Abstract: A probe head includes a plurality of probes, an upper guide plate, and a lower guide plate. Each probe has a tip, a tail, and a body. The tip is configured to contact an electronic device under test. The body extends along a longitudinal axis between the tail and the tip and has a multilayer structure including a plurality of probe arms and at least one slit. The probe arms are arranged in a widthwise direction and separated by the at least one slit penetrating the body in a thickness direction. The probe arms converge at upper and lower key portions, which respectively correspond to guide holes of the upper and lower guide plates for accommodating the probe. At least one of the upper and lower key portions is located within the corresponding guide hole.

Abstract: A probe includes a probe tip configured to contact a corresponding pad on an electronic device under test during testing. The probe further includes a probe tail positioned opposite to the probe tip. Between the probe tip and the probe tail, the probe includes a probe body extending along a longitudinal axis. The probe body includes a slit extending along the longitudinal axis, thereby defining two probe arms separated by the slit. A transverse cross-section of the probe body, taken perpendicular to the longitudinal axis, has a width side and a thickness side, with the two probe arms arranged along the width side. Each of the two probe arms is formed with a bump structure within the slit, wherein the two bump structures face each other across the slit.

Abstract: A method of establishing a model for detecting atrial fibrillation (AF) and sleep apnea (SA) is implemented by a computer system that stores training electrocardiograms, and includes steps of: dividing the training electrocardiograms into training segments, each of which contains a common length of time of recorded electrical activity of a heart; for each of the training segments, labeling the training segment with a symptom indicator that indicates whether the training segment is related to AF and whether the training segment is related to SA; for each of the training segments, performing feature extraction on the training segment to obtain an entry of feature data; and establishing the model by using a machine learning algorithm based on the entries of feature data and the symptom indicators.

Abstract: A probe unit includes first and second probes of equal length. A probe body of at least one of the probes has a slot extending along a longitudinal direction thereof to define two slats. A total cross-sectional area of the slats of the first probe is greater than that of the second probe. Alternatively, the probe body of the second probe is solid, and the total cross-sectional area of the slats of the first probe is greater than the cross-sectional area of the solid probe body of the second probe. The slats are shaped in such a way that a contact force of the first probe is greater than that of the second probe, thereby meeting testing requirements of conductive contacts of different sizes on an electronic device under test, while reducing problems of different probe tip wear rates and excessive probe mark area ratio differences.

Abstract: A contact probe defined with widths and thicknesses along first and second horizontal axes respectively and cross-sectional areas perpendicularly to a vertical axis includes a body portion for being curved at least along the first horizontal axis while disposed between upper and lower die units, a probe tip for contacting a contact pad of a device under test, and a probe tail including a contact end portion with a contact end surface for contacting a contact pad of an interface board. The contact end portion is at least partially smaller in width and thickness than the body portion, so that the contact end surface has an area smaller than a cross-sectional area of the body portion, thereby capable of stable contact with the contact pad of the interface board and prevented from exceeding its edge, obtaining stable contact resistance to ensure test results with stable and high accuracy.

Abstract: Provided is an assessment system for medical clinical skills, including an image processing module, a deep learning module, and a medical clinical skills assessment module. The image processing module receives execution videos of medical clinical skills and annotation information, where each execution video includes target actions executed consecutively. The image processing module further performs annotation processing for each execution video based on the annotation information and divides each execution video into execution segments, where each execution segment corresponds to one of the target actions. The deep learning module compiles and performs recognition processing on the execution segments that execute the same target action in the execution videos, establishing assessment benchmark videos corresponding to each target action.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

Abstract: A probe seat includes upper and lower die units, and a supporting structure including supporting pillars disposed between the upper and lower die units. The upper die unit includes upper through holes penetrating through upper and lower surfaces thereof. The lower die unit includes lower through holes penetrating through upper and lower surfaces thereof. An accommodating space is formed around the supporting pillars and between the upper and lower die units for probes to be inserted through the respective upper through holes, the accommodating space, and the respective lower through holes. The supporting pillars include upper supporting pillars protruding out of the lower surface of the upper die unit, and lower supporting pillars protruding out of the upper surface of the lower die unit and in contact with the upper supporting pillars respectively. As such, the probe seat has great structural strength, thereby uneasily deformed.

