Patents by Inventor Cheng Zhao

Cheng Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11923602
    Abstract: An outdoor customer premises equipment (CPE) is disclosed. The out door CPE may include: a main body which includes a printed circuit board (PCB), a heat sink, a heater assembly, a SIM card holder, a radio frequency (RF) cable and a fifth generation (5G) communication module; and an antenna module which is detachably connected to the main body and includes a cable interface connected to the RF cable, where the antenna module is a high-gain antenna module or a low-gain antenna module.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: March 5, 2024
    Assignee: XI'AN ZHONGXING NEW SOFTWARE CO., LTD.
    Inventors: Yan Li, Yigang Feng, Cheng Zhao
  • Publication number: 20240074282
    Abstract: The present application provides a displaying base plate and a displaying device, which relates to the technical field of displaying. The displaying device can ameliorate the problem of screen greening caused by electrostatic charges, thereby improving the effect of displaying. The displaying base plate includes an active area and a non-active area connected to the active area, the non-active area includes an edge region and a first-dam region, and the first-dam region is located between the active area and the edge region; the displaying base plate further includes: a substrate; an anti-static layer disposed on the substrate, wherein the anti-static layer is located at least within the edge region; and a driving unit and a touch unit that are disposed on the substrate, wherein the driving unit is located within the active area.
    Type: Application
    Filed: August 23, 2022
    Publication date: February 29, 2024
    Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yu Zhao, Yong Zhuo, Wei He, Yanxia Xin, Qun Ma, Xiping Li, Jianpeng Liu, Kui Fang, Cheng Tan, Xueping Li, Yihao Wu, Xiaoyun Wang, Haibo Li, Xiaoyan Yang
  • Patent number: 11917344
    Abstract: Disclosed are an interactive information processing method, an electronic device and a storage medium. The method includes establishing a position correspondence between a display text generated based on a multimedia data stream and the multimedia data stream; and presenting the display text and the multimedia data stream corresponding to the display text based on the position correspondence.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: February 27, 2024
    Assignee: BEIJING ZITIAO NETWORK TECHNOLOGY CO., LTD.
    Inventors: Jingsheng Yang, Kojung Chen, Jinghui Liu, Mengyuan Xiong, Xiang Zheng, Cheng Qian, Xiao Han, Li Zhao
  • Patent number: 11915387
    Abstract: Implementations relate to crop yield prediction at the field- and pixel-level. In various implementations, a first temporal sequence of high-elevation digital images may be obtained that capture a first geographic area and are acquired over a first predetermined time interval while the first geographic area includes a particular crop. A first plurality of other data points may also be obtained that influence a ground truth crop yield of the first geographic area after the first predetermined time interval. The first plurality of other data points may be grouped into temporal chunks corresponding temporally with respective images of the first temporal sequence. The first temporal sequence and the temporal chunks of the first plurality of other data points may be applied, e.g., iteratively, as input across a machine learning model to estimate a crop yield of the first geographic area at the end of the first predetermined time interval.
    Type: Grant
    Filed: April 21, 2023
    Date of Patent: February 27, 2024
    Assignee: MINERAL EARTH SCIENCES LLC
    Inventors: Cheng-en Guo, Wilson Zhao, Jie Yang, Zhiqiang Yuan
  • Patent number: 11896351
    Abstract: A fiber-optic sensor matt detects movements of a person on the matt that cause microbending of a fiber-optic cable that is arranged into a symmetric pair of radial ring groups within the matt. There are no cross-over points or overlapping of the fiber-optic cable within the symmetric pair of radial ring groups that could cause fiber wear and noisy readings. Microbending of the fiber-optic cable pressed into a mesh modulates the light intensity received, which is analyzed to extract both respiration and heart BallistoCardioGram (BCG) waveforms by convolution with Daubechies dB5 wavelet and scaling functions. The reconstructed level-4 detail waveform is output as the extracted BCG, while the reconstructed level-6 approximation waveform is output as the extracted respiration waveform. Respiration and heart rates and variations can be generated from the extracted waveforms. An integrated Fast Wavelet Transform (FWT) using dB5 wavelet thus generates both respiration rate and heart rate.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: February 13, 2024
    Assignee: Hong Kong Applied Science and Technology Research Institute Company Limited
    Inventors: Qian Cheng Zhao, Tsz Chung Leung, Man Sang Kwok
  • Publication number: 20240019078
    Abstract: Disclosed are a mounting bracket for a customer premise equipment and a customer premise equipment. The mounting bracket includes a bracket base (1) and a fixing frame (2). The bracket base (1) is fixedly connected to the fixing frame (2). An accommodation cavity is formed in the base (1). A bottom of the accommodation cavity is in contact with a bottom of the mounting end. A plurality of first fasteners (11) extending towards a center of the accommodation cavity are provided on a side wall of the accommodation cavity. At least two of the plurality of first fasteners (11) are provided opposite to each other. A gap is reserved between the first fasteners (11) and the bottom of the accommodation cavity. A height of the gap is adapted to a thickness of a second fastener on the mounting end.
