Abstract: A method for forming a semiconductor structure includes providing a semiconductor substrate; forming a plurality of fins on the semiconductor substrate; forming a plurality of gate structures on the plurality of fins and sidewall spacers on side surfaces of the gate structures; forming a first dielectric layer on the semiconductor substrate; recessing the gate structures to form a plurality of trenches on top surfaces of the gate structures; forming a mask material layer filling the trenches and on the first dielectric layer; forming a protective layer on the top surfaces of the remaining gate structures and a mask layer on a portion of the first dielectric layer between adjacent gate structures by etching the mask material layer; forming contact through-holes in the first dielectric layer between adjacent gates structure at both sides of the mask layer; and forming a metal contact via in each of the contact through-holes.

Abstract: Various embodiments provide semiconductor devices. A base including a substrate and an interlayer dielectric layer is provided. The base has a first region and a second region that have an overlapped third region. A mask layer having a stacked structure is formed on the interlayer dielectric layer at the overlapped third region. Using the mask layer as an etching mask, the interlayer dielectric layer at the first region at both sides of the mask layer is etched, to expose the substrate and form a first contact via at the first region. Using the mask layer as an etching mask, the interlayer dielectric layer at the second region at both sides of the mask layer is etched, to form a second contact via at the second region. A conductive layer is formed to fill the first contact via and the second contact via.

Abstract: Various embodiments provide semiconductor devices and methods for forming the same. A base including a substrate and an interlayer dielectric layer is provided. The base has a first region and a second region that have an overlapped third region. A mask layer having a stacked structure is formed on the interlayer dielectric layer at the overlapped third region. Using the mask layer as an etching mask, the interlayer dielectric layer at the first region at both sides of the mask layer is etched, to expose the substrate and form a first contact via at the first region. Using the mask layer as an etching mask, the interlayer dielectric layer at the second region at both sides of the mask layer is etched, to form a second contact via at the second region. A conductive layer is formed to fill the first contact via and the second contact via.

Abstract: An LED lamp comprises one or more LEDs and an LED driver receiving an input signal from a dimmer switch indicative of an amount of dimming for the LED lamp. The LED driver controls regulated current through the one or more LEDs based on the input signal such that an output light intensity of the one or more LEDs substantially corresponds to the amount of dimming for the LED lamp. A regulated output provides operating power for the LED driver. A controller regulates the regulated output to power the LED driver. The controller selects a power source for charging the regulated output from two or more power sources, and the regulated output is charged using the power source selected by the controller.

Abstract: A method is provided for fabricating a semiconductor structure. The method includes providing a semiconductor substrate; forming an initial metal layer; simultaneously forming a plurality of discrete first metal layers and openings by etching the initial metal layer; forming a plurality of sidewalls covering the side surface of the first metal layers; and forming a plurality of second metal layers to fill the openings.

Abstract: The disclosed subject matter provides a semiconductor structure and fabrication method thereof. In a semiconductor structure, a dielectric layer, a plurality of discrete gate structures, and a plurality of sidewall spacers are formed on a semiconductor substrate. The plurality of discrete gate structures and sidewall spacers are formed in the dielectric layer, and a sidewall spacer is formed on each side of each gate structure. A top portion of each gate structure and a top portion of the dielectric layer between neighboring sidewall spacers of neighboring gate structures are removed. A protective layer is formed on each of the remaining dielectric layer and the remaining gate structures. Contact holes are formed on the semiconductor substrate, between neighboring sidewall spacers, and on opposite sides of the protective layer on the remaining dielectric layer. A metal plug is formed in each contact hole.

Abstract: A method for manufacturing a semiconductor device includes providing a substrate structure having an action region and a gate structure having a gate dielectric layer, a gate, a hardmask. The method also includes forming a first dielectric layer on the gate structure, forming a second dielectric layer on the first dielectric layer, performing a surface treatment on the second dielectric layer so that the upper surface of the second dielectric layer is flush with the upper surface of the mask member, which has a first recess is in its middle portion, forming a third dielectric layer on the second dielectric layer covering the mask member and selectively etching the third dielectric layer and the second dielectric layer relative to the first dielectric layer and the hardmask to form an opening adjacent to the gate structure and exposing the first dielectric layer on sidewalls of the gate structure.

