Abstract: A integrated circuit structure comprises a fin extending from a substrate. The fin comprises source and drain regions and a channel region between the source and drain regions. A multilayer high-k gate dielectric stack comprises at least a first high-k material and a second high-k material, the first high-k material extending conformally over the fin over the channel region, and the second high-k material conformal to the first high-k material, wherein either the first high-k material or the second high-k material has a modified material property different from the other high-k material, wherein the modified material property comprises at least one of ferroelectricity, crystalline phase, texturing, ordering orientation of the crystalline phase or texturing to a specific crystalline direction or plane, strain, surface roughness, and lattice constant and combinations thereof. A gate electrode ix over and on a topmost high-k material in the multilayer high-k gate dielectric stack.

Abstract: A solid-state image sensor is provided. The solid-state image sensor includes photoelectric conversion units and modulation structures embedded in the photoelectric conversion units. The solid-state image sensor also includes isolation structures disposed between the photoelectric conversion units and a protective layer disposed on the photoelectric conversion units. From the top view of the solid-state image sensor, the photoelectric conversion units and the modulation structures form mosaic patterns, and the ratio of the area of one modulation structure to the area of the corresponding mosaic pattern is between 0.1 and 0.9.

Abstract: A five-piece infrared single wavelength lens system includes, in order from the object side to the image side: a first lens element with a negative refractive power, a stop, a second lens element with a positive refractive power, a third lens element with a negative refractive power, a fourth lens element with a positive refractive power, and a fifth lens element with a negative refractive power, where a radius of curvature of an object-side surface of the third lens element is R5, a central thickness of the third lens element along an optical axis is CT3, and they satisfy the relation: 5<R5/CT3<35. Such a system has a wide field of view, large stop, short length and less distortion.

Abstract: The present invention provides a cover structure, which includes a body, a first cover and a second cover. The body is provided with a first opening and a second opening. The first opening and the second opening are adjacent and are configured at an interval from each other so as to form a frame between the first opening and the second opening. The first cover includes a first cover plate and a first seat plate. The second cover includes a second cover plate and a second seat plate. The first and second seat plates are disposed in a protruding manner on side edges of the first and second cover plates, and are fixedly connected to the frame. The first and second cover plates cover the first and second openings, and are turnable relative to the first and second seat plates so as to open the first and second openings.

Abstract: A steam cooking device which includes a pressure accumulating steam boiler and a steaming cabinet is disclosed. The pressure accumulating steam boiler heats liquid water and accumulates a steam having a pressure between 1.1 and 5.0 times atmospheric pressure. The steaming cabinet receives the steam from the pressure accumulating steam boiler to cook a foodstuff contained therein. To raise the temperature of a foodstuff accommodating chamber within the steaming cabinet from a room temperature to a cooking temperature, a WH1 amount of energy is consumed by an electricity-heat conversion unit in the pressure accumulating steam boiler. A foodstuff accommodating chamber within the steaming cabinet has a volume of V1. The steam cooking device satisfies V1/WH1>160. The cooking temperature is between 101° C. and 150° C. and is lower than or equal to the temperature of the steam when the steam is outputted from the pressure accumulating steam boiler.

Abstract: One wireless communication device includes a transmitter circuit and a control circuit, wherein the control circuit sets a request to send (RTS) frame, and controls the transmitter circuit to transmit the RTS frame via at least one channel excluding a preamble punctured channel. Another wireless communication device includes a transmitter circuit and a control circuit, wherein the control circuit sets an RTS frame, and controls the transmitter circuit to transmit the RTS frame via a plurality of channels including the preamble punctured channel.

Abstract: A waterproof gate assembly, which is configured to be mounted to a housing and includes a cover, an installation axle and a fixing member, is provided. The installation axle is connected to the cover, allowing the cover to rotate relative to the installation axle. The installation axle includes an axial groove, an engaging structure and a fixing structure. The axial groove is connected to the cover and includes a first end portion and a second end portion. The engaging structure is connected to one side of the axial groove corresponding to the cover, extends to the first end portion of the axial groove, and is configured to be engaged at the housing. The fixing structure is connected to one side of the axial groove corresponding to the cover, and close to the second end portion. The fixing member passes through the fixing structure and is fixed at the housing.

Abstract: A method of automatically tuning hyperparameters includes receiving a hyperparameter tuning strategy. Upon determining that one or more computing resources exceed their corresponding predetermined quota, the hyperparameter tuning strategy is rejected. Upon determining that the one or more computing resources do not exceed their corresponding predetermined quota, a machine learning model training is run with a hyperparameter point. Upon determining that one or more predetermined computing resource usage limits are exceeded for the hyperparameter point, the running of the machine learning model training is terminated for the hyperparameter point and the process returns to running the machine learning model training with a new hyperparameter point. Upon determining that training the machine learning model is complete, training results are collected and computing resource utilization metrics are determined.

Abstract: An electronic device assembly includes an expansion component and a host. The expansion component includes a first case, a first circuit board, and a first connector. The host includes a second case, a main circuit board, and a main connector. The first circuit board is arranged in the first case. The first connector is electrically connected to the first circuit board and is exposed from a top plate of the first case. The main circuit board is arranged in the second case. The main connector is electrically connected to the main circuit board and exposed from a second surface of the second case. When the host is assembled to the expansion component, the second surface of the second case covers the top plate of the first case, and the first connector is electrically connected to the main connector.

