Abstract: The invention relates to a physical therapy device for pets. To avoid affecting the effects of the electrotherapy and the massage since more hair on the body of pets, the invention deposits a conductive platform that electrically connects to a current output unit so that the pets are laid on the conductive platform, and first brushes of a comb body separately electrically connect to the current output unit. When the first brushes contact to the body of the pets, the conductive platform, the pets, the first brushes and the current output unit form a conductive circuit together so that the pets can gain the complete effects of the electrotherapy to improve the disadvantages of the prior art.

Abstract: A process for preparing a catalyst system including contacting one or more catalysts having a Group 3 through Group 12 metal atom or lanthanide metal atom with a methylalumoxane and one or more support material compositions to a concentration of methylalumoxane of about 4 mmol to about 15 mmol aluminum per gram of support material is provided. The support material composition may have a macroporosity of from about 0.18 cc/g to about 0.50 cc/g. In other embodiments, a process for polymerizing at least one olefin to produce a polyolefin composition including contacting one or more olefins with the aforementioned catalyst system is also provide.

Abstract: An image sensor structure that includes a first semiconductor substrate having a plurality of imaging sensors; a first interconnect structure formed on the first semiconductor substrate; a second semiconductor substrate having a logic circuit; a second interconnect structure formed on the second semiconductor substrate, wherein the first and the second semiconductor substrates are bonded together in a configuration that the first and second interconnect structures are sandwiched between the first and second semiconductor substrates; and a backside deep contact (BDCT) feature extended from the first interconnect structure to the second interconnect structure, thereby electrically coupling the logic circuit to the image sensors.

Abstract: A pixel circuit applied to an uLED display including a LED, a first transistor˜a sixth transistor and a capacitor. The LED is coupled between a first voltage and a first node. The first transistor is coupled between the first node and a second node. The second transistor is coupled between the second node and a second voltage lower than the first voltage. The third transistor is coupled between a third voltage and a third node. The fourth transistor is coupled between the third node and a fourth node. The fifth transistor is coupled between the fourth node and a fourth voltage. A terminal of the sixth transistor is coupled to the first node. The capacitor is coupled between the second node and the fourth node. The fourth transistor is controlled by a second control signal. The third transistor, the fifth transistor and the sixth transistor are controlled by a third control signal.

Abstract: The present invention developed a hypothesis testing approach to analyze the high-dimensional LC-MS data to assess the extent of similarity between a reference drug and generics.

Abstract: Vertical gate all around (VGAA) devices and methods of manufacture thereof are described. A method for manufacturing a VGAA device includes: exposing a top surface and sidewalls of a first portion of a protrusion extending from a doped region, wherein a second portion of the protrusion is surrounded by a gate stack; and enlarging the first portion of the protrusion using an epitaxial growth process.

Abstract: A microfluidic chip with high volumetric flow rate is provided that includes at least two vertically stacked microfluidic channel layers, each microfluidic channel layer including an array of spaced apart pillars. Each microfluidic channel layer is interconnected by an inlet/outlet opening that extends through the microfluidic chip. The microfluidic chip is created without wafer to wafer bonding thus circumventing the cost and yield issues associated with microfluidic chips that are created by wafer bonding.

Abstract: A panel cutting apparatus includes a master cutting apparatus. The master cutting apparatus includes a casing, wheels, a first servo motor, a second servo motor, a processing unit, an image sensing unit and an integrated jig unit. The wheels are disposed on the bottom surface of the casing, and its rotation is controlled by the second servo motor. The image sensing unit is electrically connected to the processing unit and disposed at the front end of the lateral surface of the casing to sense images in front of the panel cutting apparatus. The processing unit controls the second servo motor according to the sensed images. The integrated jig unit is disposed on the top surface of the casing and includes jigs and a jig changing unit. The jig changing unit switches between the jigs and selects one of them. The selected jig is controlled by the first servo motor.

Abstract: A semiconductor apparatus includes a light source, a reflection mirror, and a heat exchanger. The reflection mirror has a reflection surface configured to reflect a light of the light source and a channel behind the reflection surface. The heat exchanger is connected to the channel and configured to circulate a working fluid in the channel.

Abstract: A hollow positioning nut structure of a slide rail bracket is provided. The hollow positioning nut includes: a tubular pillar piece, a resisting piece, a spiral portion, and a convex portion. When the hollow positioning nut is combined with a stud and rotates toward a side, the resisting piece resists and positions a wall surface, such that the stud clockwise rotates and the hollow positioning nut fits to perforations of a variety of cabinet pillars.

