Abstract: A sensor semiconductor package and a fabrication method thereof are provided in the present application. The fabrication method comprises steps of: forming a plurality of grooves on a wafer between bond pads on active surfaces of every adjacent chips; forming metal layers in the grooves for electrically connecting with the bond pads of adjacent chips; thinning the non-active surfaces to expose the metal layers therefrom; forming a cover layer on the non-active surfaces with the metal layers are exposed therefrom; forming a solder resist layer on the covering layer and the conductive wirings with terminals of the conductive wirings are exposed therefrom; and cutting along cutting paths between every sensor chips to form a plurality of sensor semiconductor packages. Accordingly, the prior art problems such as misalignment of forming beveled grooves, concentrated stress and breakage can be solved.

Abstract: A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.

Abstract: A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.

Abstract: A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.

Abstract: A base apparatus includes a base and two finger devices. The base has a first surface and two opposite sides. The finger devices are respectively mounted on the sides of the base, are made of conductive material, and each of the finger devices has multiple fingers. The fingers are extended on the first surface of the base, wherein the fingers of a first finger device are arranged respectively corresponding to the fingers of a second finger device whereby each pair of corresponding fingers supports an illuminating device. The base has a height, each of the fingers has a width and the width is smaller than the height. When the LED is mounted onto a substrate, the LED can be mounted on the substrate by its side so that an entire assembly height of the LED is reduced and is equal to the width of the LED.

Abstract: A semiconductor package and a method for fabricating the same are disclosed. The method includes installing a plurality of conductive components on a plurality of chip carriers of a chip carrier module, connecting electrically the conductive components to electrical connection points of the adjacent chip carriers, mounting and electrically connecting a semiconductor chip to each of the chip carries, forming an encapsulant for enveloping the semiconductor chip and the conductive components, cutting the chip carriers to separate the conductive components installed thereon, exposing a portion of the conductive components out of the encapsulant, forming on the exposed portion of the conductive components an electroplated layer of nickel/gold, and separating the chip carriers from each other. The conductive components exposed out of the encapsulant provide extra electrical connection points and thereby promote the functionalities of electronic products.

Abstract: A sensor semiconductor device is proposed. A plurality of metal bumps and a sensor chip are mounted on a substrate. A dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the metal bumps and the sensor chip. Thus, the sensor chip is electrically connected to the substrate via the circuit layer and the metal bumps. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. A plurality of solder balls are mounted on a surface of the substrate free of mounting the sensor chip, for electrically connecting the sensor chip to an external device.

Abstract: A surface mounting optoelectronic device is provided. The surface mounting optoelectronic device comprises a circuit board, a conductive layer, an auto-focus LED chip, a flash LED chip, a reflector and an encapsulant. The auto-focus LED chip and the flash LED chip are located on the conductive layer. The reflector is located on the edge of the circuit board. The encapsulant is filled into the reflector to hermetically seal the auto-focus LED chip and the flash LED chip.

Abstract: A sensor semiconductor device and a method for fabricating the same are proposed. A plurality of metal bumps and a sensor chip are mounted on a substrate. A dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the metal bumps and the sensor chip. Thus, the sensor chip is electrically connected to the substrate via the circuit layer and the metal bumps. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. A plurality of solder balls are mounted on a surface of the substrate free of mounting the sensor chip, for electrically connecting the sensor chip to an external device.

Abstract: A semiconductor device and the fabrication method thereof are provided.

Abstract: A sensor semiconductor device and a fabrication method thereof are provided. The fabrication method includes mounting a sensor chip on a surface of a substrate; forming a transparent cover on the sensor chip; forming a dielectric layer and a circuit layer on the substrate, wherein the sensor chip is electrically connected to the substrate through the circuit layer and the transparent cover is exposed from the dielectric layer such that light can pass through the transparent cover to reach a sensor region of the sensor chip and allow the sensor chip to operate; and implanting a plurality of solder balls on another surface of the substrate to electrically connect the sensor chip to an external device. The sensor semiconductor device can be cost-effectively fabricated, and the circuit cracking and known good die (KGD) problems of the prior art can be avoided.

Abstract: A flat lamp structure is disclosed. The flat lamp structure includes a gas discharge chamber, a fluorescence substance, a discharge gas, and a plurality of electrodes. The fluorescence substance is disposed on the inner wall of the gas discharge chamber, and the discharge gas is disposed in the gas discharge chamber. The electrodes are disposed on the outer wall of the gas discharge chamber, wherein the gas discharge chamber comprises a dielectric substrate, a plate, and a plurality of rods, and the plate is disposed on the upper portion of the dielectric substrate and the rods are disposed between the plate and the dielectric substrate, and the plate and the edge of dielectric are connected. Additionally, the gas discharge chamber, for example, can dispose with at least a spacer to enhance the strength of the gas discharge chamber.