Abstract: The disclosed subject matter provides a Fin-FET with a thinned-down InP layer and thinning-down method thereof. In a Fin-FET, the fin structure is made of InGaAs and an InP layer is formed to cover the fin structure. The InP layer is obtained from an initial InP layer formed on the fin structure through a thinning down process including converting a surface portion of the InP layer into a Phosphorus-rich layer and removing the Phosphorus-rich layer. The thickness of the ultimately-formed InP layer is less than or equal to 1 nm. According to the disclosed method, the InP layer in the Fin-FET may be easily thinned down, and during the thinning-down process, contamination may be avoided.

Abstract: The disclosed subject matter provides a semiconductor structure and fabrication method thereof. In a semiconductor structure, a dielectric layer, a plurality of discrete gate structures, and a plurality of sidewall spacers are formed on a semiconductor substrate. The plurality of discrete gate structures and sidewall spacers are formed in the dielectric layer, and a sidewall spacer is formed on each side of each gate structure. A top portion of each gate structure and a top portion of the dielectric layer between neighboring sidewall spacers of neighboring gate structures are removed. A protective layer is formed on each of the remaining dielectric layer and the remaining gate structures. Contact holes are formed on the semiconductor substrate, between neighboring sidewall spacers, and on opposite sides of the protective layer on the remaining dielectric layer. A metal plug is formed in each contact hole.

Abstract: A method is provided for fabricating a semiconductor structure. The method includes providing a semiconductor substrate; forming an initial metal layer; simultaneously forming a plurality of discrete first metal layers and openings by etching the initial metal layer; forming a plurality of sidewalls covering the side surface of the first metal layers; and forming a plurality of second metal layers to fill the openings.

Abstract: A method for fabricating a FinFET structure comprises providing a semiconductor substrate; forming a hard mask layer on the semiconductor substrate; forming a dummy gate structure having a dummy gate, a first sidewall spacer and a second sidewall spacer; removing the dummy gate to form a first trench; forming first sub-fins in the semiconductor substrate under the hard mask layer in the first trench; forming a first metal gate structure in the first trench; removing the first sidewall spacer to form a second trench; forming second sub-fins in the semiconductor substrate under the hard mask layer in the second trench; forming a second metal gate structure in the second trench; removing the second sidewall spacer to form a third trench; forming third sub-fins in the semiconductor substrate under the hard mask layer in the third trench; and forming a third metal gate structure in the third trench.

Abstract: A method for forming an interconnect structure is provided. The method includes providing a substrate with a surface; and forming a metal layer covering the surface of the substrate and with a desired grain size to reduce grain boundary scattering of the interconnect structure subsequently formed with the metal layer. The method also includes etching the metal layer to form a plurality of metal lines on the surface of the substrate and a plurality of metal pillars on each of the plurality of the metal lines of the interconnect structure; and forming a dielectric layer covering the surface of the substrate, surfaces of the metal lines, and side surfaces of the metal pillars.

Abstract: An LED lamp comprises one or more LEDs and an LED driver receiving an input signal from a dimmer switch indicative of an amount of dimming for the LED lamp. The LED driver controls regulated current through the one or more LEDs based on the input signal such that an output light intensity of the one or more LEDs substantially corresponds to the amount of dimming for the LED lamp. A regulated output provides operating power for the LED driver. A controller regulates the regulated output to power the LED driver. The controller selects a power source for charging the regulated output from two or more power sources, and the regulated output is charged using the power source selected by the controller.

Abstract: An LED lamp comprises one or more LEDs and an LED driver receiving an input signal from a dimmer switch indicative of an amount of dimming for the LED lamp. The LED driver controls regulated current through the one or more LEDs based on the input signal such that an output light intensity of the one or more LEDs substantially corresponds to the amount of dimming for the LED lamp. A regulated output provides operating power for the LED driver. A controller regulates the regulated output to power the LED driver. The controller selects a power source for charging the regulated output from two or more power sources, and the regulated output is charged using the power source selected by the controller.