Abstract: A charging device and a safety function control circuit and method thereof are provided. When a charging device is not connected to a load, a converted voltage value of a power connection terminal of the charging device is kept to be lower than a safe voltage value so as to maintain a safe mode. The safety function control circuit includes a first control module and a second control module for constant voltage control. The first control module and the second control module perform matching control on a power conversion circuit of the charging device, and in case of a single fault of one of the control modules, the other module is still capable of keeping the converted voltage value to be less than the safe voltage value. Thus, it is ensured that the safe mode stays functional in case of a concurrency of both a single hardware fault and a single firmware fault.

Abstract: An electronic device includes an input unit and a transmission dock. The transmission dock is pivotally connected to the input unit, and includes at least one pivotal concave portion, a first wall, a second wall and a third wall. The at least one pivotal concave portion has a first sidewall and a second sidewall opposite to each other. The first wall is connected to the first sidewall and the second sidewall. The second wall is connected to the first sidewall and the second sidewall. The third wall is connected to the first sidewall and the second sidewall. The first wall and the second wall are connected to two opposite sides of the third wall, respectively. An inner surface of the third wall forms a sloped surface toward each of the first sidewall and the second sidewall, and each of the sloped surfaces has an opening at an end thereof.

Abstract: An electronic device includes: a body, including opposite outer and inner surfaces, and a through opening passing through the outer and inner surfaces; a fan, disposed on the outer surface and having an air outlet; a heat sink assembly, disposed at the air outlet and corresponding to the through opening; a first thermal tube, having one end assembled on the heat sink assembly and located on the side of the outer surface; a first heat source, disposed corresponding to the other end of the first thermal tube; a thermal plate, disposed in the body and corresponding to the through opening, having one side abutting against the heat sink assembly and the inner surface; a second thermal tube, having one end connected to the other side of the thermal plate; and a second heat source, disposed corresponding to the other end of the second thermal tube.

Abstract: A replacement device includes a replacement module and a slider. The replacement module includes a sliding portion. The sliding portion is provided with a limiting column, which is formed with a fixing hole. The slider includes a slider body. The slider body is provided with a first latch, a limiting hole and a fixing element, wherein the first latch is arranged on a first side edge of the slider body. The slider is correspondingly arranged on the sliding portion of the replacement module, and the limiting column of the sliding portion passes through the limiting hole. The fixing element has a top portion, and is fixed in the fixing hole. The size of the top portion is greater than the size of the limiting hole, so that the slider moves relative to the replacement module within a limit range of the limiting hole.

Abstract: An electronic device includes a housing and a first heat source, a second heat source, and a heat dissipation module that are disposed in the housing. The heat dissipation module includes a first fan, a second fan, a first heat conduction member, and a second heat conduction member. The first fan and the second fan are disposed on two opposite sides of the housing. One end of the first heat conduction member is disposed at the first fan, and the other end is located at a position on a side of an upper surface of the housing corresponding to the first heat source. One end of the second heat conduction member is disposed at the second fan, and the other end is located on a side of a lower surface of the housing and abuts against the second heat source.

Abstract: A casing with a replacement structure includes the casing and a replacement assembly. The casing includes a casing body and an assembly space. The assembly space is provided in a recessed manner at the casing body and is located at a vertical intersection of two side edges of the casing body. The replacement assembly includes a frame, which is installed in the assembly space and encloses with the casing body to form an accommodating space.

Abstract: A circuit probe includes a shielding probe having a base and a conductive probe ring on the base. A shielding cage is attached to the conductive probe ring and has an interior. The shielding cage is configured to be positioned to contain in the interior of the shielding cage at least one integrated circuit formed on a wafer, and to provide electromagnetic shielding of the at least one integrated circuit during testing of the at least one integrated circuit.

Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.

Abstract: A testing device for testing an antenna is provided. The testing device includes a housing, an antenna module, and a receiving module. The antenna module is used for holding the antenna and disposed on the housing, wherein the antenna is coupled to an antenna testing apparatus. The receiving module is disposed on the housing and includes a coupling radiation element physically separated from the antenna, wherein the receiving module is configured to receive an excited signal emitted from the antenna.

Abstract: Described herein are capacitor devices formed using perovskite insulators. In one example, a perovskite templating material is formed over an electrode, and a perovskite insulator layer is grown over the templating material. The templating material improves the crystal structure and electrical properties in the perovskite insulator layer. One or both electrodes may be ruthenium. In another example, a perovskite insulator layer is formed between two layers of indium tin oxide (ITO), with the ITO layers forming the capacitor electrodes.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and multiple first conductive lines over the semiconductor substrate. The first conductive lines are not electrically connected to each other. The semiconductor device structure also includes multiple first magnetic structures wrapped around portions of the first conductive lines and multiple second conductive lines over the semiconductor substrate. The second conductive lines are electrically connected in series. The semiconductor device structure further includes multiple second magnetic structures wrapped around portions of the second conductive lines. A size of each of the second magnetic structures and a size of each of the first magnetic structures are substantially the same.