Patents by Inventor Cheng LING

Cheng LING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11682684
    Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Ling Huang, Lu-Ming Lai, Ying-Chung Chen
  • Patent number: 11652151
    Abstract: The present disclosure provides a semiconductor device structure with a conductive contact and a method for preparing the semiconductor device structure. The semiconductor device structure includes a dielectric layer disposed over a semiconductor substrate; a conductive contact penetrating through the dielectric layer; and a metal oxide layer separating the conductive contact from the dielectric layer, wherein the conductive contact and the metal oxide layer comprise a same metal.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: May 16, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Cheng-Ling Yang
  • Publication number: 20230034084
    Abstract: The present disclosure provides a semiconductor device structure with a conductive contact and a method for preparing the semiconductor device structure. The semiconductor device structure includes a dielectric layer disposed over a semiconductor substrate; a conductive contact penetrating through the dielectric layer; and a metal oxide layer separating the conductive contact from the dielectric layer, wherein the conductive contact and the metal oxide layer comprise a same metal.
    Type: Application
    Filed: July 28, 2021
    Publication date: February 2, 2023
    Inventor: CHENG-LING YANG
  • Patent number: 11551963
    Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: January 10, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei Ling Ma, Ying-Chung Chen, Hsin-Ying Ho, Cheng-Ling Huang, Chang Chin Tsai
  • Patent number: 11521978
    Abstract: The present application discloses a semiconductor device with a programmable unit and a method for fabricating the semiconductor device. The semiconductor device includes a substrate comprising a first region and a second region; a first semiconductor element positioned in the first region of the substrate; a second semiconductor element positioned in the first region of the substrate and electrically coupled to the first semiconductor element; and a programmable unit positioned in the second region and electrically connected to the first semiconductor element.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: December 6, 2022
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Cheng-Ling Yang
  • Publication number: 20220254895
    Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a fin, a gate structure positioned on the fin, impurity regions positioned on two sides of the fin, contacts positioned on the impurity regions, and conductive covering layers positioned on the contacts. The conductive covering layers are formed of copper germanide.
    Type: Application
    Filed: February 10, 2021
    Publication date: August 11, 2022
    Inventor: CHENG-LING YANG
  • Publication number: 20220245213
    Abstract: This application provides a content recommendation method and apparatus, an electronic device, and a storage medium.
    Type: Application
    Filed: April 21, 2022
    Publication date: August 4, 2022
    Inventors: Cheng LING, Yalong WANG, Rui WANG, Ruobing XIE, Feng XIA, Leyu LIN
  • Publication number: 20220115425
    Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 14, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Ling HUANG, Lu-Ming LAI, Ying-Chung CHEN
  • Patent number: 11296651
    Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: April 5, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Hui-Chung Liu, Kuo-Hua Lai, Cheng-Ling Huang
  • Patent number: 11189622
    Abstract: The present disclosure provides a semiconductor device with a graphene layer and a method for forming the same. The semiconductor device includes a first source/drain region and a second source/drain region disposed in a semiconductor substrate. The semiconductor device also includes a word line structure disposed in the semiconductor substrate and between the first source/drain region and the second source/drain region. The word line structure includes a gate dielectric layer, and a lower electrode layer disposed over the gate dielectric layer. The word line structure also includes an upper electrode layer disposed over the lower electrode layer, and a first graphene layer disposed between the lower electrode layer and the upper electrode layer.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: November 30, 2021
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Cheng-Ling Yang
  • Publication number: 20210327887
    Abstract: The present application discloses a semiconductor device with a programmable unit and a method for fabricating the semiconductor device. The semiconductor device includes a substrate comprising a first region and a second region; a first semiconductor element positioned in the first region of the substrate; a second semiconductor element positioned in the first region of the substrate and electrically coupled to the first semiconductor element; and a programmable unit positioned in the second region and electrically connected to the first semiconductor element.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Inventor: CHENG-LING YANG
  • Patent number: 11114536
    Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate including an array area and a peripheral area adjacent to the array area, a first gate structure positioned in the array area, and a second gate structure positioned in the peripheral area. A width of the first gate structure is less than a width of the second gate structure, and a depth of the first gate structure is less than a depth of the second gate structure.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: September 7, 2021
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Cheng-Ling Yang
  • Patent number: 11114448
    Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate having a first region and a second region, a first semiconductor element positioned in the first region of the substrate, a second semiconductor element positioned in the first region of the substrate, a bridge conductive unit electrically connected the first semiconductor element and the second semiconductor element, and a programmable unit positioned in the second region and electrically connected to the bridge conductive unit.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: September 7, 2021
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Cheng-Ling Yang
  • Publication number: 20210265475
    Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate including an array area and a peripheral area adjacent to the array area, a first gate structure positioned in the array area, and a second gate structure positioned in the peripheral area. A width of the first gate structure is less than a width of the second gate structure, and a depth of the first gate structure is less than a depth of the second gate structure.
    Type: Application
    Filed: February 26, 2020
    Publication date: August 26, 2021
    Inventor: Cheng-Ling YANG
  • Publication number: 20210257246
    Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 19, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei Ling MA, Ying-Chung CHEN, Hsin-Ying HO, Cheng-Ling HUANG, Chang Chin TSAI
  • Publication number: 20210181393
    Abstract: An optical film includes at least one light-absorbing film layer and at least one anti-reflection film layer formed on the at least one light-absorbing film layer. A material of the at least one light-absorbing film layer is a mixed powder of chromium metal and SixOy. The x and the y are respectively greater than 0 and positive integers. The disclosure further relates to an optical lens and a lens module. The optical film can reduce the effect of stray light on the imaging quality.
    Type: Application
    Filed: July 22, 2020
    Publication date: June 17, 2021
    Inventors: SHUN-YI YU, WEI-CHENG LING, KENG-PEI CHANG, YONG-JUN WEI
  • Publication number: 20210036658
    Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
    Type: Application
    Filed: October 19, 2020
    Publication date: February 4, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Ching-Han HUANG, Hui-Chung LIU, Kuo-Hua LAI, Cheng-Ling HUANG
  • Patent number: 10910507
    Abstract: A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: February 2, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Ling Huang, Ying-Chung Chen
  • Publication number: 20210013217
    Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate having a first region and a second region, a first semiconductor element positioned in the first region of the substrate, a second semiconductor element positioned in the first region of the substrate, a bridge conductive unit electrically connected the first semiconductor element and the second semiconductor element, and a programmable unit positioned in the second region and electrically connected to the bridge conductive unit.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 14, 2021
    Inventor: CHENG-LING YANG
  • Patent number: 10812017
    Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: October 20, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Hui-Chung Liu, Kuo-Hua Lai, Cheng-Ling Huang