Patents by Inventor Cheng Xu

Cheng Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10726613
    Abstract: A computer-implemented method according to one embodiment includes identifying a mobile detection device, requesting the mobile detection device to travel to a predetermined location, requesting the mobile detection device to retrieve location information and supplementary information from a radio frequency identification (RFID) tag at the predetermined location, receiving the location information and the supplementary information from the mobile detection device, determining a three-dimensional location of the RFID tag, based on the location information, and creating a three-dimensional map that includes the three-dimensional location of the RFID tag and the supplementary information from the RFID tag.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: July 28, 2020
    Assignee: International Business Machines Corporation
    Inventors: Si Bin Fan, Yu Gu, Su Liu, Cheng Xu
  • Publication number: 20200230229
    Abstract: Embodiments of immunogens based on the HIV-1 Env fusion peptide and methods of their use and production are disclosed. Nucleic acid molecules encoding the immunogens are also provided. In several embodiments, the immunogens can be used to generate an immune response to HIV-1 Env in a subject, for example, to treat or prevent an HIV-1 infection in the subject.
    Type: Application
    Filed: October 3, 2017
    Publication date: July 23, 2020
    Applicant: THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVIC
    Inventors: Peter Kwong, Rui Kong, Tongqing Zhou, John Mascola, Kai Xu, Michael Gordon Joyce, Cheng Cheng, Gwo-Yu Chuang, Kevin Liu, Baoshan Zhang, Li Ou, Wing-Pui Kong, Yongping Yang
  • Publication number: 20200225545
    Abstract: A display substrate, a display panel, a display device and a bonding method are provided. The display panel substrate includes: a transparent substrate comprising a display area and a bonding area located at the periphery of the display area. The bonding area is provided with a first bonding pad connected with a touch electrode, and a second bonding pad connected with a display electrode. One of the touch electrode and the display electrode is located in the display area, and the other electrode is located on another transparent substrate facing to the transparent substrate.
    Type: Application
    Filed: September 8, 2017
    Publication date: July 16, 2020
    Inventors: Cheng Zuo, Zhijun Xu, Kangpeng Dang
  • Publication number: 20200220599
    Abstract: A wireless communication device and a wireless communication method. A wireless communication device for use in a base station side includes one or more processors. The processor is configured to obtain a distribution state of a user equipment, and determine to use a channel state information-reference signal (CSI-RS) mechanism based on the distribution state of the user equipment. In addition, the processor is further configured to generate indication information, the indication information being used for indicating to the user equipment the CSI-RS to be used. Besides, the processor is further configured to control to send the CSI-RS to the user equipment according to the CSI-RS mechanism.
    Type: Application
    Filed: March 16, 2020
    Publication date: July 9, 2020
    Applicant: Sony Corporation
    Inventors: Jin XU, Siqi LIU, Cheng GAO, Bingcheng JIN, Jinhui CHEN
  • Publication number: 20200219763
    Abstract: A method of fabricating interconnects in a semiconductor device is provided, which includes forming an interconnect layer having a conductive line and depositing a first aluminum-containing layer over the interconnect layer. A dielectric layer is deposited over the first aluminum-containing layer, followed by a second aluminum-containing layer deposited over the dielectric layer. A via opening is formed in the second aluminum-containing layer through to the conductive line, wherein the via opening has chamferless sidewalls.
    Type: Application
    Filed: January 9, 2019
    Publication date: July 9, 2020
    Inventors: YUPING REN, HAIGOU HUANG, RAVI PRAKASH SRIVASTAVA, ZHIGUO SUN, QIANG FANG, CHENG XU, GUOXIANG NING
  • Publication number: 20200214643
    Abstract: A system and method for instant tongue sampling and diagnosis includes acquiring a plurality of tongue images from a plurality of digital oral devices, and a current health conditions, building a diagnosis framework for diagnosing a current health condition of a user by: i) analyzing the collected tongue images with a visual recognition engine to determine tongue characteristics of each tongue captured in the tongue images, and ii) correlating the tongue characteristics with the current health condition, identifying tongue characteristics from a received image of the tongue using the visual image recognition engine, applying the diagnosis framework to the tongue characteristics of the tongue to diagnosis the current health condition of the user, and modifying a graphical user interface of the digital oral device to display a custom health report indicative of the current health condition of the user, in response to applying the diagnosis framework.