Abstract: A detection device adapted to a connector is provided herein. The connecter includes a first pin and a second pin, and the first pin and the second pin are physically separated and coupled to a first power respectively. The detection device includes a first transistor, a first resistor, a second transistor, and a bias circuit. The first transistor is coupled between the first pin and the first power. The first resistor is coupled between a gate terminal of the first transistor and the first power. A detection signal is generated at the gate terminal of the first transistor. The second transistor is coupled between the gate terminal of the first transistor and a second power. The bias circuit is coupled between a gate terminal of the second transistor and the first pin.

Abstract: A vertical probe includes opposite first and third sides, and opposite second and fourth sides. The third and fourth sides extend in a planar manner from a body to a tip portion. The first and second sides include first and second upper plane segments at the body, first and second transition segments at the tip portion, and first and second lower plane segments closer to the third and fourth sides than the first and second upper plane segments are, respectively. The first and second transition segments gradually approach the third and fourth sides as they extend from the first and second upper plane segments to the first and second lower plane segments. The first transition and lower plane segments are realized by laser processing. The vertical probe can contact small conductive contacts with good current resistance, structural strength, lifespan, and processing accuracy. When applied to a probe head, breaking or shifting position of the tip portion due to vertical movement can be avoided.

Abstract: The present invention provides a circuit structure and a card-shape device comprising the same. The card-shape device includes a first plate, a second plate, a frame and the circuit structure. The frame is disposed between the first plate and the second plate. An accommodating space is defined by the first plate, the second plate and the frame. The circuit structure is disposed in the accommodating space. The circuit structure includes a flexible printed circuit and an interface element. The flexible printed circuit has a first recess and first electrical contacts disposed around the first recess. The interface element has a body, an interface disposed on the body and second electrical contacts disposed on the body and electrically connected with the interface. The interface of the interface element is exposed to the first recess of the flexible printed circuit when the first electrical contacts electrically connect to the second electrical contacts.

Abstract: An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.

Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.

Abstract: A probe card includes a structure stiffener unit including a base with a lower surface where central and peripheral supporting elements protrude out and a main circuit board is fixed, a space transformer and a probe head disposed thereunder, which are disposed to the supporting elements by bolts and defined with central and peripheral regions located correspondingly to the central and peripheral supporting elements respectively, and a metal supporting member fixed on the space transformer in a direct contact manner and located correspondingly to the central region. The supporting member has a lower surface coplanar with the lower end surface of the peripheral supporting element, which is abutted on the space transformer, and an upper surface against which the central supporting element is abutted. The space transformer has great structural strength, flatness and heat dissipation effect for satisfying the large-area requirement and great electrical property testing stability.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.

Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.

Abstract: A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.

Abstract: An electronic device for switching a standby power of a motherboard includes a universal serial bus (USB) connector, electrically connected to the motherboard, configured to connect an external device; a device detecting module, coupled to the USB connector, configured to determine a power control signal according to a voltage level of the USB connector; and an output switching control module, coupled to the device detecting module and the USB connector, configured to determine whether to cut off the standby power provided by the motherboard to the USB connector or not according to the power control signal.

Abstract: A detection device adapted to a connector is provided herein. The connecter includes a first pin and a second pin, and the first pin and the second pin are physically separated and coupled to a first power respectively. The detection device includes a first transistor, a first resistor, a second transistor, and a bias circuit. The first transistor is coupled between the first pin and the first power. The first resistor is coupled between a gate terminal of the first transistor and the first power. A detection signal is generated at the gate terminal of the first transistor. The second transistor is coupled between the gate terminal of the first transistor and a second power. The bias circuit is coupled between a gate terminal of the second transistor and the first pin.