Abstract: A processing device can determine a configuration parameter to be used in an error correction code (ECC) operation. The configuration parameter is based on a memory type of a memory component that is associated with a controller. Data can be received from a host system. The processing device can generate a code word for the data by using the ECC operation that is based on the configuration parameter. The code word can be sent to a sequencer that is external to the controller.

Abstract: A read operation to retrieve data from memory component and that bypasses a prior search for the data at a buffer in a read data path associated with the read operation can be performed. Responsive to performing the read operation that bypasses the prior search for the data at the buffer, the data is returned to a host system.

Abstract: A computing system having a memory component with an embedded media controller. The memory component is encapsulated within an integrated circuit (IC) package. The embedded controller within the IC package is configured to: receive incoming packets, via a serial communication interface of the controller, from a serial connection outside of the IC package; convert the incoming packets into commands and addresses according to a predetermined serial communication protocol; operate memory units encapsulated within the IC package according to the commands and the addresses; convert results of at least a portion of the commands into outgoing packets; and transmit the outgoing packets via the serial communication interface to the serial connection outside of the IC package.

Abstract: A light-emitting touch button can include a first printed circuit board (PCB), a second PCB, and a pin coupling the first PCB to the second PCB. The first PCB can include first electronics to detect a touch event on a touch surface. The second PCB can include second electronics to control light emission. The pin can communicate the detected touch event from the first electronics to the second electronics. The touch button can also include a housing including one or more walls defining one or more light-emitting regions. One or more light sources can be disposed within the one or more light-emitting regions. The second electronics can control light emitted from the one or more light sources based at least in part on the detected touch event. The one or more walls can collimate the light emitted from the one or more light sources to the touch surface.

Abstract: An inertial measurement module comprising a depth measurement unit and an inertial data calculation unit is disclosed. When the inertial measurement module moves, the depth measurement unit keeps gathering depth data of the external environment in order to compute the coordinate transformations of a numbers of detected points in the external environment, and then, the inertial data calculation unit converts the coordinate transformations into inertial data of the inertial measurement module movement. Here, inertial data includes rotation and translation of the inertial measurement module on the X, Y and Z axes. Finally, the inertial measurement module outputs the transformed inertial data.

Abstract: A method and a processing device for providing financial data to a user are provided. The method includes: storing personal data uploaded by users into a database; obtaining personal data from the database by a server; scoring personal data individually for each user and sorting scores, and calculating relative transaction conditions of the users according to the sorting results by an examination module in the server; and displaying the sorting results and the transaction conditions via user terminals of the users by the server.

Abstract: A magnesium alloy is disclosed. The magnesium alloy includes magnesium (Mg), 6-12 wt % of lithium (Li) and 1-10 wt % of aluminum (Al). A temperature range between a solidus and a liquidus of the magnesium alloy is equal to or larger than 50° C.

Abstract: A manufacturing method and equipment for intensifying hardness of screws includes at least three steps. A first step is to have a steel wire forged into a first blank with a screw head and a screw shank. A second step is to convey the first blank into a thread shaping die to have the outer diameter of the shank of the first blank diminished to form a second blank through the first sectional cold forging region of the thread shaping die for intensifying the hardness of the shank. A third step is to have the second blank directly moved into the second sectional thread-forming region of the thread shaping die to shape threads and a pointed tail of the shank. Thus, both the second step and the third step can be carried out within the same thread shaping die, able to elevate shaping speeds and hardness of screws.

Abstract: An LED display with a reduced thickness is described. In one embodiment, the LED display includes a second support plate between a front support plate and a back support plate. The second support plate enables the front support plate to be thinner than if the second support plate was not included. The second support plate increases the distance between an LED chip and a light exit surface thereby allowing the front support plate thickness to be reduced by about the thickness of the second support plate. In one embodiment, the second support plate allows the thickness of an LED display to be thinner. The second support plate adds structural integrity to a back support plate. Therefore, the back support plate can be thinner, and thickness of the LED display can be reduced.

Abstract: An LED display with a reduced thickness is described. In one embodiment, the LED display includes a second support plate between a front support plate and a back support plate. The second support plate enables the front support plate to be thinner than if the second support plate was not included. The second support plate increases the distance between an LED chip and a light exit surface thereby allowing the front support plate thickness to be reduced by about the thickness of the second support plate. In one embodiment, the second support plate allows the thickness of an LED display to be thinner. The second support plate adds structural integrity to a back support plate. Therefore, the back support plate can be thinner, and thickness of the LED display can be reduced.

