Patents by Inventor Cheng-Yi Chang

Cheng-Yi Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190165124
    Abstract: A semiconductor structure includes a substrate, a semiconductor fin connected to the substrate, an epitaxial layer disposed over the semiconductor fin, and a silicide feature over and in contact with the epitaxial layer. The epitaxial layer including silicon germanium (SiGe) and further includes gallium (Ga) in an upper portion of the epitaxial layer that is in contact with the silicide feature.
    Type: Application
    Filed: December 6, 2018
    Publication date: May 30, 2019
    Inventors: Shahaji B. More, Chun Hsiung Tsai, Shih-Chieh Chang, Kuo-Feng Yu, Cheng-Yi Peng
  • Publication number: 20190164747
    Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In a method embodiment, a dielectric layer is formed on a semiconductor substrate. The semiconductor substrate has a source/drain region. An opening is formed through the dielectric layer to the source/drain region. A silicide region is formed on the source/drain region and a barrier layer is formed in the opening along sidewalls of the dielectric layer by a same Plasma-Enhance Chemical Vapor Deposition (PECVD) process.
    Type: Application
    Filed: January 2, 2018
    Publication date: May 30, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Wei CHANG, Huang-Yi HUANG, Chun-chieh WANG, Yu-Ting LIN, Min-Hsiu HUNG
  • Publication number: 20190165143
    Abstract: Methods for forming semiconductor structures are provided. The method includes forming a fin structure over a substrate and forming a gate structure across the fin structure. The method further includes forming a fin spacer on a sidewall of the fin structure and partially removing the fin spacer. The method further includes recessing the fin structure to form a recess and implanting dopants from the recess to form a doped region. The method further includes diffusing the dopants in the doped region to form an expanded doped region and forming a source/drain structure over the expanded doped region.
    Type: Application
    Filed: May 31, 2018
    Publication date: May 30, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shahaji B. MORE, Chun-Hsiung TSAI, Cheng-Yi PENG, Shih-Chieh CHANG, Kuo-Feng YU
  • Patent number: 9709957
    Abstract: A smart wristwatch structure includes a glass, a dial, a watch case, a bottom case, a movement, an antenna, a functional module, and a dedicated battery. The dial, the watch case, and the bottom case construct an accommodating space from top to bottom. The antenna is adhered to a lower surface of the glass. The functional module is disposed in the accommodating space for wirelessly communicating with a mobile terminal. The dedicated battery provides power for the functional module or the movement. In the smart wristwatch structure, signals are not shielded, and the thickness of the watch case is not increased significantly.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: July 18, 2017
    Assignee: PRINCO CORP.
    Inventors: Chi-Pin Kuo, Ying-Che Shih, Cheng-Yi Chang
  • Publication number: 20170199497
    Abstract: A smart wristwatch structure includes a glass, a dial, a watch case, a bottom case, a movement, an antenna, a functional module, and a dedicated battery. The dial, the watch case, and the bottom case construct an accommodating space from top to bottom. The antenna is adhered a lower surface of the glass. The functional module is disposed in the accommodating space for wirelessly communicating with a mobile terminal. The dedicated battery provides power for the functional module or the movement. In the smart wristwatch structure, signals are not shielded, and the thickness of the watch case is not increased significantly.
    Type: Application
    Filed: May 27, 2016
    Publication date: July 13, 2017
    Applicant: PRINCO CORP.
    Inventors: Chi-Pin Kuo, Ying-Che Shih, Cheng-Yi Chang
  • Publication number: 20170060268
    Abstract: A device for integrating a position, an attitude, and a wireless transmission is disclosed. The device includes an electrical connection substrate, a processor unit, a wireless communication module, and a set of sensors. The wireless communication module is electrically coupled to the processor unit via the electrical connection substrate. The set of sensors is electrically coupled to the processor unit. The processor unit and the wireless communication module are packaged as a monolithic package structure on the electrical connection substrate. The device for integrating the position, the attitude, and the wireless transmission can be manufactured as a miniaturization device. Accordingly, the present invention can be applied to a wearable device and applied to a game in which an absolute positioning is required.
    Type: Application
    Filed: August 17, 2016
    Publication date: March 2, 2017
    Applicant: PRINCO CORP.
    Inventors: Chen-Ping Chiu, Chih-Kuang Yang, Cheng-Yi Chang
  • Patent number: 9379089
    Abstract: Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: June 28, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-kuang Yang, Cheng-yi Chang, Yeong-yan Guu, Gan-how Shaue
  • Publication number: 20160091864
    Abstract: The present invention provides a wristwatch structure with physical hands and a method for offering a communication function to a wristwatch, which uses remaining room in a traditional wristwatch (such as a mechanical watch and a quartz watch) to dispose an electronic module. By way of wireless transmission, the electronic module is utilized to receive wireless signals transmitted from a device (such as a smart phone) near a wristwatch user, and to provide a prompt message (such as vibration or an audio sound) based on the wireless signals. The present invention gives a new function to the traditional wristwatch, and is also capable of solving the problem of prompt function not working in large-scale cell phone.
