disclosed.

Abstract: An electrical connector includes a conductive housing, a first terminal module and a first ground sheet. The conductive housing defines a receiving slot. The conductive housing includes a first conductive housing. The first terminal module includes a number of first conductive terminals. The first conductive terminal includes a first fixing portion and a first contact portion. The first contact portion protrudes into the receiving slot. The first conductive terminal is not in contact with the first conductive housing. The first ground sheet includes a first mounting plate and a second mounting plate. The first mounting plate is fixed to the first conductive housing. The second mounting plate is provided with a first grounding elastic arm protruding into the receiving slot.

Abstract: An electrical connector includes a housing, a number of first conductive terminals, a first ground terminal and a first pressing plate. The housing includes a receiving slot for receiving a mating module and a wall portion located on at least one side of the receiving slot. The wall portion defines a first terminal installation slot communicating with the receiving slot. The first ground terminal includes a first mating portion protruding into the receiving slot and an elastic portion located in the first terminal installation slot. The elastic portion is deformable when the mating module contacts the first mating portion. The first pressing plate is fixed on the wall portion to limit the elastic portion.

Abstract: An electrical connector includes a first conductive housing, a second conductive housing, a first terminal module and a second terminal module. The first conductive housing and the second conductive housing are made separately and fixed together to jointly form a receiving slot. The first terminal module is at least partially disposed in the first conductive housing. The first terminal module includes a number of first conductive terminals which are not in contact with the first conductive housing. The second terminal module is at least partially disposed in the second conductive housing. The second terminal module includes a number of second conductive terminals which are not in contact with the second conductive housing. By using the conductive housing to replace an insulating housing in the related art, the shielding effect and the quality of signal transmission are improved.