    Type: Application
    Filed: February 24, 2022
    Publication date: January 18, 2024
    Applicant: ZTE CORPORATION
    Inventors: Fan Liu, Danni Wang, Cheng Zhao, Qingyi Tong
  • Publication number: 20230342256
    Abstract: The present disclosure relates to an incremental backup method and system for a CAD engineering data file, and the method includes: chunking historical CAD engineering data based on a sliding window approach, to determine a first data block group; calculating a first hash fingerprint value separately for each data block in the first data block group; chunking, based on the sliding window approach, CAD engineering data to be backed up, to determine a second data block group; calculating a second hash fingerprint value separately for each data block in the second data block group; and determining a backup status of the data block in the second data block group based on the first hash fingerprint value and the second hash fingerprint value. The present disclosure resolves a problem that a long time is occupied when a large-scale engineering CAD data file is saved by applying a full backup.
    Type: Application
    Filed: April 24, 2023
    Publication date: October 26, 2023
    Inventors: Ketai HE, Xiaowei MENG, Yanxi LI, Dongmei ZHU, Cheng ZHAO
  • Publication number: 20230115125
    Abstract: The present disclosure provides a video and audio signal processing chip, a video and audio signal processing device including the same, and a video and audio signal processing method. The video and audio signal processing chip includes a signal detection module, a storing unit and a controller. The signal detection module is configured to detect and store video and audio signals. The controller is configured to: transfer the video and audio signals from the signal detection module to the storing unit; and transmit the video and audio signals stored in the storing unit to a host.
    Type: Application
    Filed: October 11, 2022
    Publication date: April 13, 2023
    Inventors: RONG CHEN, YUE CHENG ZHAO, HAO ZHOU, TAO XU
  • Patent number: 11590536
    Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: February 28, 2023
    Assignees: PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., LTD.
    Inventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee, Dan Gong
  • Publication number: 20230053800
    Abstract: A battery module includes batteries, bus bars, a flexible flat cable and connecting terminals. Each battery includes a first electrode and a second electrode. Each bus bar connects the first electrode of one battery with the second electrode of another battery. At least one of the bus bar is arranged obliquely. The flexible flat cable includes a number of wires arranged in parallel. Each connecting terminal includes a first connecting portion connected to a corresponding bus bar and a second connecting portion connected to a corresponding wire of the flexible flat cable. Compared with the prior art, at least one of the bus bars of the present disclosure is arranged obliquely, thereby reducing the difficulty of arranging the batteries. In addition, by providing the first connecting portion and the second connecting portion, it is convenient to realize the assembly of the battery module.
    Type: Application
    Filed: May 11, 2022
    Publication date: February 23, 2023
    Applicant: LUXSHARE-ICT CO., LTD.
    Inventors: Chuntai LEE, Cheng ZHAO
  • Publication number: 20230014827
    Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. Rhe ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.
