Abstract: An executing system and executing method of intelligent rule base service (IRBS) is provided. The executing system uses a rule base service interface for receiving a service request content which includes a header from a rule base service module, and obtains a proper rule from the rule base according to the header when a rule component receives the service request content. Finally, a rule application component applies the received rule on a part of the service request content needed to be processed to obtain and output a processing result.

Abstract: An exemplary method for measuring a distance from a subject to a camera includes the following operations: focusing on the subject using the imaging system; illuminating an area on the subject using auxiliary light; capturing an image of the subject, the image having an illumination portion corresponding to the illuminated area; measuring the area of the illumination portion of the image; and calculating the subject distance based on the measured area.

Abstract: A computer system is provided. In one embodiment, the computer system includes a memory, a peripheral device, a central processing unit (CPU), and a peripheral device controller. The CPU stores information about the data transmission in a descriptor in the memory when data transmission between the CPU and the peripheral device is required. The peripheral device controller reads the descriptor from the memory at an access frequency, records whether the descriptor read from the memory requests for data transmission as a recording result, and adjusts the access frequency according to the recording result.

Abstract: A computer system has an adjustable data transmission rate between a CPU and a core logic chip thereof. In the computer system, the CPU has a power state adjustable in response to a power management control signal issued by the core logic chip. For adjusting data transmission rate between the CPU and the core logic chip, a change of an asserted time of the power management control signal from a first time period to a second time period is first determined to obtain an index value. The data transmission rate is increased or decreased according to the index value.

Abstract: A semiconductor package having an optical device and the method of making the same, includes a transparent substrate, a chip, an optical device and a carrier substrate. The transparent substrate has a plurality of first contacts and second contacts, wherein the first contacts are electrically connected to the second contacts. The chip is connected to the transparent substrate and forms a gap therebetween. The chip has a plurality of third contacts that are electrically connected to the first contacts. The optical device is disposed in the gap. The carrier substrate has a receiving space and a plurality of fourth contacts, wherein the receiving space accommodates the chip and the optical device, and the fourth contacts are electrically connected to the second contacts of the transparent substrate. Therefore, no connecting wires are needed and the step of wire bonding is omitted. Also, only one transparent substrate is used in the semiconductor package.

Abstract: A method for a power management of a central processor unit is disclosed. The method is applied to when the central processor unit is in a low power state without snooping and a bus master signal is sent from a peripheral device. First, a South Bridge sends a control signal to a central processor unit to drive the central processor unit to enter a low power state allowing snooping. Afterward an arbiter of the North Bridge is enabled. If the bus master signal is sent from the peripheral device to the South Bridge, an arbiter of the South Bridge is also enabled. And then the bus master signal is snooped by the central processor unit and the data is transmitted. After the bus master signal is snooped and the data has been transmitted, the arbiters are disabled and the South Bridge drives the central processor unit to return to the low power state without snooping.

Abstract: A system and method, including software and hardware, for providing an accurate, real-time, and synchronized view of supply chain information. The system utilizes various RFID technologies (like an RFID tag, an RFID reader, and an RFID middleware software) to collect and manage data in real time. It then implements a synchronization mechanism to synchronize supply chain data from various data sources within and across a company in near real time fashion to allow different types of enterprise users, both internal and external, to access the synchronized information and take synchronized action within an appropriate timeframe.

Abstract: A package structure is provided herein. The package structure includes a first substrate and a second substrate. A first seal ring having a first height is disposed around a predetermined area of the first substrate and between the first and second substrates. A second seal ring having a second height is disposed on the first substrate and around the first seal ring. A sealant is provided between the first and second seal rings to seal up the package structure.

Abstract: A connected indicator wire of open-drained configuration is set between a north bridge and a south bridge. When either the south or north bridge is handling a bus master request, a bus master indicator (BMI) signal is asserted to the connected indicator wire. With open-drained configuration, the signal of the connected indicator wire is capable of reflecting whether a BMI signal is asserted, and accordingly, the south bridge controls the CPU to switch between power saving states for responding to the bus master request. The CPU does not have to resume a full-function power state to coordinate a bus master service.

Abstract: Thermal throttling duty estimation methods for a CPU (Central Processing Unit) in a computer system are provided. The temperature of a CPU is highly related to the CPU performance. CPU temperature data (CPUT) is first acquired. A thermal throttle duty (TTD) is then calculated according to the acquired CPUT. Thereafter, the calculated TTD can be sent to the CPU and the CPU performance is accordingly adjusted.

Abstract: An image sensor package and a method for manufacturing the same are provided, wherein an image sensor chip facing downwards is assembled in a frame during the manufacture of the package so as to prevent the chip from being contaminated by falling dust and minute foreign objects.

