Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).

Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

Abstract: An optical sensing module capable of providing a multi-directional optical sensing function teaches that the optical sensing module can be fixed on a circuit board via a bridging medium. The optical sensing module includes a supporter, a photosensitive component and a connecting component. The supporter includes a base and several lateral portions. The lateral portions are bent from edges of the base to form an accommodating space. The photosensitive component is disposed inside the accommodating space to receive an optical signal passing into an opening of the accommodating space. The connecting component is disposed on the supporter and includes a conductive terminal. The supporter is connected with the bridging material via the conductive terminal to stand on the circuit board by one of a plurality of sensing directions.

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).

Abstract: A packaged optical device includes a light source device emitting light to an object surface, a sensor chip receiving reflective light reflected from the object surface, and a non-lens transparency layer located in front of the sensor chip. The light and the reflective light have a first main optic axis and a second main optic axis, respectively, and the first main optic axis and the second main optic axis are configured to form the specular reflection configuration, thereby enhancing images received by the sensor chip. The non-lens transparency layer has a zone passed through by the second main optic axis, and transmittance of the zone is lower than that of other zones of the non-lens transparency layer, thereby preventing the sensor chip from being saturated.

Abstract: An optical detecting device has gas emission and pressure reduction function and includes a holder, a light penetrating component, a light detecting component, a hole structure, and a. The light penetrating component is disposed on the holder to form an accommodating space whereinside the light detecting component is disposed. The hole structure is formed on the holder to connect with the accommodating space. The waterproofing and ventilating component is disposed on the holder and covers the hole structure to prevent liquid from leaking into the accommodating space via the hole structure. While an inner gas pressure of the accommodating space is decreased, part of the gas is exhausted from the accommodating space via the hole structure and the waterproofing and ventilating component.

Abstract: An optical sensor module and a sensor chip thereof are provided. The optical sensor module includes a substrate, a sensor chip and a passive chip. The sensor chip is disposed on the substrate, and the sensor chip includes a chip body having an active region located at a top side thereof and a recess portion depressed from a top surface of the chip body. The passive chip is accommodated in the recess portion, and a depth of the recess portion is greater than a thickness of the passive chip.

Abstract: An optical detecting module includes a housing, a light emitting component, an optical detecting component and an optical signal collecting component. The light emitting component is disposed inside the housing. The optical detecting component is disposed inside the housing to receive an optical detecting signal generated by the light emitting component. The optical signal collecting component is utilized to hold the light emitting component for signal collection. The optical signal collecting component includes an output portion, a bottom portion and at least one lateral portion. The light emitting component is disposed on the bottom portion, and an optical positive signal of the optical detecting signal is projected out of the housing through the output portion. The lateral portion is bent from the bottom portion to reflect an optical lateral signal of the optical detecting signal, and the optical lateral signal is projected out of the housing through the output portion.

Abstract: A package structure includes: 1) a circuit substrate; 2) a first semiconductor device disposed on the circuit substrate; 3) a first insulation layer covering a sidewall of the first semiconductor device; 4) a second insulation layer covering the first insulation layer; and 5) a third insulation layer disposed on the circuit substrate and in contact with the second insulation layer.

Abstract: A sensor chip package structure and a manufacturing method thereof are provided. The sensor chip package structure includes a substrate, a sensor chip and a wiring layer. The sensor chip is mounted on the substrate and has a top surface and a concave portion concaved from the top surface. The sensor chip has an active region formed on the top surface and the concave portion is located at one side of the active region. The concave portion has a depth of 100 ?m to 400 ?m. The wiring layer is disposed on the sensor chip and electrically connected to the active region. At least a portion of the wiring layer extends from the active region along a sidewall of the concave portion to a bottom surface of the concave portion.

Abstract: A package process is provided. An adhesive layer is disposed on a carrier board and then plural first semiconductor devices are disposed on the adhesive layer. A first molding compound formed on the carrier board covers the sidewalls of the first semiconductor devices and fills the gaps between the first semiconductor devices so as to form a chip array board constructed by the first semiconductor devices and the first molding compound. Next, plural second semiconductor devices are flip-chip bonded to the first semiconductor devices respectively. Then, a second molding compound formed on the chip array board at least covers the sidewalls of the second semiconductor devices and fills the gaps between the second semiconductor devices. Subsequently, the chip array board is separated from the adhesive layer. Then, the first and the second molding compound are cut along the gaps between the second semiconductor devices.

Abstract: An optical sensing module capable of providing a multi-directional optical sensing function teaches that the optical sensing module can be fixed on a circuit board via a bridging medium. The optical sensing module includes a supporter, a photosensitive component and a connecting component. The supporter includes a base and several lateral portions. The lateral portions are bent from edges of the base to form an accommodating space. The photosensitive component is disposed inside the accommodating space to receive an optical signal passing into an opening of the accommodating space. The connecting component is disposed on the supporter and includes a conductive terminal. The supporter is connected with the bridging material via the conductive terminal to stand on the circuit board by one of a plurality of sensing directions.

Abstract: The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.

Abstract: An optical detecting device capable of preventing environmental pollution includes a casing, an optical detecting component and a transparent component. The casing includes a light through unit and at least one accommodating structure. The optical detecting component is disposed inside the accommodating structure. The transparent component is disposed inside the accommodating structure and located above the optical detecting component, to partly fill the accommodating structure at least and block between the light through unit and the optical detecting component.

Abstract: The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.

Abstract: An optical detecting module includes a housing, a light emitting component, an optical detecting component and an optical signal collecting component. The light emitting component is disposed inside the housing. The optical detecting component is disposed inside the housing to receive an optical detecting signal generated by the light emitting component. The optical signal collecting component is utilized to hold the light emitting component for signal collection. The optical signal collecting component includes an output portion, a bottom portion and at least one lateral portion. The light emitting component is disposed on the bottom portion, and an optical positive signal of the optical detecting signal is projected out of the housing through the output portion. The lateral portion is bent from the bottom portion to reflect an optical lateral signal of the optical detecting signal, and the optical lateral signal is projected out of the housing through the output portion.

Abstract: A sensor chip package structure and a manufacturing method thereof are provided. The sensor chip package structure includes a substrate, a sensor chip and a wiring layer. The sensor chip is mounted on the substrate and has a top surface and a concave portion concaved from the top surface. The sensor chip has an active region formed on the top surface and the concave portion is located at one side of the active region. The concave portion has a depth of 100 ?m to 400 ?m. The wiring layer is disposed on the sensor chip and electrically connected to the active region. At least a portion of the wiring layer extends from the active region along a sidewall of the concave portion to a bottom surface of the concave portion.