Abstract: An LED display with a reduced thickness is described. In one embodiment, the LED display includes a second support plate between a front support plate and a back support plate. The second support plate enables the front support plate to be thinner than if the second support plate was not included. The second support plate increases the distance between an LED chip and a light exit surface thereby allowing the front support plate thickness to be reduced by about the thickness of the second support plate. In one embodiment, the second support plate allows the thickness of an LED display to be thinner. The second support plate adds structural integrity to a back support plate. Therefore, the back support plate can be thinner, and thickness of the LED display can be reduced.

Abstract: An LED display with a reduced thickness is described. In one embodiment, the LED display includes a second support plate between a front support plate and a back support plate. The second support plate enables the front support plate to be thinner than if the second support plate was not included. The second support plate increases the distance between an LED chip and a light exit surface thereby allowing the front support plate thickness to be reduced by about the thickness of the second support plate. In one embodiment, the second support plate allows the thickness of an LED display to be thinner. The second support plate adds structural integrity to a back support plate. Therefore, the back support plate can be thinner, and thickness of the LED display can be reduced.

Abstract: An LED display with a reduced thickness is described. In one embodiment, the LED display includes a second support plate between a front support plate and a back support plate. The second support plate enables the front support plate to be thinner than if the second support plate was not included. The second support plate increases the distance between an LED chip and a light exit surface thereby allowing the front support plate thickness to be reduced by about the thickness of the second support plate. In one embodiment, the second support plate allows the thickness of an LED display to be thinner. The second support plate adds structural integrity to a back support plate. Therefore, the back support plate can be thinner, and thickness of the LED display can be reduced.

Abstract: A network interface circuit or card has a memory and a medium control module for transmitting data stored in the memory to a network. The method includes: when a packet data is transmitted (such as completely transmitted) from the memory to the medium control module, making the memory send an interrupt request such that a new packet data can be read into the memory. This results in increased data transmission efficiency in the network interface circuit.

Abstract: An LED display with a reduced thickness is described. In one embodiment, the LED display includes a second support plate between a front support plate and a back support plate. The second support plate enables the front support plate to be thinner than if the second support plate was not included. The second support plate increases the distance between an LED chip and a light exit surface thereby allowing the front support plate thickness to be reduced by about the thickness of the second support plate. In one embodiment, the second support plate allows the thickness of an LED display to be thinner. The second support plate adds structural integrity to a back support plate. Therefore, the back support plate can be thinner, and thickness of the LED display can be reduced.

Abstract: A self-tapping screw made of composite material includes a first shank and a second shank. The first shank made of stainless steel is provided with a locking head with a tool locking recess and a threaded member, having its lower end bored with a circular combining recess. The second shank made of low carbon steel, low carbon alloy steel or other steel suitable for carburizing and hardening treatment is provided with a threaded member and a cutting member and has its upper end secured with polygonal combining member to be combined with the combining recess of the first shank. The cutting member functions to cut a work piece and the threaded member will be locked therein. The stainless steel locking head exposed out of the work piece is uneasily corroded quickly by acid and alkaline in external environment, enabling the self-tapping screw locked in the work piece for long.

Abstract: Circuit and method for testing digital logic circuit modules of an integrated circuit chip. The circuit includes a storage device, a first multiplexing module and a selection device. The storage device stores first, second, third and fourth N-bit groups of a test pattern separately according to a loading signal and an address selection signal. The first multiplexing module is coupled to the storage device and a first digital logic circuit module, for parallel transmitting the first, second, third and fourth N-bit groups which will be received and executed by the first digital logic circuit module to parallel generate first, second and third M-bit groups. The selection device is coupled to the first digital logic circuit module for sequentially selecting one of the first, second and third M-bit groups to output a first test result according to the address selection signal.

Abstract: A network interface circuit or card has a memory and a medium control module for transmitting data stored in the memory to a network. The method includes: when a packet data is transmitted (such as completely transmitted) from the memory to the medium control module, making the memory send an interrupt request such that a new packet data can be read into the memory. This results in increased data transmission efficiency in the network interface circuit.

Abstract: A network interface circuit or card has a memory and a medium control module for transmitting data stored in the memory to a network. The method includes: when a packet data is transmitted (such as completely transmitted) from the memory to the medium control module, making the memory send an interrupt request such that a new packet data can be read into the memory. This results in increased data transmission efficiency in the network interface circuit.

Abstract: Circuit and method for testing digital logic circuit modules of an integrated circuit chip. The circuit includes a storage device, a first multiplexing module and a selection device. The storage device stores first, second, third and fourth N-bit groups of a test pattern separately according to a loading signal and an address selection signal. The first multiplexing module is coupled to the storage device and a first digital logic circuit module, for parallel transmitting the first, second, third and fourth N-bit groups which will be received and executed by the first digital logic circuit module to parallel generate first, second and third M-bit groups. The selection device is coupled to the first digital logic circuit module for sequentially selecting one of the first, second and third M-bit groups to output a first test result according to the address selection signal.