Abstract: A vertical probe includes opposite first and third sides, and opposite second and fourth sides. The third and fourth sides extend in a planar manner from a body to a tip portion. The first and second sides include first and second upper plane segments at the body, first and second transition segments at the tip portion, and first and second lower plane segments closer to the third and fourth sides than the first and second upper plane segments are, respectively. The first and second transition segments gradually approach the third and fourth sides as they extend from the first and second upper plane segments to the first and second lower plane segments. The first transition and lower plane segments are realized by laser processing. The vertical probe can contact small conductive contacts with good current resistance, structural strength, lifespan, and processing accuracy. When applied to a probe head, breaking or shifting position of the tip portion due to vertical movement can be avoided.

Abstract: The present invention provides a circuit structure and a card-shape device comprising the same. The card-shape device includes a first plate, a second plate, a frame and the circuit structure. The frame is disposed between the first plate and the second plate. An accommodating space is defined by the first plate, the second plate and the frame. The circuit structure is disposed in the accommodating space. The circuit structure includes a flexible printed circuit and an interface element. The flexible printed circuit has a first recess and first electrical contacts disposed around the first recess. The interface element has a body, an interface disposed on the body and second electrical contacts disposed on the body and electrically connected with the interface. The interface of the interface element is exposed to the first recess of the flexible printed circuit when the first electrical contacts electrically connect to the second electrical contacts.

Abstract: An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.

Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.

Abstract: A probe card includes a structure stiffener unit including a base with a lower surface where central and peripheral supporting elements protrude out and a main circuit board is fixed, a space transformer and a probe head disposed thereunder, which are disposed to the supporting elements by bolts and defined with central and peripheral regions located correspondingly to the central and peripheral supporting elements respectively, and a metal supporting member fixed on the space transformer in a direct contact manner and located correspondingly to the central region. The supporting member has a lower surface coplanar with the lower end surface of the peripheral supporting element, which is abutted on the space transformer, and an upper surface against which the central supporting element is abutted. The space transformer has great structural strength, flatness and heat dissipation effect for satisfying the large-area requirement and great electrical property testing stability.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.

Abstract: An electronic device for switching a standby power of a motherboard includes a universal serial bus (USB) connector, electrically connected to the motherboard, configured to connect an external device; a device detecting module, coupled to the USB connector, configured to determine a power control signal according to a voltage level of the USB connector; and an output switching control module, coupled to the device detecting module and the USB connector, configured to determine whether to cut off the standby power provided by the motherboard to the USB connector or not according to the power control signal.

Abstract: A detection device adapted to a connector is provided herein. The connecter includes a first pin and a second pin, and the first pin and the second pin are physically separated and coupled to a first power respectively. The detection device includes a first transistor, a first resistor, a second transistor, and a bias circuit. The first transistor is coupled between the first pin and the first power. The first resistor is coupled between a gate terminal of the first transistor and the first power. A detection signal is generated at the gate terminal of the first transistor. The second transistor is coupled between the gate terminal of the first transistor and a second power. The bias circuit is coupled between a gate terminal of the second transistor and the first pin.

Abstract: A fingerprint sensing apparatus including a first substrate, a light sensing structure, a second substrate, a lens layer, a filler, and a first light shielding layer is provided. The light sensing structure is disposed on a sensing area of the first substrate. The lens layer is disposed on the second substrate. The lens layer has multiple first convex portions and a first concave portion. The filler is disposed between the lens layer and the light sensing structure. The refractive index of the filler is greater than the refractive index of the lens layer. The first light shielding layer is disposed between the second substrate and the lens layer. A solid of the first light shielding layer overlaps the first convex portions of the lens layer. An opening of the first light shielding layer overlaps the first concave portion of the lens layer.

Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.

Abstract: A head cap with channel identification includes a head cap, channel identification module, a controlling module, and electrical stimulation modules. The head cap includes the channels therein, and the head cap includes brain regions corresponding to the brain areas of the human being. The electrical stimulation modules disposed in the channels, and the channel identification modules disposed around the peripheral of the channels. The controlling module is electrically coupled to the channel identification modules. When the electrical stimulation modules disposed in some of the channels, the channel identification modules around the peripheral of the channels and the electrical stimulation module are constituted a circuit conduction status or a short circuit status, then the channel identification module transmits a signal to the controlling module to determine the desired sites of the electrical stimulation module where is corresponding to one of the brain areas of the human being according to the signal.

Abstract: A fingerprint sensing apparatus including a first substrate, a light sensing structure, a second substrate, a lens layer, a filler, and a first light shielding layer is provided. The light sensing structure is disposed on a sensing area of the first substrate. The lens layer is disposed on the second substrate. The lens layer has multiple first convex portions and a first concave portion. The filler is disposed between the lens layer and the light sensing structure. The refractive index of the filler is greater than the refractive index of the lens layer. The first light shielding layer is disposed between the second substrate and the lens layer. A solid of the first light shielding layer overlaps the first convex portions of the lens layer. An opening of the first light shielding layer overlaps the first concave portion of the lens layer.

Abstract: An electron-device protection casing using magnetic connection includes a protection casing for receiving a tablet form electronic device; a device end connecting unit installed in the protection casing for being connected to the electronic device. The device end connecting unit further includes at least one device end magnetic unit which is positioned in the body; the device end magnetic unit serves to be magnetically connected to an external device so that the external connecting unit can be fixedly connected to the external device. The present invention further includes an intermediate connecting unit which further has at least one intermediate magnetic unit positioned for being magnetically connected to the device end magnetic unit; the positions of the device end magnetic units are corresponding to those of the intermediate magnetic units so that the device end magnetic units are attracted by the intermediate magnetic unit.

Abstract: An electron-device protection casing using magnetic connection includes a protection casing for receiving a tablet form electronic device; a device end connecting unit installed in the protection casing for being connected to the electronic device. The device end connecting unit further includes at least one device end magnetic unit which is positioned in the body; the device end magnetic unit serves to be magnetically connected to an external device so that the external connecting unit can be fixedly connected to the external device. The present invention further includes an intermediate connecting unit which further has at least one intermediate magnetic unit positioned for being magnetically connected to the device end magnetic unit; the positions of the device end magnetic units are corresponding to those of the intermediate magnetic units so that the device end magnetic units are attracted by the intermediate magnetic unit.

Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.

Abstract: A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.