Abstract: A sensor semiconductor device and a method for fabricating the same are proposed. A plurality of metal bumps and a sensor chip are mounted on a substrate. A dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the metal bumps and the sensor chip. Thus, the sensor chip is electrically connected to the substrate via the circuit layer and the metal bumps. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. A plurality of solder balls are mounted on a surface of the substrate free of mounting the sensor chip, for electrically connecting the sensor chip to an external device.

Abstract: A sensor semiconductor device and a method for fabricating the same are proposed. A sensor chip is mounted on a substrate, and a dielectric layer and a circuit layer are formed on the substrate, wherein the circuit layer is electrically connected to the substrate and the sensor chip. The dielectric layer is formed with an opening for exposing a sensor region of the sensor chip. A light-penetrable lid covers the opening of the dielectric layer, such that light is able to penetrate the light-penetrable lid to reach the sensor region and activate the sensor chip. The sensor chip can be electrically connected to an external device via a plurality of solder balls implanted on a surface of the substrate not for mounting the sensor chip. Therefore, the sensor semiconductor device is fabricated in a cost-effective manner, and circuit cracking and a know good die (KGD) problem are prevented.

Abstract: A sensor module structure and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers is provided, each chip carrier having a first surface and a second surface. At least one semiconductor chip is mounted on and electrically connected to the first surface of each of the chip carriers. An encapsulation body is formed for completely encapsulating the semiconductor chips and the first surfaces of the chip carriers. A singulation process is performed to form individual package units integrated with the semiconductor chips. A sensor chip, a corresponding lens kit and a flexible printed circuit (FPC) board are attached to the second surface of each of the chip carriers, wherein the sensor chip and the FPC board are electrically connected to the chip carrier. This provides the sensor module structure fabricated with simple processes, low costs and high yields.

Abstract: A planar fluorescent lamp having a first panel, a second panel, a glass rim, a venting tube, and a set of electrodes. Fluorescent layers are formed on both the first panel and the second panel. The glass rim is mounted on edges of the first and second panels. A recess and a gap are formed in the glass rim; the recess is used for placing the electrodes while the gap is reserved for installing the venting tube. The first panel, the second panel, and the glass rim are so arranged so that a cavity is formed thereby. The cavity is vacuumed via the venting tube and mercury vapor and inert gas are then introduced into the cavity.

Abstract: A method and apparatus for measuring a wafer position on a lower electrode in a plasma etching device are disclosed herein. A wafer is generally placed on a lower electrode in a process chamber of a plasma etching device. Such a wafer (i.e., semiconductor wafer) generally comprises a front side and a back side. A differential pressure gradient between the front side and the back side of the wafer is determined, and thereafter, a position of the wafer on the lower electrode can be measured utilizing the differential pressure gradient.

Abstract: A flat lamp. The flat lamp comprises an upper glass plate, a bottom glass plate, at least one glass sidewall, two long electrodes, two front glass sleeves and two rear glass sleeves. The upper glass plate, the bottom glass plate and the glass sidewalls form a closed space. The two long electrodes are parallel and extend through the front glass sleeves into the closed space. Support from the rear glass sleeve prevents electrode bending.

Abstract: A cold cathode fluorescent flat lamp comprising a first plate, a second plate, a fluorescent substance, a discharge gas and a plurality of electrodes is provided. The first plate has a plurality of grooves. The second plate is disposed on the first plate on which the grooves form airtight chambers. The fluorescent substance is disposed on the inner wall of the airtight chambers; the discharge gas is disposed in the airtight chambers; and the electrodes are disposed on both sides of various airtight chambers. Therefore, by disposing the grooves on the inner surface of the first plate, the second plate can dispose on the first plate directly. Furthermore, the second plate disposing on the first plate directly can enhance the strength of the cold cathode fluorescent flat lamp without using rods and spacers.

Abstract: A flat lamp structure is disclosed. The flat lamp structure comprises a gas discharge chamber, a fluorescence substance, a discharge gas, and a plurality of electrodes. The fluorescence substance is disposed on the inner wall of the gas discharge chamber, and the discharge gas is disposed in the gas discharge chamber. The electrodes are disposed on the outer wall of the gas discharge chamber, wherein the gas discharge chamber comprises a dielectric substrate, a plate, and a plurality of rods, and the plate is disposed on the upper portion of the dielectric substrate and the rods are disposed between the plate and the dielectric substrate, and the plate and the edge of dielectric are connected. Additionally, the gas discharge chamber, for example, can dispose with at least a spacer to enhance the strength of the gas discharge chamber.