Abstract: A system capable of upgrading a firmware in the background and a method for upgrading a firmware in the background are provided. The method for upgrading the firmware in the background partitions the memory module of an electronic device, one user code sector is used to normally execute an initial firmware and an upgrade flow, and the other user code sector is used to store an upgrade firmware.

Abstract: A method for preparing an SCR catalyst may include: (1) placing a first aqueous solution containing a titanium oxide and a tungstate in an electric field environment, adjusting the pH value of the first aqueous solution, and adjusting the current direction of the electric field environment to obtain a first mixture; (2) providing a second mixture by, in the electric field environment, adding dropwise a second aqueous solution containing a soluble salt of one or more active components, a copper-organic polyamine complex and a dispersant to the first mixture, and adjusting the current direction; and (3) processing the second mixture to obtain the SCR catalyst. The one or more active components may be selected from Ce, Zr, Cu, Fe, Pr and Sc.

Abstract: A video transmission method and a system thereof are provided. The video transmission method includes: obtaining a first display timing setting parameter of one or more display devices. A total transmission bandwidth of the display device is calculated according to the first display timing setting parameter, and when the total transmission bandwidth is greater than a maximum transmission bandwidth between a video source and a conversion device, a second display timing setting parameter with a lower bandwidth is generated corresponding to the first display timing setting parameter. The video source transmits a video signal conforming to the second display timing setting parameter to the conversion device. The conversion device converts the second display timing setting parameter of the video signal back to the first display timing setting parameter. The video signal conforming to the first display timing setting parameter is transmitted to the corresponding display device.

Abstract: The present invention discloses a method and a process of producing ammonia from methane extracted from methane-hydrate at the site of methane-hydrate extraction. The method and the process comprise coupled chemical reactions. During the first reaction, carbon dioxide reacts methane-hydrate to produce carbon-dioxide-hydrate and methane: carbon dioxide+methane-hydrate?carbon-dioxide-hydrate+methane (CO2+CH4-hydrate?CO2-hydrate+CH4). The produced methane is reacted with water to produced carbon dioxide and hydrogen via the second reaction: methane+water?carbon dioxide+hydrogen (CH4+2H2O?CO2+4H2). One embodiment of the second reaction is a combination of the methane steam reforming reaction (CH4+H2O?CO+3H2) and the water-gas shift reaction (CO+H2O?CO2+H2), both are widely known in the art. The carbon dioxide produced in the second reaction is recycled and used for the first reaction.

Abstract: A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.

Abstract: Provided is a planar power module with a spatially interleaved structure, including a top power substrate, a bottom power substrate arranged opposite to the top power substrate, and a plurality of interleaved switch units configured between the top power substrate and the bottom power substrate; wherein adjacent interleaved switch units are electrically connected through a current commutator so that the interleaved switch units form spatial position interleaving. Problems of uneven parallel currents and uneven heat dissipation in the power module are solved.

Abstract: A video transmission method and a system thereof are provided. The video transmission method includes: obtaining a first display timing setting parameter of one or more display devices. A total transmission bandwidth of the display device is calculated according to the first display timing setting parameter, and when the total transmission bandwidth is greater than a maximum transmission bandwidth between a video source and a conversion device, a second display timing setting parameter with a lower bandwidth is generated corresponding to the first display timing setting parameter. The video source transmits a video signal conforming to the second display timing setting parameter to the conversion device. The conversion device converts the second display timing setting parameter of the video signal back to the first display timing setting parameter. The video signal conforming to the first display timing setting parameter is transmitted to the corresponding display device.

Abstract: A containing module includes a connection casing, a tubular member, and first and second connection members. A tubular structure extends inwardly from a first end portion of the connection casing and has first and second guide portions. The first guide portion extends inwardly from the tubular structure. The second guide portion extends from the first guide portion. The first and second connection members are pivoted to a second end portion of the connection casing. A protruding point protrudes from the tubular member corresponding to the first guide portion. The protruding point is movable along the first guide portion and the second guide portion.

Abstract: Light control for improved near infrared sensitivity and channel separation for an image sensor. In one embodiment, an image sensor includes: a plurality of photodiodes arranged in rows and columns of a pixel array; and a light filter layer having a plurality of light filters configured over the plurality of photodiodes. The light filter layer has a first side facing the plurality of photodiodes and a second side facing away from the first side. The image sensor also includes a color filter layer having a plurality of color filters configured over the plurality of photodiodes. The color filter layer has a first surface facing the second side of the light filter layer and a second surface facing away from the first layer. Individual micro-lenses are configured to direct incoming light through corresponding light filter and color filter onto the respective photodiode.

