Patents by Inventor Cheng-Yu Hsieh
Cheng-Yu Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20180192067Abstract: A scheduling method for a high efficiency video coding (HEVC) apparatus is provided. A plurality of input frame signals are received by a scheduling module of the HEVC apparatus to generate a control signal to determine whether an inter/intra-frame coding operation is to be performed on each of the input frame signals. When the control signal is determined to perform the inter/intra-frame coding operation, the HEVC apparatus performs a first coding operation and a second coding operation sequentially on multiple of the plurality of frame signals in each working cycle. Each working cycle is a time period corresponding to one of the first coding operation and the second coding operation that a single luma frame signal or a single chroma frame signal undergoes.Type: ApplicationFiled: December 21, 2017Publication date: July 5, 2018Inventors: Cheng-Yu Hsieh, Yu-Hsiang Tseng
-
Patent number: 9979071Abstract: An electronic device including a metal element and an antenna element is provided. The antenna element is disposed on a substrate and includes a radiation portion and a connection portion. A first end of the radiation portion has a feeding point for receiving a feeding signal, and a second end of the radiation portion is an open end. A first end of the connection portion is electrically connected to the first end of the radiation portion. A second end of the connecting portion has a first ground point to be electrically connected the metal element. An orthogonal projection of the metal element on the substrate and an orthogonal projection of the antenna element on the substrate are overlapped with each other. The radiation portion is electrically connected the metal element through a second ground point.Type: GrantFiled: April 11, 2016Date of Patent: May 22, 2018Assignee: Acer IncorporatedInventors: Cheng-Yu Hsieh, Kun-Sheng Chang, Ching-Chi Lin
-
Publication number: 20170349763Abstract: An anti-corrosion composite layer includes a first anti-corrosion coating coated on a substrate, and a second anti-corrosion coating coated on the first anti-corrosion coating. The first anti-corrosion layer includes a plurality of first graphene nanosheets and a first carrier resin, wherein a surface of each the first graphene nanosheet has a first lipophilic functional group for chemically bonding to the first carrier resin, the first lipophilic functional group is selected from carboxyl, epoxy and amino. The second anti-corrosion coating includes a plurality of second graphene nanosheets and a second carrier resin, wherein a surface of each the second graphene nanosheet has a second lipophilic functional group for chemically bonding to the second carrier resin, the second lipophilic functional group is selected from hydroxyl and isocyanic acid group.Type: ApplicationFiled: September 14, 2016Publication date: December 7, 2017Inventors: Mark Y. Wu, Cheng-Yu Hsieh, Chun-Hsien Lee, Jing-Ru Chen, Shu-Ling Hsieh
-
Patent number: 9747522Abstract: An image processing method is provided. The method is for calculating a first weighted sum of absolute difference (WSAD) of a first search window and a corresponding first target window, and a second WSAD of a second search window and a corresponding second target window. The first and second search windows have a common matching window, and the first and second target windows have a common target block. The method includes: a) calculating a plurality of absolute differences of the common matching window and the common target block; b) determining a first weight coefficient group and a second weight coefficient group; and c) summing up products of multiplying the absolute differences by the first weight coefficient group to generate the first WSAD, and summing up products of multiplying the absolute differences by the second weight coefficient group to generate the second WSAD.Type: GrantFiled: December 31, 2014Date of Patent: August 29, 2017Assignee: MStar Semiconductor, Inc.Inventors: Yu-Hsiang Tseng, Cheng-Yu Hsieh, Wei-Hsiang Hong
-
Patent number: 9704611Abstract: The present invention discloses a composite structure of graphene and carbon nanotube and a method of manufacturing the same. The composite structure includes graphene platelets and carbon nanotubes, each carbon nanotube growing perpendicular to the planar surface of the graphene platelet. The method includes steps of graphene platelets preparation, chemical precipitation, chemical reduction and carbon nanotube growth. Metal particles are first formed on the graphene platelets through the steps of chemical precipitation and electrochemical reduction, and carbon nanotubes grow in the step of carbon nanotube growth through thermal treatment. Thus, the graphene platelets and the carbon nanotubes of the present invention form a three dimensional structure, and the carbon nanotubes are used as three dimensional spacers and configured between the graphene platelets, which are effectively separated and hard to aggregate or congregate together.Type: GrantFiled: June 24, 2015Date of Patent: July 11, 2017Assignee: ENERAGE INC.Inventors: Mark Y. Wu, Cheng-Yu Hsieh, Cheng-Shu Peng