    Type: Application
    Filed: February 24, 2020
    Publication date: July 9, 2020
    Inventors: Anita Govindjee, Su Liu, Cheng Xu, Hong Chuan Yuan
  • Patent number: 10705362
    Abstract: A curved display device and a fabrication method are provided. The curved display device comprises: a cover lens; a display panel, wherein the display panel and the cover lens are bonded together as an integral having a curved surface; and a module, wherein a supporter is provided at each of at least two ends of the module. The supporter provided at the each of at least two ends of the module is directly bonded to the cover lens.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: July 7, 2020
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Cheng Fu, Yincheng Ding, Xiaosong Song, Chuanzhi Xu, Mengning Hu, Xiaoye Li
  • Patent number: 10705219
    Abstract: The present application discloses a method and apparatus for updating a map. An implementation of the method comprises: acquiring a laser point clouds obtained by scanning a surrounding environment and acquiring a periodic pose change of a vehicle in a scanning period; determining an a priori pose of the laser radar at a reference time in the current scanning period based on a known pose of the laser radar in a previous scanning period and the periodic pose change; performing motion compensation on the scanned laser point clouds to form a compensated point cloud frame; generating a partial point cloud characteristic map; matching the partial point cloud characteristic map with a map area obtained in a reference point cloud map, and correcting the a priori pose to obtain an a posteriori pose; and updating a three-dimensional point cloud map of a to-be-constructed area using the compensated point cloud frame.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: July 7, 2020
    Assignee: BAIDU ONLINE NETWORK TECHNOLOGY (BEIJNG) CO., LTD
    Inventors: Shichun Yi, Cheng Wang, Li Yu, Shiyu Song, Baoqiang Xu
  • Publication number: 20200212020
    Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a die having a first surface and an opposing second surface; a capacitor having a surface, wherein the surface of the capacitor is coupled to the first surface of the die; and a conductive pillar coupled to the first surface of the die. In some embodiments, a microelectronic assembly may include a capacitor in a first dielectric layer; a conductive pillar in the first dielectric layer; a first die having a surface in the first dielectric layer; and a second die having a surface in a second dielectric layer, wherein the second dielectric layer is on the first dielectric layer, and wherein the surface of the second die is coupled to the capacitor, to the surface of the first die, and to the conductive pillar.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 2, 2020
    Applicant: Intel Corporation
    Inventors: Chong Zhang, Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao
  • Publication number: 20200211806
    Abstract: An external grid-controlled hot cathode array electron gun, including an insulated cathode base, a filament, a plurality of hot cathode emission elements, and a grid-controlled structure is disclosed. In one aspect, the grid-controlled structure includes an insulated grid-controlled structure body and a plurality of through holes. One side of the grid-controlled structure body abuts against the cathode base to clamp the filament between the grid-controlled structure body and the cathode base and the plurality of hot cathode emission elements are inserted into the plurality of through holes respectively.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 2, 2020
    Inventors: Wenhui Huang, Qingxiu Jin, Cong Xu, Luming Zhang, Donghai Liu, Cheng Song, Peidong Wu, Qun Luo, Chengjun Tan, Shuo Wang
  • Publication number: 20200211927
    Abstract: Microelectronic assemblies that include a cooling channel, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a surface, a die having a surface, and a fluidic channel between the surface of the die and the surface of the package substrate, wherein a top surface of the fluidic channel is defined by the surface of the die and a bottom surface of the fluidic channel is defined by the surface of the package substrate. In some embodiments, a microelectronic assembly may include a package substrate having a surface; a die having a surface; and an interposer having a fluidic channel between the surface of the die and the surface of the package substrate.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 2, 2020
    Applicant: Intel Corporation
    Inventors: Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang, Chong Zhang, Kyu Oh Lee, Chandra Mohan Jha, Chia-Pin Chiu
  • Patent number: 10698559
    Abstract: Provided are a method and an apparatus for displaying content on a same screen and a terminal device. The method includes: displaying an application interface of an application on a display apparatus, and displaying a floating region on the same screen as the application interface; setting a content loader corresponding to the floating region; determining display content of the floating region; and invoking the content loader to load the determined display content to the floating region for display.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: June 30, 2020
    Assignee: Tencent Technology (Shenzhen) Company Limited
    Inventors: Kunjie Zhang, Chaoqun Jin, Wenshuo Zhou, Xiaonan Feng, Guangwen Zhong, Can Li, Liping Zhou, Cheng Guo, Wei Xu, Xiao Song
  • Patent number: 10699104
    Abstract: The present disclosure provides a method, computer system and computer program product for obtaining an image. According to the method, an emotional status of a user is determined, at least one character can be determined based on a preference of the user, and at least one image comprising the at least one character can be obtained based on the emotional status of the user.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: June 30, 2020
    Assignee: International Business Machines Corporation
    Inventors: Cheng Xu, Su Liu, Bing Fang, Li Ya Feng
  • Publication number: 20200202061
    Abstract: Techniques and systems for implementing a general extensible layer mapping approach that maps between integrated circuit (IC) design database layers and process layers are described. A first IC design layout having in-design layers can be converted into a second IC design layout having derived layers, wherein said converting comprises mapping the in-design layers to the derived layers by applying a set of layer derivation rules to shapes in the IC design layout, and wherein the set of layer derivation rules implements a one-to-many mapping between the in-design layers and the derived layers. Next, a one-to-one mapping between the derived layers and process layers used in a parasitic extraction tool can be generated. Parasitic extraction on the IC design layout then be performed by providing the second IC design layout and the one-to-one mapping to the parasitic extraction tool.
