Patents by Inventor Cheng Zhao

Cheng Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210279048
    Abstract: A system capable of upgrading a firmware in the background and a method for upgrading a firmware in the background are provided. The method for upgrading the firmware in the background partitions the memory module of an electronic device, one user code sector is used to normally execute an initial firmware and an upgrade flow, and the other user code sector is used to store an upgrade firmware.
    Type: Application
    Filed: December 2, 2020
    Publication date: September 9, 2021
    Inventors: WEN-JUAN NI, HAO ZHOU, YUE-CHENG ZHAO, RONG CHEN
  • Patent number: 11110437
    Abstract: A method for preparing an SCR catalyst may include: (1) placing a first aqueous solution containing a titanium oxide and a tungstate in an electric field environment, adjusting the pH value of the first aqueous solution, and adjusting the current direction of the electric field environment to obtain a first mixture; (2) providing a second mixture by, in the electric field environment, adding dropwise a second aqueous solution containing a soluble salt of one or more active components, a copper-organic polyamine complex and a dispersant to the first mixture, and adjusting the current direction; and (3) processing the second mixture to obtain the SCR catalyst. The one or more active components may be selected from Ce, Zr, Cu, Fe, Pr and Sc.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: September 7, 2021
    Assignees: BAOTOU RESEARCH INSTITUTE OF RARE EARTHS, NATIONAL ENGINEERING RESEARCH CENTRE OF RUIKE RARE EARTH METALLURGY AND FUNCTION MATERIALS CO., LTD., HEBEI HWAT AUTOMOBILE COMPONENTS CO., LTD.
    Inventors: Wenyi Zhao, Yan Wang, Zhaoqiang Li, Cheng Zhang, Rongrong Fan, Xin Guo, Yu Wang, Rong Wang, Lihua Song, Yanhai Song, Yuan Li, Zhiyong Ding, Jing Song
  • Patent number: 11082658
    Abstract: A video transmission method and a system thereof are provided. The video transmission method includes: obtaining a first display timing setting parameter of one or more display devices. A total transmission bandwidth of the display device is calculated according to the first display timing setting parameter, and when the total transmission bandwidth is greater than a maximum transmission bandwidth between a video source and a conversion device, a second display timing setting parameter with a lower bandwidth is generated corresponding to the first display timing setting parameter. The video source transmits a video signal conforming to the second display timing setting parameter to the conversion device. The conversion device converts the second display timing setting parameter of the video signal back to the first display timing setting parameter. The video signal conforming to the first display timing setting parameter is transmitted to the corresponding display device.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: August 3, 2021
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yue-Cheng Zhao, Cheng-Hua Wu, Chia-Liang Wei, Cheng-Hung Wu
  • Patent number: 11072536
    Abstract: The present invention discloses a method and a process of producing ammonia from methane extracted from methane-hydrate at the site of methane-hydrate extraction. The method and the process comprise coupled chemical reactions. During the first reaction, carbon dioxide reacts methane-hydrate to produce carbon-dioxide-hydrate and methane: carbon dioxide+methane-hydrate?carbon-dioxide-hydrate+methane (CO2+CH4-hydrate?CO2-hydrate+CH4). The produced methane is reacted with water to produced carbon dioxide and hydrogen via the second reaction: methane+water?carbon dioxide+hydrogen (CH4+2H2O?CO2+4H2). One embodiment of the second reaction is a combination of the methane steam reforming reaction (CH4+H2O?CO+3H2) and the water-gas shift reaction (CO+H2O?CO2+H2), both are widely known in the art. The carbon dioxide produced in the second reaction is recycled and used for the first reaction.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: July 27, 2021
    Inventor: Ji-Cheng Zhao
  • Patent number: 11075072
    Abstract: A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: July 27, 2021
    Assignees: J-Metrics Technology Co., Ltd., Peking University Shenzhen Graduate School
    Inventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee, Dan Gong
  • Publication number: 20210202386
    Abstract: Provided is a planar power module with a spatially interleaved structure, including a top power substrate, a bottom power substrate arranged opposite to the top power substrate, and a plurality of interleaved switch units configured between the top power substrate and the bottom power substrate; wherein adjacent interleaved switch units are electrically connected through a current commutator so that the interleaved switch units form spatial position interleaving. Problems of uneven parallel currents and uneven heat dissipation in the power module are solved.
