Patents by Inventor Cheng Xu

Cheng Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11480710
    Abstract: A computer receives a hotspot and a corresponding incentive, where the hotspot is a geolocation for collecting the weather data. The computer presents the received hotspot and the corresponding incentive to a user. The computer receives the weather data from the drone, transmits the weather data to a server, and updates a scorecard with the incentive corresponding to the hotspot based on determining that the drone reached the hotspot.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: October 25, 2022
    Assignee: International Business Machines Corporation
    Inventors: Sushain Pandit, Su Liu, Fang Wang, Cheng Xu
  • Publication number: 20220328431
    Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.
    Type: Application
    Filed: June 28, 2022
    Publication date: October 13, 2022
    Inventors: Cheng XU, Kyu-Oh LEE, Junnan ZHAO, Rahul JAIN, Ji Yong PARK, Sai VADLAMANI, Seo Young KIM
  • Patent number: 11466218
    Abstract: A catalytic reactor apparatus is disclosed for continuous conversion of plastic wastes into liquid fuels by dispersing a cracking catalyst in molten plastics and cracking plastic macromolecules into smaller hydrocarbons within boiling point range of gasoline and diesel fuel at temperatures significantly lower than thermal pyrolysis and thermal cracking. The catalyst/plastic mixing and heat transfer from the reactor wall to the reaction zone are enhanced using non-Newtonian stirrer. A catalytic membrane filter is used to keep the catalyst fines and unconverted plastic particulates inside the reactor while letting the desirable hydrocarbon vapor be withdrawn out of the reactor.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: October 11, 2022
    Assignee: Molecule Works Inc.
    Inventors: Wei Liu, Bang-Cheng Xu
  • Patent number: 11450471
    Abstract: Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: September 20, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Kyu-Oh Lee, Junnan Zhao, Rahul Jain, Ji Yong Park, Sai Vadlamani, Seo Young Kim
  • Patent number: 11440797
    Abstract: A process of catalytic partial oxidation of hydrocarbons, particularly methane and/or natural gas to form a product containing hydrogen and carbon monoxide where the first catalyst comprises Co—Ni—Cr—W alloy.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: September 13, 2022
    Inventor: Bang-Cheng Xu
  • Patent number: 11443892
    Abstract: Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: September 13, 2022
    Assignee: Intel Corporation
    Inventors: Kyu-Oh Lee, Rahul Jain, Sai Vadlamani, Cheng Xu, Ji Yong Park, Junnan Zhao, Seo Young Kim
  • Publication number: 20220278038
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
    Type: Application
    Filed: May 12, 2022
    Publication date: September 1, 2022
    Applicant: Intel Corporation
    Inventors: Ji Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew James Brown, Cheng Xu, Jiwei Sun
  • Patent number: 11429795
    Abstract: A combined translation request is obtained that includes content of a first language to be translated to a second language combined with translation context information of a user for which translation is to be performed. The content is translated, using machine translation, from the first language to the second language based on the translation context information to provide a translation. The translation is adjusted based on one or more identified translation factors selected based on user feedback to provide an adjusted translation. The adjusted translation is provided to the user.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: August 30, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Su Liu, Yu Liu, Cheng Xu, Shunguo Yan
  • Publication number: 20220262844
    Abstract: Disclosed is an X-ray sensor having an active detector region including detector diodes on its surface. The X-ray sensor further includes a junction termination surrounding the surface region including the detector diodes. The junction termination includes a guard arranged closest to the end of the surface region, a field stop outside the guard and at least two field limiting rings, FLRs arranged between the guard and the field stop. A first FLR is arranged at a distance ?1 from the guard selected from the interval [4 ?m; 12 ?m], a second FLR is arranged at a distance ?2 from the first FLR selected from the interval [6.5 ?m; 14 ?m], and wherein the distance ?2 is larger than the distance ?1. The proposed technology also provides a method for constructing such an X-ray sensor and an X-ray imaging system including an X-ray detector system that includes such X-ray sensor.
    Type: Application
    Filed: May 14, 2019
    Publication date: August 18, 2022
    Inventors: Mietek BAKOWSKI HOLTRYD, Mats DANIELSSON, Cheng XU
  • Patent number: 11417614
    Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: August 16, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Kyu-Oh Lee, Junnan Zhao, Rahul Jain, Ji Yong Park, Sai Vadlamani, Seo Young Kim
  • Publication number: 20220230800
    Abstract: Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.
    Type: Application
    Filed: April 5, 2022
    Publication date: July 21, 2022
    Inventors: Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji Yong Park, Srinivas Venkata Ramanuja Pietambaram, Ying Wang, Chong Zhang, Rui Zhang, Junnan Zhao
  • Publication number: 20220230951
    Abstract: Methods/structures of forming in-package inductor structures are described. Embodiments include a substrate including a dielectric material, the substrate having a first side and a second side. A conductive trace is located within the dielectric material. A first layer is on a first side of the conductive trace, wherein the first layer comprises an electroplated magnetic material, and wherein a sidewall of the first layer is adjacent the dielectric material. A second layer is on a second side of the conductive trace, wherein the second layer comprises the electroplated magnetic material, and wherein a sidewall of the second layer is adjacent the dielectric material.