-
Publication number: 20170190925Abstract: A transparent antistatic film of the present application includes a substrate and a transparent graphene coating, the substrate at least includes a first surface, and the transparent graphene coating is disposed above the first surface of the substrate. The transparent graphene coating has a surface resistance less than 1012 ohm/sq and a visible transmittance greater than 70% at wavelength of 550 nm, and the transparent graphene coating includes a plurality of surface modified graphene nanosheets and a carrier resin, wherein the plurality of surface modified graphene nanosheets is uniformly dispersed in the carrier resin.Type: ApplicationFiled: March 22, 2016Publication date: July 6, 2017Inventors: Mark Y. WU, Cheng-Yu HSIEH, Fang-Ru SHEN, Tsung-Han CHEN, You-Lin JIAN
-
Publication number: 20170141452Abstract: An electronic device including a metal element and an antenna element is provided. The antenna element is disposed on a substrate and includes a radiation portion and a connection portion. A first end of the radiation portion has a feeding point for receiving a feeding signal, and a second end of the radiation portion is an open end. A first end of the connection portion is electrically connected to the first end of the radiation portion. A second end of the connecting portion has a first ground point to be electrically connected the metal element. An orthogonal projection of the metal element on the substrate and an orthogonal projection of the antenna element on the substrate are overlapped with each other. The radiation portion is electrically connected the metal element through a second ground point.Type: ApplicationFiled: April 11, 2016Publication date: May 18, 2017Inventors: Cheng-Yu Hsieh, Kun-Sheng Chang, Ching-Chi Lin
-
Publication number: 20170129772Abstract: A semiconductor structure includes: a first device; a second device contacted with the first device, wherein a chamber is formed between the first device and the second device; a first hole disposed in the second device and defined between a first end with a first circumference and a second end with a second circumference; a second hole disposed in the second device and aligned to the first hole; and a sealing object for sealing the second hole. The first end links with the chamber, and the first circumference is different from the second circumference, the second hole is defined between the second end and a third end with a third circumference, and the second circumference and the third circumference are smaller than the first circumference.Type: ApplicationFiled: January 17, 2017Publication date: May 11, 2017Inventors: CHUN-WEN CHENG, YI-CHUAN TENG, CHENG-YU HSIEH, LEE-CHUAN TSENG, SHIH-CHANG LIU, SHIH-WEI LIN
-
Patent number: 9608032Abstract: A method for manufacturing a BSI image sensor includes following steps: A substrate is provided. The substrate includes a front side and a back side opposite to the front side. The substrate further includes a plurality of isolation structures and a plurality of sensing elements formed therein. Next, the isolation structures are exposed from the back side of the substrate. Subsequently, a thermal treatment is performed to the back side of the substrate to form a plurality of cambered surfaces on the back side of the substrate. The cambered surfaces are formed correspondingly to the sensing elements, respectively.Type: GrantFiled: September 22, 2016Date of Patent: March 28, 2017Assignee: UNITED MICROELECTRONICS CORP.Inventor: Cheng-Yu Hsieh
-
Patent number: 9567208Abstract: A semiconductor structure includes a first device, a second device, a first hole, a second hole, and a sealing object. The second device is contacted to the first device, wherein a chamber is formed between the first device and the second device. The first hole is disposed in the second device and defined between a first end with a first circumference and a second end with a second circumference. The second hole is disposed in the second device and aligned to the first hole. The sealing object seals the second hole. The first end links with the chamber, and the first circumference is different from the second circumference.Type: GrantFiled: November 6, 2015Date of Patent: February 14, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chun-Wen Cheng, Yi-Chuan Teng, Cheng-Yu Hsieh, Lee-Chuan Tseng, Shih-Wei Lin