    Type: Application
    Filed: December 28, 2020
    Publication date: July 1, 2021
    Inventors: Laili WANG, Fengtao YANG, Wei MU, Dingkun MA, Cheng ZHAO, Jianpeng WANG
  • Publication number: 20210136322
    Abstract: A video transmission method and a system thereof are provided. The video transmission method includes: obtaining a first display timing setting parameter of one or more display devices. A total transmission bandwidth of the display device is calculated according to the first display timing setting parameter, and when the total transmission bandwidth is greater than a maximum transmission bandwidth between a video source and a conversion device, a second display timing setting parameter with a lower bandwidth is generated corresponding to the first display timing setting parameter. The video source transmits a video signal conforming to the second display timing setting parameter to the conversion device. The conversion device converts the second display timing setting parameter of the video signal back to the first display timing setting parameter. The video signal conforming to the first display timing setting parameter is transmitted to the corresponding display device.
    Type: Application
    Filed: April 27, 2020
    Publication date: May 6, 2021
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yue-Cheng Zhao, Cheng-Hua Wu, Chia-Liang Wei, Cheng-Hung Wu
  • Patent number: 10990138
    Abstract: A containing module includes a connection casing, a tubular member, and first and second connection members. A tubular structure extends inwardly from a first end portion of the connection casing and has first and second guide portions. The first guide portion extends inwardly from the tubular structure. The second guide portion extends from the first guide portion. The first and second connection members are pivoted to a second end portion of the connection casing. A protruding point protrudes from the tubular member corresponding to the first guide portion. The protruding point is movable along the first guide portion and the second guide portion.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: April 27, 2021
    Assignee: Wistron Corporation
    Inventors: XingLiang Bao, Cheng Zhao
  • Patent number: 10964744
    Abstract: Light control for improved near infrared sensitivity and channel separation for an image sensor. In one embodiment, an image sensor includes: a plurality of photodiodes arranged in rows and columns of a pixel array; and a light filter layer having a plurality of light filters configured over the plurality of photodiodes. The light filter layer has a first side facing the plurality of photodiodes and a second side facing away from the first side. The image sensor also includes a color filter layer having a plurality of color filters configured over the plurality of photodiodes. The color filter layer has a first surface facing the second side of the light filter layer and a second surface facing away from the first layer. Individual micro-lenses are configured to direct incoming light through corresponding light filter and color filter onto the respective photodiode.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: March 30, 2021
    Assignee: OmniVision Technologies, Inc.
    Inventors: Cheng Zhao, Chen-Wei Lu, Cunyu Yang, Ping-Hsu Chen, Zhiqiang Lin, Chengming Liu
  • Publication number: 20210082990
    Abstract: Light control for improved near infrared sensitivity and channel separation for an image sensor. In one embodiment, an image sensor includes: a plurality of photodiodes arranged in rows and columns of a pixel array; and a light filter layer having a plurality of light filters configured over the plurality of photodiodes. The light filter layer has a first side facing the plurality of photodiodes and a second side facing away from the first side. The image sensor also includes a color filter layer having a plurality of color filters configured over the plurality of photodiodes. The color filter layer has a first surface facing the second side of the light filter layer and a second surface facing away from the first layer. Individual micro-lenses are configured to direct incoming light through corresponding light filter and color filter onto the respective photodiode.
    Type: Application
    Filed: September 13, 2019
    Publication date: March 18, 2021
    Inventors: Cheng Zhao, Chen-Wei Lu, Cunyu Yang, Ping-Hsu Chen, Zhiqiang Lin, Chengming Liu
  • Publication number: 20210013026
    Abstract: A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.
    Type: Application
    Filed: May 14, 2020
    Publication date: January 14, 2021
    Inventors: Yu-Feng JIN, Sheng-Lin MA, Qian-Cheng ZHAO, Yi-Hsiang CHIU, Huan LIU, Hung-Ping LEE, Dan GONG
  • Patent number: 10880467
    Abstract: An image sensor pixel array comprises a plurality of image pixel units to gather image information and a plurality of phase detection auto-focus (PDAF) pixel units to gather phase information. Each of the PDAF pixel units includes two of first image sensor pixels covered by a shared micro-lens. Each of the image pixel units includes four of second image sensor pixels adjacent to each other, wherein each of the second image sensor pixels is covered by an individual micro-lens. A coating layer is disposed on the micro-lenses and forms a flattened surface across the whole image sensor pixel array to receive incident light.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: December 29, 2020
    Assignee: OmniVision Technologies, Inc.
