Abstract: A vapor chamber having no gas discharging protrusion includes: a lower shell member, formed with an upper surface divided into an inner zone and an outer zone and an outer peripheral wall formed with a planar surface, the inner zone is formed with capillary channels, the outer zone is formed with a recess, and one thereof is communicated with at least one of the capillary channels and the other end thereof penetrates the planar surface; and an upper shell member, engaged with the upper surface and sealed with the lower shell member, and a gas discharging hole is formed between the recess and the upper shell member. Accordingly, a conventional gas discharging protrusion is not required on the vapor chamber thereby advantages of small and thin in volume and compact in structure being provided.

Abstract: A flat heat pipe includes a tube, a sealed section, an insulation section and a heat conduction section. The tube includes a metal shell and a chamber. The sealed section is formed by rolling the metal shell and making two opposite inner walls of the tube combined closely on the tube that separate the chamber into a first chamber and a second chamber. The insulation section is a hollow chamber including the first chamber. The conduction section includes the second chamber, a capillary and working fluid. Further, the heat conduction device includes a heat dissipating shell, a heating element and a flat heat pipe. The plate heat pipe is disposed in the heat dissipating shell and thermally conducted with the heating element.

Abstract: A flat heat pipe includes a tube, a sealed section, an insulation section and a heat conduction section. The tube includes a metal shell and a chamber. The sealed section is formed by rolling the metal shell and making two opposite inner walls of the tube combined closely on the tube that separate the chamber into a first chamber and a second chamber. The insulation section is a hollow chamber including the first chamber. The conduction section includes the second chamber, a capillary and working fluid. Further, the heat conduction device includes a heat dissipating shell, a heating element and a flat heat pipe. The plate heat pipe is disposed in the heat dissipating shell and thermally conducted with the heating element.

Abstract: A lateral surrounding heat pipe is for contacting a heating element while the heating element has a working surface and a sidewall formed around the working surface. The heat pipe includes a heated section and a cooling section. The heated section has a heated surface, which is flat, for contacting and being attached to the sidewall of the heating element. The cooling section is integrally connected to the heated section and extends from the heating element towards any direction.

Abstract: A vapor chamber having no gas discharging protrusion includes: a lower shell member, formed with an upper surface divided into an inner zone and an outer zone and an outer peripheral wall formed with a planar surface, the inner zone is formed with capillary channels, the outer zone is formed with a recess, and one thereof is communicated with at least one of the capillary channels and the other end thereof penetrates the planar surface; and an upper shell member, engaged with the upper surface and sealed with the lower shell member, and a gas discharging hole is formed between the recess and the upper shell member. Accordingly, a conventional gas discharging protrusion is not required on the vapor chamber thereby advantages of small and thin in volume and compact in structure being provided.

Abstract: A thin vapor chamber includes a heat conducting plate having an upper surface, a metal cover sealed and covering on the heat conducting plate, and a wick structure disposed between the heat conducting plate and the metal cover. A plurality of hollow supports are formed on the metal cover by pressing and face the heat conducting plate. The wick structure is provided with plural throughholes. The hollow supports are individually disposed through the corresponding throughholes and attached to the upper surface. Thus, the heat of the heat conducting plate is transferred to the metal cover through the hollow supports. Besides, the metal cover is pressed to have an uneven shape to increase heat-dissipating area and structural strength, which achieves excellent heat transfer efficiency and heat diffusion of the thin vapor chamber.

Abstract: A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.

Abstract: A method of making a lightweight heat pipe includes steps of: a) preparing a first hollow pipe and a second hollow pipe making of two different materials; b) disposing the first hollow pipe into the second hollow pipe along an axial direction of the second hollow pipe; c) making an inner wall surface of the second hollow pipe attached on an outer wall surface of the first hollow pipe to combine the first and the second hollow pipes as a pipe body of the heat pipe; and d) vacuuming an inner space of the first hollow pipe, and sealing the pipe body after working fluid is filled in the inner space of the first hollow pipe to finish the heat pipe.

Abstract: A slim-type vapor chamber and a capillary structure thereof are provided, including an upper board and a lower board. The upper and lower boards respectively include a metal plate. Trenches are formed on one side surface of the metal plate. The upper board and the lower board overlap each other to make the corresponding side surfaces of the two metal plates contact each other. The trenches of the two metal plates are correspondingly disposed to form passages. The trenches of one of the metal plates are staggered from the trenches of the other metal plate by an offset distance to form staggered passages. Therefore, the capillary force during reverse flow of a working fluid is enhanced, the contact area between the vapor and the passage is increased, and the heat transfer efficiency of the vapor chamber is improved.

Abstract: Systems, methods, and instrumentalities are provided to implement scheduling for device-to-device (D2D). A WTRU (e.g., a D2D WTRU) may determine whether the WTRU has D2D data to transmit. The WTRU may determine a set of allowed SA resources and/or allowed D2D data resources for transmission of the SA. The WTRU may select an SA resource and/or D2D data resources (e.g., from the set of allowed SA resources and/or D2D data resources) for transmission. The WTRU may select one or more transmission parameters. The WTRU may select one or more transmission patterns. The WTRU may transmit D2D data over the set of allowed D2D resources using the selected transmission patterns and according to the selected transmission parameters.

