Patents by Inventor Cheng-Wei Huang

Cheng-Wei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070055899
    Abstract: A method for a power management of a central processor unit is disclosed. The method is applied to when the central processor unit is in a low power state without snooping and a bus master signal is sent from a peripheral device. First, a South Bridge sends a control signal to a central processor unit to drive the central processor unit to enter a low power state allowing snooping. Afterward an arbiter of the North Bridge is enabled. If the bus master signal is sent from the peripheral device to the South Bridge, an arbiter of the South Bridge is also enabled. And then the bus master signal is snooped by the central processor unit and the data is transmitted. After the bus master signal is snooped and the data has been transmitted, the arbiters are disabled and the South Bridge drives the central processor unit to return to the low power state without snooping.
    Type: Application
    Filed: April 17, 2006
    Publication date: March 8, 2007
    Inventors: Jui-Ming Wei, Cheng-Wei Huang, Yao-Chun Su, Ruei-Ling Lin
  • Publication number: 20060250248
    Abstract: A system and method, including software and hardware, for providing an accurate, real-time, and synchronized view of supply chain information. The system utilizes various RFID technologies (like an RFID tag, an RFID reader, and an RFID middleware software) to collect and manage data in real time. It then implements a synchronization mechanism to synchronize supply chain data from various data sources within and across a company in near real time fashion to allow different types of enterprise users, both internal and external, to access the synchronized information and take synchronized action within an appropriate timeframe.
    Type: Application
    Filed: May 5, 2005
    Publication date: November 9, 2006
    Inventors: Mengru Tu, Kuo-Sue Lo, Chuan-Yu Wu, Cheng-Wei Huang, Ho-Chun Lei
  • Publication number: 20060226540
    Abstract: A chip package including a heat spreader, a circuit substrate, locating structures, a chip, wires, and an encapsulating compound is provided. The heat spreader has a bonding surface, and the circuit substrate is disposed on the bonding surface of the heat spreader. The circuit substrate has an opening, which exposes a portion of the bonding surface. The locating structures are disposed on the heat spreader for fixing the circuit substrate and attaching the circuit substrate to the bonding surface closely. The chip is disposed on the bonding surface exposed by the opening, and the wires are coupled between the chip and the circuit substrate. The encapsulating compound is disposed on the bonding surface exposed by the opening for covering the chip, the wires, and a portion of the circuit substrate. The chip package has high reliability and high yield of processing.
    Type: Application
    Filed: December 13, 2005
    Publication date: October 12, 2006
    Inventors: Cheng-Wei Huang, Kuang-Wei Yao
  • Publication number: 20060053310
    Abstract: A connected indicator wire of open-drained configuration is set between a north bridge and a south bridge. When either the south or north bridge is handling a bus master request, a bus master indicator (BMI) signal is asserted to the connected indicator wire. With open-drained configuration, the signal of the connected indicator wire is capable of reflecting whether a BMI signal is asserted, and accordingly, the south bridge controls the CPU to switch between power saving states for responding to the bus master request. The CPU does not have to resume a full-function power state to coordinate a bus master service.
    Type: Application
    Filed: May 27, 2005
    Publication date: March 9, 2006
    Inventors: Yao-Chun Su, Ruei-Ling Lin, Jui-Ming Wei, Cheng-Wei Huang
  • Publication number: 20050025995
    Abstract: Iridium compounds having at least two 2-arylpyridine ligands in which a non-hydrogen atom group is substituted at the 4-position of the pyridine ring, and light-emitting elements comprising on organic layer comprising at least one of the iridium compounds are disclosed.
    Type: Application
    Filed: July 29, 2004
    Publication date: February 3, 2005
    Inventors: Chien-Hong Cheng, Ruey-Min Chen, Cheng-Wei Huang, Chen-Chung Yang
  • Patent number: 5962193
    Abstract: The present invention discloses a method and apparatus for controlling air flow in a liquid coating apparatus by providing an adjustable housing that consists of an upper compartment and a lower compartment such that the height of the cavity contained therein can be adjusted. Subsequently, the spacing between a substrate to be coated and the interior wall of the upper compartment can be suitably adjusted to allow a desirable quantity of air flowing therethrough. The redeposition of liquid coating particles thrown off the substrate surface during a spin coating process and then bouncing back from the interior wall of the upper compartment onto the substrate surface can be prevented. The contamination of the substrate surface can therefore be eliminated or reduced.
    Type: Grant
    Filed: January 13, 1998
    Date of Patent: October 5, 1999
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Kuang-Hung Lin, Dong-Hsu Cheng, Cheng-Wei Huang, Cheng-Ku Chen