    Type: Application
    Filed: December 18, 2019
    Publication date: June 25, 2020
    Applicant: Synopsys, Inc.
    Inventors: Jun Wang, Yun-Jui Li, Bin Xu, Cheng-Ming Wu, Yu Fan Lu, Hu Cai, Yuting Fu, Hwei-Tseng Wang, Sui Zheng, Jeong-Tyng Li
  • Publication number: 20200204228
    Abstract: An electronic device at a base station end includes a processing circuit, the processing circuit being configured to: configure, in response to request signalling from a user equipment, an aperiodic beam-forming reference signal relevant to a first beam group for the user equipment, wherein the first beam group is determined by a base station according to channel state information periodically fed back by the user equipment; generate downlink control information, so as to indicate that the user equipment feeds back beam selection information according to the aperiodic beam-forming reference signal; determine, according to the beam selection information, one or a plurality of candidate beams and one or a plurality of corresponding second pre-coding codebooks; and determine an effective pre-coding codebook based on the one or multiple second pre-coding codebooks.
    Type: Application
    Filed: March 5, 2020
    Publication date: June 25, 2020
    Applicant: Sony Corporation
    Inventors: Jin XU, Cheng GAO, Siqi LIU, Chaonan HE, Jianfei CAO
  • Publication number: 20200185300
    Abstract: An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.
    Type: Application
    Filed: December 10, 2018
    Publication date: June 11, 2020
    Applicant: INTEL CORPORATION
    Inventors: Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha, Kyu-oh Lee
  • Patent number: 10678572
    Abstract: Techniques provide a framework for dynamic globalization enablement for an application during software development. A globalization development operation information system (GDOIS) retrieves source code for the application, which is assigned to support specified globalization features. The GDOIS evaluates the source code for each of the plurality of specified globalization features. Upon determining that the source code does not include at least a first specified globalization feature, the GDOIS identifies an application programming interface (API) associated with the feature. The GDOIS inserts source code associated with the API into the source code for the application.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: June 9, 2020
    Assignee: International Business Machines Corporation
    Inventors: Syed Haiderzaidi, Su Liu, Boyi Tzen, Cheng Xu
  • Patent number: 10674952
    Abstract: A system and method for providing reminding assistance. The system includes at least one processing component, at least one memory component, and a memory impairment detection and assistance environment. The memory impairment detection and assistance environment includes a reminding database, an analysis module, and an assistance module. The analysis module includes an attribute analyzer configured to determine values for attributes based on memory impairment detection data and a memory evaluator configured to determine that an attribute has a value that crosses a threshold attribute value. The assistance module includes a reminding assistant configured to receive a memory impairment signal and, in response, generate a reminder that includes information selected from the reminding database.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: June 9, 2020
    Assignee: International Business Machines Corporation
    Inventors: Anita Govindjee, Cheng Xu, Su Liu, Bing Fang
  • Publication number: 20200175535
    Abstract: Systems and methods are provided for online traffic dynamical adjustment and optimization. A such system may comprise one or more servers configured to monitor an incoming traffic volume for visiting an online platform, determine one or more unit traffic values of the monitored incoming traffic volume to the online platform, and monitor one or more subsets of the incoming traffic volume for respectively visiting one or more sub-platforms of the online platform.
    Type: Application
    Filed: July 7, 2017
    Publication date: June 4, 2020
    Inventors: Hua XU, Guang YANG, Chi ZHANG, Jun YIN, Kaifan YANG, Chuang TIAN, Cheng YANG, Shenghuo ZHU, Rong JIN
  • Publication number: 20200176674
    Abstract: The present disclosure provides a 1S1R memory integrated structure and a method for fabricating the same, wherein the 1S1R memory integrated structure includes: a word line metal, a resistive material layer, a selector lower electrode, a selector material layer, a selector upper electrode, an interconnection wire, and a bit line metal; wherein the selector material layer is in a shape of a groove, and the selector upper electrode is formed in the groove. According to the 1S1R memory integrated structure and its fabricating method in the present disclosure, by the change of the integrated position of the selector, the device area of the selector is much larger than the device area of the memory, which significantly reduces the requirement for the on-state current density of the selector.
    Type: Application
    Filed: February 10, 2020
    Publication date: June 4, 2020
    Inventors: Qing Luo, Hangbing Lv, Ming Liu, Xiaoxin Xu, Cheng Lu