Abstract: A method for fabricating a semiconductor structure includes: providing a substrate with a dielectric layer and a passivation layer formed on the substrate; forming a via through the dielectric layer and exposing the substrate; forming a first conductive layer to fill the via with a top surface of the first conductive layer leveled with a top surface of the passivation layer; forming a patterned layer with an opening on the passivation layer. The opening is located above the first conductive layer with a dimension larger than the dimension of the via. The method also includes forming a trench in the dielectric layer; forming a second conductive layer to fill the trench and to electrically connect to the first conductive layer; then removing a portion of the second conductive layer, the patterned layer, and the passivation layer to make a top surface of the second conductive layer level with a top surface of the dielectric layer.

Abstract: A method for fabricating a FinFET structure comprises providing a semiconductor substrate; forming a hard mask layer on the semiconductor substrate; forming a dummy gate structure having a dummy gate, a first sidewall spacer and a second sidewall spacer; removing the dummy gate to form a first trench; forming first sub-fins in the semiconductor substrate under the hard mask layer in the first trench; forming a first metal gate structure in the first trench; removing the first sidewall spacer to form a second trench; forming second sub-fins in the semiconductor substrate under the hard mask layer in the second trench; forming a second metal gate structure in the second trench; removing the second sidewall spacer to form a third trench; forming third sub-fins in the semiconductor substrate under the hard mask layer in the third trench; and forming a third metal gate structure in the third trench.

Abstract: The disclosed subject matter provides a Fin-FET with a thinned-down InP layer and thinning-down method thereof. In a Fin-FET, the fin structure is made of InGaAs and an InP layer is formed to cover the fin structure. The InP layer is obtained from an initial InP layer formed on the fin structure through a thinning down process including converting a surface portion of the InP layer into a Phosphor-rich layer and removing the Phosphor-rich layer. The thickness of the ultimately-formed InP layer is less than or equal to 1 nm. According to the disclosed method, the InP layer in the Fin-FET may be easily thinned down, and during the thinning-down process, contamination may be avoided.

Abstract: A method for fabricating a FinFET structure comprises providing a semiconductor substrate; forming a hard mask layer on the semiconductor substrate; forming a dummy gate structure having a dummy gate, a first sidewall spacer and a second sidewall spacer; removing the dummy gate to form a first trench; forming first sub-fins in the semiconductor substrate under the hard mask layer in the first trench; forming a first metal gate structure in the first trench; removing the first sidewall spacer to form a second trench; forming second sub-fins in the semiconductor substrate under the hard mask layer in the second trench; forming a second metal gate structure in the second trench; removing the second sidewall spacer to form a third trench; forming third sub-fins in the semiconductor substrate under the hard mask layer in the third trench; and forming a third metal gate structure in the third trench.

Abstract: A capacitive pressure sensor is provided. The capacitive pressure sensor includes a substrate; and a first electrode formed in one surface of the substrate and vertical to the surface of the substrate. The capacitive pressure sensor also includes a second electrode with a portion facing the first sub-electrode, a portion facing the second sub-electrode and a portion formed in the other surface of the substrate. Further, the capacitive pressure sensor includes a first chamber between the first electrode and the second electrode and a second chamber formed in the second electrode. Further, the pressure sensor also includes a first sealing layer formed on the second electrode; and a second sealing layer formed on the other surface of the substrate.

Abstract: A method for forming a semiconductor structure including providing a substrate; forming a dielectric layer covering a surface of the substrate; forming a plurality of first through holes exposing the surface of the substrate by etching the dielectric layer; forming first conductive vias by filling the plurality of first through holes using a first metal material and first conductive lines on the first conductive vias also using the first metal material; forming a plurality of second through holes exposing the surface of the substrate by etching the dielectric layer; and forming second conductive vias by filling the plurality of second through holes using a second metal material, different from the first metal material, and second conductive lines over the second conductive vias also using the second metal material, wherein the second metal material has a different anti-electromigration ability from the first metal material.