Abstract: A method for power management of CPU and a system thereof which drive the CPU enter a most efficient power saving state is disclosed. A chip of the present invention sends a first control signal to drive the CPU to wake from the non-snooping sleep state and enter a normally executing instruction state as well as a system management mode to execute a system management interrupt routine. Then the chip enables an arbiter to transmit the bus master request to the CPU for processing. After completing processing the bus master request, the chip disables the arbiter and the CPU drives the chip sends a second control signal to drive the CPU return to the non-snooping sleep state according the system management interrupt routine.

Abstract: A chip package including a heat spreader, a circuit substrate, locating structures, a chip, wires, and an encapsulating compound is provided. The heat spreader has a bonding surface, and the circuit substrate is disposed on the bonding surface of the heat spreader. The circuit substrate has an opening, which exposes a portion of the bonding surface. The locating structures are disposed on the heat spreader for fixing the circuit substrate and attaching the circuit substrate to the bonding surface closely. The chip is disposed on the bonding surface exposed by the opening, and the wires are coupled between the chip and the circuit substrate. The encapsulating compound is disposed on the bonding surface exposed by the opening for covering the chip, the wires, and a portion of the circuit substrate. The chip package has high reliability and high yield of processing.

Abstract: An executing system and executing method of intelligent rule base service (IRBS) is provided. The executing system uses a rule base service interface for receiving a service request content which includes a header from a rule base service module, and obtains a proper rule from the rule base according to the header when a rule component receives the service request content. Finally, a rule application component applies the received rule on a part of the service request content needed to be processed to obtain and output a processing result.

Abstract: A product managing system and method using RFID technology is provided. The product managing system includes an RFID tag, an RFID reader, and a server. The RFID tag is set on a product for providing a tag ID, an object type and attribute, and an event content. The RFID reader reads the RFID tag. The server obtains various information provided by the RFID tag set on the product from the RFID reader, determines the product ID according to the tag ID, determines a class of the product and whether the product is correctly combined with another product according to the object type and attribute, and determines whether a processing procedure of the product is correctly conducted according to the event content. The server finally determines whether the product is normal according to the aforementioned determinations.

Abstract: The present invention relates to a semiconductor package having an optical device and the method of making the same. The semiconductor package comprises: a transparent substrate, a chip, an optical device and a carrier substrate. The transparent substrate has a plurality of first contacts and second contacts, wherein the first contacts are electrically connected to the second contacts. The chip is connected to the transparent substrate and forms a gap therebetween. The chip has a plurality of third contacts that are electrically connected to the first contacts. The optical device is disposed in the gap. The carrier substrate has a receiving space and a plurality of fourth contacts, wherein the receiving space accommodates the chip and the optical device, and the fourth contacts are electrically connected to the second contacts of the transparent substrate. Therefore, no connecting wires are needed and the step of wire bonding is omitted.

Abstract: A method for a power management of a central processor unit is disclosed. The method is applied to when the central processor unit is in a low power state without snooping and a bus master signal is sent from a peripheral device. First, a South Bridge sends a control signal to a central processor unit to drive the central processor unit to enter a low power state allowing snooping. Afterward an arbiter of the North Bridge is enabled. If the bus master signal is sent from the peripheral device to the South Bridge, an arbiter of the South Bridge is also enabled. And then the bus master signal is snooped by the central processor unit and the data is transmitted. After the bus master signal is snooped and the data has been transmitted, the arbiters are disabled and the South Bridge drives the central processor unit to return to the low power state without snooping.

Abstract: A system and method, including software and hardware, for providing an accurate, real-time, and synchronized view of supply chain information. The system utilizes various RFID technologies (like an RFID tag, an RFID reader, and an RFID middleware software) to collect and manage data in real time. It then implements a synchronization mechanism to synchronize supply chain data from various data sources within and across a company in near real time fashion to allow different types of enterprise users, both internal and external, to access the synchronized information and take synchronized action within an appropriate timeframe.

Abstract: A chip package including a heat spreader, a circuit substrate, locating structures, a chip, wires, and an encapsulating compound is provided. The heat spreader has a bonding surface, and the circuit substrate is disposed on the bonding surface of the heat spreader. The circuit substrate has an opening, which exposes a portion of the bonding surface. The locating structures are disposed on the heat spreader for fixing the circuit substrate and attaching the circuit substrate to the bonding surface closely. The chip is disposed on the bonding surface exposed by the opening, and the wires are coupled between the chip and the circuit substrate. The encapsulating compound is disposed on the bonding surface exposed by the opening for covering the chip, the wires, and a portion of the circuit substrate. The chip package has high reliability and high yield of processing.

Abstract: A connected indicator wire of open-drained configuration is set between a north bridge and a south bridge. When either the south or north bridge is handling a bus master request, a bus master indicator (BMI) signal is asserted to the connected indicator wire. With open-drained configuration, the signal of the connected indicator wire is capable of reflecting whether a BMI signal is asserted, and accordingly, the south bridge controls the CPU to switch between power saving states for responding to the bus master request. The CPU does not have to resume a full-function power state to coordinate a bus master service.