    Type: Application
    Filed: September 15, 2022
    Publication date: January 19, 2023
    Inventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee, Dan Gong
  • Publication number: 20230020875
    Abstract: Disclosed is wristband and wrist wearable device, including: a wristband body portion, one end is connected to one end of a device body of a wrist wearable device, and the other end is a free end; and a memory metal portion, which is arranged on the wristband body portion and has an arc-shaped memory state in a natural state, so that the wristband body portion is naturally maintained in an arc shape. The memory metal portion comprises a strip-shaped memory metal piece including a first metal segment, a second metal segment, and a third metal segment that are sequentially connected, the first metal segment and the third metal segment extend along a length direction of the wristband body portion in parallel, the second metal segment is arranged at the free end of the wristband body portion and is provided with at least one bent portion.
    Type: Application
    Filed: December 29, 2021
    Publication date: January 19, 2023
    Inventors: Jianning ZHANG, Qingru SHAO, Huaying FENG, Cheng ZHAO, Ying ZHONG, Rui GUO, Yao XUE, Chao ZHANG, Yawei LI
  • Patent number: 11545113
    Abstract: A display control integrated circuit (IC) applicable to performing multi-display processing in a display device includes multiple sub-circuits such as a Multi-Stream Transport (MST) stream splitting module, multiple video format conversion circuits, a multiplexer and a video combination module for generating a combined picture for being displayed. The display control IC may utilize at least one additional data path coupled to at least one predetermined sub-circuit among the multiple sub-circuits to obtain at least one signal, and output any signal of the at least one signal through a video output terminal of the display control IC and a video output port of the display device to be a video output signal for further use, where the at least one predetermined sub-circuit include at least one of the MST stream splitting module and the multiplexer.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: January 3, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Cheng-Hung Wu, Yue Cheng Zhao, Tao Xu
  • Patent number: 11532557
    Abstract: Provided is a planar power module with a spatially interleaved structure, including a top power substrate, a bottom power substrate arranged opposite to the top power substrate, and a plurality of interleaved switch units configured between the top power substrate and the bottom power substrate; wherein adjacent interleaved switch units are electrically connected through a current commutator so that the interleaved switch units form spatial position interleaving. Problems of uneven parallel currents and uneven heat dissipation in the power module are solved.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 20, 2022
    Assignee: XI'AN JIAOTONG UNIVERSITY
    Inventors: Laili Wang, Fengtao Yang, Wei Mu, Dingkun Ma, Cheng Zhao, Jianpeng Wang
  • Patent number: 11478822
    Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. The ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: October 25, 2022
    Assignees: J-Metrics Technology Co., Ltd., Peking University Shenzhen Graduate School
    Inventors: Yu-Feng Jin, Sheng-Lin Ma, Qian-Cheng Zhao, Yi-Hsiang Chiu, Huan Liu, Hung-Ping Lee, Dan Gong
  • Patent number: 11474805
    Abstract: A system capable of upgrading a firmware in the background and a method for upgrading a firmware in the background are provided. The method for upgrading the firmware in the background partitions the memory module of an electronic device, one user code sector is used to normally execute an initial firmware and an upgrade flow, and the other user code sector is used to store an upgrade firmware.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: October 18, 2022
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Wen-Juan Ni, Hao Zhou, Yue-Cheng Zhao, Rong Chen
  • Patent number: 11421023
    Abstract: Disclosed herein are antibodies and methods of using said antibodies to detect Golgi protein 73 (GP73) and fucosylated GP73 in a sample.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: August 23, 2022
    Assignee: ABBOTT LABORATORIES
    Inventors: Bailin Tu, Robert N. Ziemann, Bryan C. Tieman, Philip M. Hemken, Carol S. Ramsay, Carolyn J. Strobel, David J. Hawksworth, Larry G. Birkenmeyer, Cheng Zhao, Susan E. Brophy, Barry L. Dowell, Anthony S. Muerhoff
  • Patent number: D966840
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: October 18, 2022
    Inventor: Cheng Zhao
  • Patent number: D1008231
    Type: Grant
    Filed: August 8, 2023
    Date of Patent: December 19, 2023
    Assignee: FUJIAN EASTWEST LIFEWIT TECHNOLOGY CO., LTD
    Inventor: Cheng Zhao
  • Patent number: D1010025
    Type: Grant
    Filed: July 20, 2023
    Date of Patent: January 2, 2024
    Assignee: FUJIAN EASTWEST LIFEWIT TECHNOLOGY CO., LTD
    Inventor: Cheng Zhao