Abstract: A method for manufacturing a semiconductor device package includes providing a substrate having a first surface and a second surface opposite to the first surface; disposing a passive component layer on the first surface of the substrate; after disposing the passive component layer, forming at least one via in the substrate, wherein the via penetrates the substrate and the passive component layer; and disposing a conductive layer on the passive component layer and filling the via with the conductive layer.

Abstract: A method for manufacturing a semiconductor device package includes providing a substrate having a first surface and a second surface opposite to the first surface; disposing a passive component layer on the first surface of the substrate; after disposing the passive component layer, forming at least one via in the substrate, wherein the via penetrates the substrate and the passive component layer; and disposing a conductive layer on the passive component layer and filling the via with the conductive layer.

Abstract: A semiconductor device package includes a dielectric layer, a first RDL, a second RDL, an inductor, a first electronic component and a second electronic component. The first RDL is adjacent to a first surface of the dielectric layer, and the first RDL includes first conductive pieces. The second RDL is adjacent to a second surface of the dielectric layer, and the second RDL includes second conductive pieces. The inductor is disposed in the dielectric layer. The inductor includes induction pillars, wherein each of the induction pillars is disposed through the dielectric layer, and each of the induction pillars is interconnected between a respective one of the first conductive pieces of the first RDL and a respective one of the second conductive pieces of the second RDL. The first electronic component and the second electronic component are between the first RDL and the second RDL, and electrically connected to each other through the inductor.

Abstract: The present disclosure relates to a semiconductor package and a method of manufacturing the same. In some embodiments, a semiconductor package includes a substrate, at least one die, a sealing ring and an inductor. The at least one die is mounted on the substrate and includes a plurality of component structures operating with acoustic waves. The component structures are arranged on a side of the at least one die that faces the substrate. The sealing ring is disposed between the at least one die and the substrate and surrounds the component structures. The inductor is disposed in the substrate.