    Inventors: Chen-Wei Lu, Yin Qian, Dyson Tai, Chin Poh Pang, Boyang Zhang, Cheng Zhao
  • Publication number: 20200388595
    Abstract: The present invention relates to a three-dimensional integrated package device for a high-voltage silicon carbide power module, comprising a source substrate, first chip submodules, a first driving terminal, a first driving substrate, a ceramic housing, a metal substrate, a water inlet, a water outlet, second chip submodules, a second driving terminal, a second driving substrate and a drain substrate from top to bottom; and each first chip submodule is composed of a driving connection substrate, a power source metal block, a first driving gate metal post, second driving gate metal posts, a silicon carbide bare chip, an insulation structure and the like. A three-dimensional integrated half-bridge structure is adopted to greatly reduce corresponding parasitic parameters.
    Type: Application
    Filed: May 22, 2020
    Publication date: December 10, 2020
    Inventors: Laili WANG, Xiaodong HOU, Cheng ZHAO, Jianpeng WANG, Dingkun MA, Chengzi YANG, Xu YANG
  • Publication number: 20200332311
    Abstract: The present invention relates to increasing bioproduct yield in plants. In particular, the invention relates increasing the yield of bioproduct synthesized by a plant per unit mass of plant biomass. The bioproduct can be a carbon-based bioproduct, specifically it may be a terpene, and more specifically it may be squalene.
    Type: Application
    Filed: January 12, 2018
    Publication date: October 22, 2020
    Inventors: Shuhua Yuan, Cheng Zhao
  • Patent number: 10761385
    Abstract: A liquid crystal on silicon (LCOS) panel comprises: a silicon substrate having silicon circuit within the silicon substrate; a plurality of metal electrodes disposed on the silicon substrate, where the plurality of metal electrodes are periodically formed on the silicon substrate; a dielectric material disposed in and filling gaps between adjacent metal electrodes; and an oxide layer disposed on the plurality of metal electrodes and the dielectric material in the gaps between adjacent metal electrodes; where the refractive index of the dielectric material is higher than the refractive index of the oxide layer.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: September 1, 2020
    Assignee: OmniVision Technologies, Inc.
    Inventors: Ming Zhang, Libo Weng, Cheng Zhao, Yin Qian, Chia-Chun Miao, Zhiqiang Lin, Dyson H. Tai
  • Publication number: 20200179979
    Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.
    Type: Application
    Filed: February 13, 2019
    Publication date: June 11, 2020
    Inventors: Yu-Feng JIN, Sheng-Lin MA, Qian-Cheng ZHAO, Yi-Hsiang CHIU, Huan LIU, Hung-Ping LEE, Dan GONG
  • Publication number: 20200164406
    Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. Rhe ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.
    Type: Application
    Filed: February 13, 2019
    Publication date: May 28, 2020
    Inventors: Yu-Feng JIN, Sheng-Lin MA, Qian-Cheng ZHAO, Yi-Hsiang CHIU, Huan LIU, Hung-Ping LEE, Dan GONG
  • Patent number: 10665626
    Abstract: An image sensor comprises a first photodiode and a second photodiode having a smaller full-well capacitance than the first photodiode, wherein the second photodiode is adjacent to the first photodiode; a first micro-lens is disposed above the first photodiode and on an illuminated side of the image sensor; a second micro-lens is disposed above the second photodiode and on the illuminated side of the image sensor; and a coating layer disposed on both the first and second micro-lens, wherein the coating layer forms a flat top surface on the second micro-lens and a conformal coating layer on the first micro-lens.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: May 26, 2020
    Inventors: Cheng Zhao, Chen-Wei Lu, Zhiqiang Lin, Dyson Hsin-Chih Tai
  • Patent number: 10657349
    Abstract: An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: May 19, 2020
    Assignees: J-METRICS TECHNOLOGY CO., LTD., PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL
    Inventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Huan Liu, Yi-Hsiang Chiu
  • Publication number: 20190394389
    Abstract: An image sensor pixel array comprises a plurality of image pixel units to gather image information and a plurality of phase detection auto-focus (PDAF) pixel units to gather phase information. Each of the PDAF pixel units includes two of first image sensor pixels covered by a shared micro-lens. Each of the image pixel units includes four of second image sensor pixels adjacent to each other, wherein each of the second image sensor pixels is covered by an individual micro-lens. A coating layer is disposed on the micro-lenses and forms a flattened surface across the whole image sensor pixel array to receive incident light.
    Type: Application
    Filed: June 25, 2018
    Publication date: December 26, 2019
    Inventors: Chen-Wei Lu, Yin Qian, Dyson Tai, Chin Poh Pang, Boyang Zhang, Cheng Zhao