-
Publication number: 20170012079Abstract: A method for manufacturing a BSI image sensor includes following steps: A substrate is provided. The substrate includes a front side and a back side opposite to the front side. The substrate further includes a plurality of isolation structures and a plurality of sensing elements formed therein. Next, the isolation structures are exposed from the back side of the substrate. Subsequently, a thermal treatment is performed to the back side of the substrate to form a plurality of cambered surfaces on the back side of the substrate. The cambered surfaces are formed correspondingly to the sensing elements, respectively.Type: ApplicationFiled: September 22, 2016Publication date: January 12, 2017Inventor: Cheng-Yu Hsieh
-
Patent number: 9530177Abstract: A data access method is provided. The data access method is applied for a data device access device to access data from N layers to display an image, where N is a positive integer. Each of the N layers includes a horizontal start point, a horizontal end point, a vertical start point and a vertical end point. The data access method includes: dividing the image into a plurality of regions according to the horizontal start points, the horizontal end points, the vertical start points and the vertical end points, wherein the regions respectively correspond to the N layers; and accessing data from the respective layers corresponding to the regions when displaying the image.Type: GrantFiled: May 13, 2014Date of Patent: December 27, 2016Assignee: MStar Semiconductor, Inc.Inventors: Chih-Hao Chang, Cheng-Yu Hsieh
-
Publication number: 20160329120Abstract: The present invention discloses a composite structure of graphene and carbon nanotube and a method of manufacturing the same. The composite structure includes graphene platelets and carbon nanotubes, each carbon nanotube growing perpendicular to the planar surface of the graphene platelet. The method includes steps of graphene platelets preparation, chemical precipitation, chemical reduction and carbon nanotube growth. Metal particles are first formed on the graphene platelets through the steps of chemical precipitation and electrochemical reduction, and carbon nanotubes grow in the step of carbon nanotube growth through thermal treatment. Thus, the graphene platelets and the carbon nanotubes of the present invention form a three dimensional structure, and the carbon nanotubes are used as three dimensional spacers and configured between the graphene platelets, which are effectively separated and hard to aggregate or congregate together.Type: ApplicationFiled: June 24, 2015Publication date: November 10, 2016Inventors: Mark Y. WU, Cheng-Yu HSIEH, Cheng-Shu PENG
-
Patent number: 9484380Abstract: A back side illumination image sensor includes a substrate including a front side and a back side opposite to the front side, a plurality of sensing elements formed in the substrate, a plurality of isolation structures isolating each element, and a plurality of cambered surfaces formed on the back side of the substrate. The cambered surfaces are formed correspondingly to the sensing elements, respectively.Type: GrantFiled: July 15, 2015Date of Patent: November 1, 2016Assignee: UNITED MICROELECTRONICS CORP.Inventor: Cheng-Yu Hsieh
-
Patent number: 9460828Abstract: Disclosed is a graphene printed circuit pattern structure including a substrate excellent in electrical insulation and a graphene printed circuit layer provided on the substrate. The graphene printed circuit layer is electrically conductive and has a circuit pattern like an electrical circuit on the circuit board. The graphene printed circuit layer includes surface-modified nanographene platelets, a carrier resin and a filler. The ratio of the particle size of the filler to the thickness of the surface-modified nanographene platelet is 2-1000, and the surface-modified nanographene platelets are dispersed in the carrier resin. The filler is uniformly placed among the surface-modified nanographene platelets so as to enhance effective contact for the surface-modified nanographene platelets. The graphene printed circuit pattern structure provides excellent electrical properties and heat dissipation to achieve protection by preventing electrical elements from overheat.Type: GrantFiled: October 30, 2014Date of Patent: October 4, 2016Assignee: ENERAGE INC.Inventors: Mark Y Wu, Cheng-Yu Hsieh, Jing-Ru Chen, Shu-Ling Hsieh, Kuan-Ting Li
-
