Abstract: Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component.

Abstract: A heat dissipating apparatus includes a thermal conducting base and heat pipes connected to the thermal conducting base. Each heat pipe includes a heated section and a heat dissipating section. The portion connected to the thermal conducting base is the heated section, and the heat dissipating section is extended outward from the thermal conducting base. In the heat pipes, at least one heat dissipating section of the heat pipe is extended outward from a lateral side of the thermal conducting base, and the heat dissipating section of the heat pipe is situated at a position higher than the heated section, and fins are disposed on the heat dissipating section of the heat pipe. Therefore, the heat pipe guides the heat absorbed by thermal conducting base to a lateral side to dissipate heat from a nearby heat source.

Abstract: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process.

Abstract: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process.

Abstract: A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape.

Abstract: A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an encapsulant. In the manufacturing method, a heating step is first performed to heat a first transparent plastic material to be a sticky member. Thereafter a connecting step is performed to connect the lead frame to the sticky member. Then a chip-bonding step is performed to bond the LED chips on the sticky member. Thereafter a wire-bonding step is performed to electrically connect the transparent LED chip to the lead frame. Then an encapsulating step is performed to encapsulate the transparent LED chips with a second transparent plastic material. Thereafter a drying step is performed to form the shapes of the sticky member and the second transparent plastic material.

Abstract: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process.

Abstract: A submount comprising a chip mounting area, a first bonding pad and a connecting portion is provided. An LED chip is mounted on the chip mounting area. The first bonding pad is electrically connected to an electrode of the LED chip. The connecting portion has a first hollow portion and is disposed between the chip mounting area and the first bonding pad. The first hollow portion is located between the chip mounting area and the first bonding pad. The first hollow portion is located in a central region of the connecting portion.

Abstract: A base apparatus includes a base and two finger devices. The base has a first surface and two opposite sides. The finger devices are respectively mounted on the sides of the base, are made of conductive material, and each of the finger devices has multiple fingers. The fingers are extended on the first surface of the base, wherein the fingers of a first finger device are arranged respectively corresponding to the fingers of a second finger device whereby each pair of corresponding fingers supports an illuminating device. The base has a height, each of the fingers has a width and the width is smaller than the height. When the LED is mounted onto a substrate, the LED can be mounted on the substrate by its side so that an entire assembly height of the LED is reduced and is equal to the width of the LED.

Abstract: An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad.

Abstract: A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.

Abstract: An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad.

Abstract: A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an encapsulant. In the manufacturing method, a heating step is first performed to heat a first transparent plastic material to be a sticky member. Thereafter a connecting step is performed to connect the lead frame to the sticky member. Then a chip-bounding step is performed to bond the LED chips on the sticky member. Thereafter a wire-bonding step is performed to electrically connect the transparent LED chip to the lead frame. Then an encapsulating step is performed to encapsulate the transparent LED chips with a second transparent plastic material. Thereafter a drying step is performed to form the shapes of the sticky member and the second transparent plastic material.

Abstract: A heat dissipating apparatus includes a thermal conducting base and heat pipes connected to the thermal conducting base. Each heat pipe includes a heated section and a heat dissipating section. The portion connected to the thermal conducting base is the heated section, and the heat dissipating section is extended outward from the thermal conducting base. In the heat pipes, at least one heat dissipating section of the heat pipe is extended outward from a lateral side of the thermal conducting base, and the heat dissipating section of the heat pipe is situated at a position higher than the heated section, and fins are disposed on the heat dissipating section of the heat pipe. Therefore, the heat pipe guides the heat absorbed by thermal conducting base to a lateral side to dissipate heat from a nearby heat source.

Abstract: A cooling apparatus includes a base, a plurality of first heat pipes, a plurality of second heat pipes, a plurality of first heat conducting columns and a plurality of second heat conducting columns. Each of the first heat pipes and the second heat pipes respectively has a heat-absorbing terminal. The heat-absorbing terminals of the first heat pipes are disposed on the base spaced at intervals. The heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes spaced at intervals. Each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes. Each of the second heat conducting columns is installed between the heat-absorbing terminals of the two adjacent second heat pipes. Thereby, the heat conducting area is increased within the base, and the cooling efficiency of the cooling apparatus is enhanced.

Abstract: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process.

Abstract: A sensor semiconductor device and a fabrication method thereof are provided. The fabrication method includes mounting a sensor chip on a surface of a substrate; forming a transparent cover on the sensor chip; forming a dielectric layer and a circuit layer on the substrate, wherein the sensor chip is electrically connected to the substrate through the circuit layer and the transparent cover is exposed from the dielectric layer such that light can pass through the transparent cover to reach a sensor region of the sensor chip and allow the sensor chip to operate; and implanting a plurality of solder balls on another surface of the substrate to electrically connect the sensor chip to an external device. The sensor semiconductor device can be cost-effectively fabricated, and the circuit cracking and known good die (KGD) problems of the prior art can be avoided.

Abstract: The present invention provides a sensor-type semiconductor package and a method for fabricating the same. The method includes the steps of: providing a wafer having a plurality of sensor chips for mounting the wafer on a carrier board having an insulation layer, a plurality of conductive traces, and a substrate; forming a plurality of grooves among the solder pads on the active surfaces of the adjacent sensor chips, so as to expose the conductive traces and form a metal layer in the grooves, to electrically connect to the solder pads on the active surfaces of the adjacent sensor chips and the conductive traces; disposing a transparent medium on the wafer to cover the sensing areas of the sensor chips; removing the substrate, so as to expose the conductive traces and the insulation layer; and cutting the sensor chips along the borders to form a plurality of sensor-type semiconductor packages.

Abstract: A sensor semiconductor package and a fabrication method thereof are provided in the present application. The fabrication method comprises steps of: forming a plurality of grooves on a wafer between bond pads on active surfaces of every adjacent chips; forming metal layers in the grooves for electrically connecting with the bond pads of adjacent chips; thinning the non-active surfaces to expose the metal layers therefrom; forming a cover layer on the non-active surfaces with the metal layers are exposed therefrom; forming a solder resist layer on the covering layer and the conductive wirings with terminals of the conductive wirings are exposed therefrom; and cutting along cutting paths between every sensor chips to form a plurality of sensor semiconductor packages. Accordingly, the prior art problems such as misalignment of forming beveled grooves, concentrated stress and breakage can be solved.