Abstract: Light control for improved near infrared sensitivity and channel separation for an image sensor. In one embodiment, an image sensor includes: a plurality of photodiodes arranged in rows and columns of a pixel array; and a light filter layer having a plurality of light filters configured over the plurality of photodiodes. The light filter layer has a first side facing the plurality of photodiodes and a second side facing away from the first side. The image sensor also includes a color filter layer having a plurality of color filters configured over the plurality of photodiodes. The color filter layer has a first surface facing the second side of the light filter layer and a second surface facing away from the first layer. Individual micro-lenses are configured to direct incoming light through corresponding light filter and color filter onto the respective photodiode.

Abstract: A wafer scale ultrasonic sensing device includes a substrate assembly, an ultrasonic component, a first protective layer, a first conductive circuit, a second conductive circuit, a second protective layer, a conductive material, electrical connection layers, and soldering portions. The substrate assembly includes a first wafer and a second wafer, and the second wafer covers a groove on the first wafer to define a hollow chamber. The first wafer, the second wafer, and the first protective layer are coplanar with the first conductive circuit on a first side surface and coplanar with the second conductive circuit on a second side surface. The second protective layer has an opening, where the conductive material is in the opening and is in contact with the ultrasonic component. The electrical connection layers are on the first side surface and the second side surface, and the soldering portions are respectively connected to the electrical connection layers.

Abstract: An image sensor pixel array comprises a plurality of image pixel units to gather image information and a plurality of phase detection auto-focus (PDAF) pixel units to gather phase information. Each of the PDAF pixel units includes two of first image sensor pixels covered by a shared micro-lens. Each of the image pixel units includes four of second image sensor pixels adjacent to each other, wherein each of the second image sensor pixels is covered by an individual micro-lens. A coating layer is disposed on the micro-lenses and forms a flattened surface across the whole image sensor pixel array to receive incident light.

Abstract: The present invention relates to a three-dimensional integrated package device for a high-voltage silicon carbide power module, comprising a source substrate, first chip submodules, a first driving terminal, a first driving substrate, a ceramic housing, a metal substrate, a water inlet, a water outlet, second chip submodules, a second driving terminal, a second driving substrate and a drain substrate from top to bottom; and each first chip submodule is composed of a driving connection substrate, a power source metal block, a first driving gate metal post, second driving gate metal posts, a silicon carbide bare chip, an insulation structure and the like. A three-dimensional integrated half-bridge structure is adopted to greatly reduce corresponding parasitic parameters.

Abstract: The present invention relates to increasing bioproduct yield in plants. In particular, the invention relates increasing the yield of bioproduct synthesized by a plant per unit mass of plant biomass. The bioproduct can be a carbon-based bioproduct, specifically it may be a terpene, and more specifically it may be squalene.

Abstract: A liquid crystal on silicon (LCOS) panel comprises: a silicon substrate having silicon circuit within the silicon substrate; a plurality of metal electrodes disposed on the silicon substrate, where the plurality of metal electrodes are periodically formed on the silicon substrate; a dielectric material disposed in and filling gaps between adjacent metal electrodes; and an oxide layer disposed on the plurality of metal electrodes and the dielectric material in the gaps between adjacent metal electrodes; where the refractive index of the dielectric material is higher than the refractive index of the oxide layer.

Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. Rhe ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

Abstract: An image sensor comprises a first photodiode and a second photodiode having a smaller full-well capacitance than the first photodiode, wherein the second photodiode is adjacent to the first photodiode; a first micro-lens is disposed above the first photodiode and on an illuminated side of the image sensor; a second micro-lens is disposed above the second photodiode and on the illuminated side of the image sensor; and a coating layer disposed on both the first and second micro-lens, wherein the coating layer forms a flat top surface on the second micro-lens and a conformal coating layer on the first micro-lens.

Abstract: An ultrasonic module and a manufacturing method for ultrasonic module are provided. The ultrasonic module includes a substrate, a composite layer, and a covering layer. The substrate has an upper surface. The composite layer has a top surface, a bottom surface, and a recessed surface recessed toward the bottom surface. The bottom surface is on the upper surface of the substrate. One or more space is formed between the recessed surface and the upper surface. The composite layer has one or more first groove extending from the top surface toward the recessed surface. The first groove separates the composite layer into a circuit structure and an ultrasonic structure connected to the circuit structure. The covering layer is assembled on the top surface of the composite layer.

Abstract: An image sensor pixel array comprises a plurality of image pixel units to gather image information and a plurality of phase detection auto-focus (PDAF) pixel units to gather phase information. Each of the PDAF pixel units includes two of first image sensor pixels covered by a shared micro-lens. Each of the image pixel units includes four of second image sensor pixels adjacent to each other, wherein each of the second image sensor pixels is covered by an individual micro-lens. A coating layer is disposed on the micro-lenses and forms a flattened surface across the whole image sensor pixel array to receive incident light.