    Type: Application
    Filed: September 14, 2015
    Publication date: March 31, 2016
    Applicant: Princo Middle East FZE
    Inventors: Chih-Kuang Yang, Cheng-Yi Chang, Chi-Pin Kuo
  • Patent number: 9256209
    Abstract: The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: February 9, 2016
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-Kuang Yang, Yeong-yan Guu, Cheng-yi Chang, Gan-how Shaue
  • Patent number: 9223296
    Abstract: The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: December 29, 2015
    Assignee: PRINCO MIDDLE EAST FZE
    Inventors: Chih-kuang Yang, Yeong-yan Guu, Cheng-yi Chang, Gan-how Shaue
  • Publication number: 20150323906
    Abstract: Disclosed are a timepiece and a power saving method of a timepiece. The timepiece includes a display, a setting module, a sensor and a controller. The display is utilized for displaying a time pattern. The setting module is utilized for setting a normal display mode and a first power saving mode. The sensor is utilized for sensing an operation of a user for transmitting a signal. The controller is utilized for switching the display between the normal display mode and the first power saving mode according to the setting of the setting module and the signal of the sensor. The display changes the time pattern when the timepiece is switched between the normal display mode and the first power saving mode. The present invention can decrease the power consumption for extending the usage time of the timepiece.
    Type: Application
    Filed: March 27, 2015
    Publication date: November 12, 2015
    Inventors: Chih-kuang YANG, Cheng-yi CHANG
  • Publication number: 20140328147
    Abstract: The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch.
    Type: Application
    Filed: February 24, 2014
    Publication date: November 6, 2014
    Applicant: Princo Middle East FZE
    Inventors: Chih-kuang YANG, Yeong-yan GUU, Cheng-yi CHANG, Gan-how SHAUE
  • Publication number: 20140328148
    Abstract: The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle.
    Type: Application
    Filed: February 24, 2014
    Publication date: November 6, 2014
    Applicant: Princo Middle East FZE
    Inventors: Chih-Kuang YANG, Yeong-yan GUU, Cheng-yi CHANG, Gan-how SHAUE
  • Publication number: 20140312490
    Abstract: Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.
    Type: Application
    Filed: January 23, 2014
    Publication date: October 23, 2014
    Applicant: Princo Middle East FZE
    Inventors: Chih-kuang YANG, Cheng-yi CHANG, Yeong-yan GUU, Gan-how SHAUE
  • Patent number: 8496047
    Abstract: A heat dissipating apparatus includes a thermal conducting base and heat pipes connected to the thermal conducting base. Each heat pipe includes a heated section and a heat dissipating section. The portion connected to the thermal conducting base is the heated section, and the heat dissipating section is extended outward from the thermal conducting base. In the heat pipes, at least one heat dissipating section of the heat pipe is extended outward from a lateral side of the thermal conducting base, and the heat dissipating section of the heat pipe is situated at a position higher than the heated section, and fins are disposed on the heat dissipating section of the heat pipe. Therefore, the heat pipe guides the heat absorbed by thermal conducting base to a lateral side to dissipate heat from a nearby heat source.
    Type: Grant
    Filed: December 30, 2008
    Date of Patent: July 30, 2013
    Assignee: Chemtron Research LLC
    Inventor: Cheng-Yi Chang
  • Patent number: 8278562
    Abstract: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: October 2, 2012
    Assignee: Princo Middle East FZE
    Inventors: Chih-Kuang Yang, Cheng-Yi Chang
  • Patent number: 8266797
    Abstract: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: September 18, 2012
    Assignee: Princo Middle East FZE
    Inventors: Chih-Kuang Yang, Cheng-Yi Chang
  • Publication number: 20110266589
    Abstract: A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape.
    Type: Application
    Filed: July 15, 2011
    Publication date: November 3, 2011
    Applicants: EVERLIGHT ELECTRONICS CO., LTD., EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD.
    Inventors: Chih-Chia Tsai, Cheng-Yi Chang, Ming-Kuei Lin
  • Patent number: 8008100
    Abstract: A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an encapsulant. In the manufacturing method, a heating step is first performed to heat a first transparent plastic material to be a sticky member. Thereafter a connecting step is performed to connect the lead frame to the sticky member. Then a chip-bonding step is performed to bond the LED chips on the sticky member. Thereafter a wire-bonding step is performed to electrically connect the transparent LED chip to the lead frame. Then an encapsulating step is performed to encapsulate the transparent LED chips with a second transparent plastic material. Thereafter a drying step is performed to form the shapes of the sticky member and the second transparent plastic material.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: August 30, 2011
    Assignee: Everylight Electronics Co., Ltd.
    Inventors: Chih-Chia Tsai, Cheng-Yi Chang, Ming-Kuei Lin
  • Publication number: 20110198782
    Abstract: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process.
    Type: Application
    Filed: April 22, 2011
    Publication date: August 18, 2011
    Applicant: PRINCO CORP.
    Inventors: Chih-Kuang Yang, Cheng-Yi Chang