Patent number: 9410041Abstract: A method of surface modifying graphene is disclosed and includes placing powder-like graphene into a closed container, heating up to a preset impurity detaching temperature higher than 100° C. so as to detach the impurity from the surface of graphene, further adjusting the treatment temperature to a preset surface modifying temperature, and injecting the gaseous surface modifying agent to be physically adsorbed by the surface of graphene. Thus, surface modified graphene is formed. The surface modifying temperature is higher than the sublimation temperature of the surface modifying agent and less than the decomposition temperature of the surface modifying agent. Therefore, the present invention is simpler and safer because of only physical adsorption used and no chemical reaction involved. Dispersibility of surface modified graphene in the solution is greatly increased to improve uniformity and enhance the performance of the final product formed of surface modified graphene.Type: GrantFiled: March 9, 2015Date of Patent: August 9, 2016Assignee: ENERAGE INC.Inventors: Mark Y. Wu, Cheng-Yu Hsieh, Cheng-Shu Peng
-
Publication number: 20160222215Abstract: A method of surface modifying graphene is disclosed and includes placing powder-like graphene into a closed container, heating up to a preset impurity detaching temperature higher than 100° C. so as to detach the impurity from the surface of graphene, further adjusting the treatment temperature to a preset surface modifying temperature, and injecting the gaseous surface modifying agent to be physically adsorbed by the surface of graphene. Thus, surface modified graphene is formed. The surface modifying temperature is higher than the sublimation temperature of the surface modifying agent and less than the decomposition temperature of the surface modifying agent. Therefore, the present invention is simpler and safer because of only physical adsorption used and no chemical reaction involved. Dispersibility of surface modified graphene in the solution is greatly increased to improve uniformity and enhance the performance of the final product formed of surface modified graphene.Type: ApplicationFiled: March 9, 2015Publication date: August 4, 2016Inventors: Mark Y. WU, Cheng-Yu HSIEH, Cheng-Shu PENG
-
Publication number: 20160210245Abstract: A circuit for accessing a memory is provided. The memory includes a scatter table storage region and a plurality of storage regions. The scatter table storage region stores a plurality of entries that record starting addresses and sizes of the data storage regions, respectively. The circuit includes an accessing circuit and a cache. The cache stores an entry read from the scatter table storage region. When the accessing circuit needs to access data from the data storage regions, the accessing circuit issues a read request to the cache to read the entry from the cache, determines whether the data is stored in the storage region recorded by the entry according to contents of the entry, and further accordingly determines whether to access the memory to obtain the data according to the contents of the entry.Type: ApplicationFiled: January 15, 2016Publication date: July 21, 2016Inventors: Yu-Hsiang Tseng, Cheng-Yu Hsieh
-
Patent number: 9363503Abstract: An image access method applicable to an image access device is provided. The method includes: providing a plurality of codes that respectively represent a plurality of image sources; determining a plurality of sets of access settings according to a pixel format arrangement, each set of access setting corresponding to a code arrangement combination composed of the codes; and sequentially accessing data of the image sources by the image access apparatus according to the code arrangement combinations corresponding to the access settings.Type: GrantFiled: February 5, 2014Date of Patent: June 7, 2016Assignee: MStar Semiconductor, Inc.Inventors: Chih-Hao Chang, Huan-Chun Tseng, Cheng-Yu Hsieh
-
Publication number: 20160126176Abstract: A package substrate is provided, which includes: a body having opposite first and second surfaces, each having adjacent first and second regions defined thereon; first and second circuit layers formed on the first and second surfaces of the body, respectively; a first insulating layer formed on the first surface of the body and having a plurality of first openings formed in the first insulating layer and positioned in the first and second regions; and a second insulating layer formed on the second surface of the body and having a plurality of second openings formed in the second insulating layer and positioned in the second region. Further, at least a third opening is formed in the second insulating layer and positioned in the first region to reduce the volume of the second insulating layer, thereby facilitating even distribution of thermal stresses through the first and second insulating layers during thermal cycling and hence preventing warpage of the package substrate.Type: ApplicationFiled: August 27, 2015Publication date: May 5, 2016Inventors: Tso-Chia Chang, Cheng-Yu Hsieh, Lien-Chen Chiang, Fu-Tang Huang