Abstract: A plastic optical lens assembly includes a first lens element, a second lens element and a cementing glue coating. A first spacing section is located between a first optical effective portion and a first engaging structure. A second optical effective portion is disposed correspondingly to the first optical effective portion. A second spacing section is located between the second optical effective portion and a second engaging structure. The first engaging structure is engaged with the second engaging structure. A reference space is between the first and the second spacing section. The cementing glue coating is at least disposed between the first and the second optical effective portions, and the first and the second lens elements are cemented by the cementing glue coating.

Abstract: A tread detecting device and a trend detecting module are provided. The tread detecting device is disposed at a first predetermined thickness of a tire. The tread detecting device includes a control module providing a voltage or a current, and a tread detection module including a first tread detecting layer. The first tread detecting layer is disposed at the first predetermined thickness of the tire. The control module is electrically connected to the tread detecting module. The control module detects a variation of an impedance value of the tread detecting module to determine whether the thickness of the tread of the tire is less than or equal to the first predetermined thickness.

Abstract: A memory includes: a dielectric fin formed over a substrate; and a pair of memory cells disposed along respective sidewalls of the dielectric fin, each of the pair of memory cells comprising: a first conductor layer; a selector layer; a resistive material layer; and a second conductor layer, wherein the first conductor layer, selector layer, resistive material layer, and second conductor layer each includes upper and lower boundaries, and at least one of the upper and lower boundaries is tilted away from one of the sidewalls of the dielectric fin by an angle.

Abstract: Provided is a pixel circuit.

Abstract: Devices and methods for controlling wafer uniformity using a gas baffle plate are disclosed. In one example, a device for plasma-based processes is disclosed. The device includes: a housing defining a process chamber and a baffle plate arranged above a wafer in the process chamber. The baffle plate is configured to control plasma distribution on the wafer. The baffle plate has a shape of an annulus that comprises a first annulus sector and a second annulus sector. The first annulus sector has a first inner radius. The second annulus sector has a second inner radius that is different from the first inner radius.

Abstract: An image sensor and a method for fabricating the image sensor are provided. In the method for fabricating the image sensor, at first, a substrate having a first surface and a second surface opposite to the first surface is provided. Then, light-sensitive regions are formed in the substrate. Thereafter, transfer gate structures are formed on the first surface of the substrate. Then, the first surface of the substrate is formed to form recess structures on the light-sensitive regions. Thereafter, light-reflective layers are formed to cover the recess structures of the first surface of the substrate, in which the recess structures are filled with protrusion structures of the light-reflective layers. Further, the second surface of the substrate may be etched to form recess structures corresponding to the light-sensitive regions.

Abstract: An embodiment of the disclosure provides a light source apparatus including a light-emitting module and a control unit. The light-emitting module is configured to provide a light. The control unit is configured to change proportion of a first sub-light and a second sub-light to form the light so that a circadian action factor (CAF) and a correlated color temperature (CCT) of the light varies along a CAF vs. CCT locus of the light different from a CAF vs. CCT locus of sunlight. A CAF vs. CCT coordinate of one of the first sub-light and the second sub-light is below the CAF vs. CCT locus of sunlight, and a CAF vs. CCT coordinate of the other one of the first sub-light and the second sub-light is above the CAF vs. CCT locus of sunlight. A display apparatus is also provided.

Abstract: Embodiments of the present disclosure are directed to a method for generating simulated point cloud data, a device, and a storage medium. The method includes: acquiring at least one frame of point cloud data collected by a road collecting device in an actual environment without a dynamic obstacle as static scene point cloud data; setting, according to set position association information, at least one dynamic obstacle in a coordinate system matching the static scene point cloud data; simulating in the coordinate system, according to the static scene point cloud data, a plurality of simulated scanning lights emitted by a virtual scanner located at an origin of the coordinate system; and updating the static scene point cloud data according to intersections of the plurality of simulated scanning lights and the at least one dynamic obstacle to obtain the simulated point cloud data comprising point cloud data of the dynamic obstacle.

Abstract: A method and apparatus for predicting traffic, comprising: determining time at which payment times for a first service reaches a peak as designated time; determining a peak of payment times for a second service in history as a historical peak according to a saved historical record; and predicting the actual traffic of the second service at the designated time according to the historical peak, wherein the first service and the second service belong to the same type of services, the execution manner of the first service is different from that of the second service, the service execution time of the first service is shorter than a preset duration, and the service execution time of the second service is longer than the preset duration. The present application can provide a more accurate reference for the operation and maintenance procedure of the server.

Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a passivation layer over a semiconductor substrate. The method also includes forming a magnetic element over the passivation layer. The method further includes forming an isolation layer over the magnetic element and the passivation layer. The isolation layer includes a polymer material. In addition, the method includes forming a conductive line over the isolation layer, and the conductive line extends across the magnetic element.