Abstract: Embodiments include methods and apparatuses for the design, construction and selection of base patterns and associated control signaling for direct device-to-device (D2D) communication, independent of a network. An embodiment includes the selection and transmission, by a wireless transmit and receive unit (WTRU), of base patterns in a scheduling period when the number of medium access control (MAC) protocol data units (PDUs) is larger than the number of MAC PDUs that a family of pre-determined base patterns can support. An embodiment may include the selection and transmission, by a WTRU, of base patterns in a scheduling period when the number of MAC PDUs is smaller than the number of MAC PDUs that a family of pre-determined base patterns can support. In addition, embodiments may include the selection, by a WTRU, of a base pattern or base patterns to minimize interference with other communications and to use resources efficiently.

Abstract: A heat plate sealing method and structure thereof includes a) providing a bottom plate and a cover plate engaging with each other; b) providing a welding frame; c) disposing the welding frame between the bottom plate and the cover plate; d) placing solder on the welding frame; e) sandwiching the welding frame having the solder thereon between the bottom plate and the cover plate; and f) conducting thermal melting on the solder to seal the bottom plate and the cover plate. Therefore, a sealing structure is strengthened and the airtightness during a sealing process is enhanced.

Abstract: The heat sink includes a fastener and a heat pipe. The fastener has a receiving space, an upper claw and a lower claw. The upper claw and the lower claw are formed in the receiving space. The heat pipe has a first end and a second end. The first end is received in the receiving space and clipped between the upper claw and the second claw, and the upper claw or the lower claw is partially embedded in the heat pipe to be flush with each other.

Abstract: The present disclosure provides a method for forming a light-emitting apparatus, comprising providing a carrier having a plurality of first metal contacts; forming a light-emitting structure comprising a substrate, a first cladding layer on the substrate, an active layer on the first cladding layer, and a second cladding layer on the active layer; bonding the light-emitting structure to the carrier; forming a cap layer on a side of the light-emitting structure opposite to the carrier; and cutting the carrier and the cap layer to form a chip-scale LED unit.

Abstract: A method of accessing an on-chip read only memory (ROM) includes dividing a frequency of a system clock by a specific divisor, in order to generate a ROM clock; combining a specific number of adjacent addresses into a combined address, wherein the specific number is determined according to the specific divisor; inserting a first stall signal into a real output data, wherein a length of the first stall signal is determined in order to meet a timing requirement for accessing the on-chip ROM; generating an output data of the on-chip ROM according to the combined address, wherein a width of the output data is extended by a specific multiple which is determined according to the specific number; and generating a first delay corresponding to the length of the first stall signal in the address.

Abstract: A method for separating charged particles in a liquid sample is disclosed. The method includes the steps of driving the liquid sample containing a plurality of charged particles to flow, forming a non-uniform electric field in the direction relative to the flow direction of the liquid sample by two electrodes, and aggregating the charged particles under the non-uniform electric field so as to separating the charged particles from the liquid sample. When the liquid sample flows through the non-uniform electric field, it doesn't contact to the electrodes. A device and its manufacturing method for separating charged particles in a liquid sample are also disclosed. Accordingly, the charged particles can be separated from the liquid sample easily and more effectively.

Abstract: The present disclosure provides a method for forming a light-emitting apparatus, comprising providing a first board having a plurality of first metal contacts, providing a substrate, forming a plurality of light-emitting stacks and trenches on the substrate, wherein the light-emitting stacks are apart from each other by the plurality of the trenches, bonding the light-emitting stacks to the first board, forming an encapsulating material commonly on the plurality of the light-emitting stacks, and cutting the first board and the encapsulating material to form a plurality of chip-scale LED units.

Abstract: A flip-chip light emitting diode comprises a transparent base-plate, at least a first electrical semi-conductive layer, a light emitting layer, a second electrical semi-conductive layer, at least a first ohmic contact, a second ohmic contact and a third ohmic contact are installed above the transparent base-plate. The at least first ohmic contact is electrically connected to the third ohmic contact through a connection passage. A first electrode area is formed above the second electrical semi-conductive layer. The second ohmic contact is disposed above the transparent base-plate and adjacent to a side of the first ohmic contact. A second electrode area is formed on the second ohmic contact.

Abstract: A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicating with the vapor channel are formed in the chamber. The heat-absorption part corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and in the liquid channel of the heat-absorption part. The working fluid fills the chamber.

Abstract: A short detection circuit includes a voltage divider circuit, for generating, according to a bottom voltage of one or more light-emitting diode strings, a divided voltage less than the bottom voltage. Additionally, the short detection circuit includes a voltage clamp circuit, coupled to the voltage divider circuit, for clamping the divided voltage, and a comparator, coupled to the voltage divider circuit, for comparing the divided voltage and a reference voltage, to decide whether a short circuit occurs in the one or more light-emitting diode strings according to a result of the comparison.