    Type: Application
    Filed: April 7, 2022
    Publication date: July 21, 2022
    Applicant: Intel Corporation
    Inventors: Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Rahul Jain, Andrew J. Brown, Lauren A. Link, Cheng Xu, Sheng C. Li
  • Patent number: 11393016
    Abstract: A smart meal ordering method comprises: conducting body sensing of a diner by a body sensing hardware of a smart meal ordering device; outputting a meal ordering interface by a display screen of a smart meal ordering device in response to sensing that the diner has taken a seat, and obtaining information of one or more dishes selected by the diner on the meal ordering interface; and in response to sensing that the diner has left the seat, sending a total price of the dishes and identification information of the smart meal ordering device to a server.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: July 19, 2022
    Assignee: ADVANCED NEW TECHNOLOGIES CO., LTD.
    Inventors: Huanmi Yin, Sihai Yao, Jun Wu, Ying Wang, Fang Fang, Cheng Xu, Rong Wang, Feng Lin
  • Patent number: 11384384
    Abstract: Disclosed herein are methods, reagent kits, and compositions for performing a bisulfite conversion of DNA directly from a biological sample including a patient's urine sample or a slide-mounted FFPE tissue sample. For example, a method of performing a bisulfite conversion of DNA can comprise certain preliminary steps for processing the biological sample and transferring a portion of the processed sample into a reaction vessel containing a bisulfite mixture. The method can further comprise heating the reaction vessel containing the biological sample and the bisulfite mixture at several heating temperatures and subsequently holding the reaction vessel at a holding temperature for a holding period. The method can also comprise certain bisulfite removal steps, desulfonation steps, and removal of the desulfonation solution. A final elution step can yield the converted DNA for further downstream sequencing and analysis.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: July 12, 2022
    Inventors: Tom Cheng Xu, Kuikui Shen, Sally Li Shen, Jinlan Xu, Shilei Tang, Jusong Liang
  • Patent number: 11387224
    Abstract: A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a cavity, and phase change material within the cavity. In an example, the phase change material has a phase change temperature lower than 120 degree centigrade. A die may be coupled to the substrate. In an example, the semiconductor device package structure includes one or more interconnect structures that are to couple the die to the phase change material within the cavity.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: July 12, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan M Jha, Ying Wang, Kyu-oh Lee
  • Patent number: 11380609
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: July 5, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Jiwei Sun, Ji Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew James Brown
  • Publication number: 20220191024
    Abstract: By analyzing a content of a first message, a confidentiality level of the first message is determined. An encryption rule for a first computational complexity level corresponding to the confidentiality level of the first message is selected. The first message is encoded according to the encryption rule. The encoded first message and the confidentiality level of the first message are caused to be sent to a recipient.
    Type: Application
    Filed: December 15, 2020
    Publication date: June 16, 2022
    Applicant: International Business Machines Corporation
    Inventors: Su Liu, Yin Xia, Cheng Xu, Xinya Wang
  • Patent number: 11361143
    Abstract: Embodiments of the present invention are directed to a computer-implemented method for proactive rich text format management. Aspects include obtaining a content item to be displayed to a user and obtaining a preferred rich text format template for the user. Aspects also include applying the preferred rich text format template to the content item to create a customized view of the content item and displaying the customized view of the content item to the user.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: June 14, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anita Govindjee, Su Liu, Kai Liu, Cheng Xu
  • Patent number: 11355459
    Abstract: Techniques for fabricating a semiconductor package having magnetic materials embedded therein are described. For one technique, fabrication of package includes: forming a pad and a conductive line on a build-up layer; forming a raised pad structure on the build-up layer, the raised pad comprising a pillar structure on the pad; encapsulating the conductive line and the raised pad structure in a magnetic film comprising one or more magnetic fillers; planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar; depositing a primer layer on the top surfaces; removing one or more portions of the primer layer above the raised pad structure to create an opening; and forming a via in the opening on the raised pad structure. The primer layer may comprise one or more of a build-up layer, a photoimageable dielectric layer, and a metal mask.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: June 7, 2022
    Assignee: Intel Corpoation
    Inventors: Kyu-Oh Lee, Sai Vadlamani, Rahul Jain, Junnan Zhao, Ji Yong Park, Cheng Xu, Seo Young Kim
  • Patent number: 11347381
    Abstract: A set of images and a corresponding set of textual information are received, such that a first textual information is to be presented with a first image. The first textual information is translated into a set of translated textual information, each textual information in the set of translated textual information corresponding to a language in a set of languages. A set of layout parameters is determined for at least one translated textual information. The translated textual information is transformed according to the set of layout parameters and overlaid on the first image. The overlaying causes a pixel of the transformed translated textual information to be superimposed on a pixel of the first image.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: May 31, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Su Liu, Yang Liang, Debbie Anglin, Cheng Xu