Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the electronic package can effectively increase the packaging density to meet the requirements of multi-functional end products.

Abstract: Embodiments of the present disclosure provide a method of forming a contact opening using selective ALE operations to remove ILD layer along an upper profile of a source/drain region, and then form a source/drain contact feature having a concave bottom profile with increased contact area.

Abstract: A connecting structure for a liquid container includes a receiving groove. The liquid container having a suction tube is disposed in the receiving groove. A top end of the receiving groove is engaged with a connecting base. A front side of the connecting base is pivotally connected to a locking assembly protruding frontwards. A liftable base being movable along a top-bottom direction and a front-rear direction is disposed in an inner side of the connecting base, and has a bottom frame engaging with a sleeve that is for being connected to and communicating with a liquid pipeline and fits around the suction tube. Two extending arms extending frontwards out of the bottom frame are pivotally connected to the locking assembly. A left side and a right side of the bottom frame are pivotally connected to two swinging arms that extend backwards and are pivotally connected to the connecting base.

Abstract: Systems, methods and devices are provided, which can include an engineering change order (ECO) base. A base layout cell includes metal layer regions, conductive gate patterns arranged above metal layer regions; oxide definition (OD) patterns, metal-zero layer over oxide-definition (metal-zero) patterns, at least one cut metal layer (CMD) pattern; and at least one via region. The base layout cell can be implemented in at least two non-identical functional cells. A first functional cell of the at least two non-identical functional cells includes first interconnection conductive patterns arranged connecting metal-zero structures corresponding to at least two metal-zero patterns in a first layout, and a second functional cell of the at least two non-identical functional cells includes second interconnection conductive patterns arranged connecting metal-zero structures corresponding to at least two metal-zero patterns in a second layout.

Abstract: The present disclosure provides a method for forming an integrated circuit (IC) structure. The method comprises providing a substrate including a conductive feature; forming aluminum (Al)-containing dielectric layer on the conductive feature; forming a low-k dielectric layer on the Al-containing dielectric layer; and etching the low-k dielectric layer to form a contact trench aligned with the conductive feature. A bottom of the contact trench is on a surface of the Al-containing dielectric layer.

Abstract: The invention discloses a multi-lighting projection warning device for vehicle turning, which comprises a composite lamp and a control unit. The composite lamp is arranged on one side of a vehicle and combined with a range indicator light, a contour indicator light, and a text or pattern indicator light, so that the composite lamp can project lighting to a visual blind spot when the vehicle turns or reverses to form a warning area. The control unit is connected to the composite lamp to enable functions of controlling rotation and start-stop lighting of the composite lamp. Thereby, when the vehicle is turning, the invention projects composite lightings on the ground at the turning side to form the warning area, so as to actively warn other passers-by to dodge the warning area and increase the safety of passers-by.

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: A dyeing method for functional contact lenses includes the following steps: providing a dry lens body, including hydrogel with 0-90% water content, silicone hydrogel with 0-90% water content, or a combination thereof; preparing an amphoteric polymethyl ether prepolymer, combining the amphoteric polymethyl ether prepolymer with a hydrophilic monomer to form a masking ring material, and attaching the masking ring material to an inner surface of the dry lens body to form a masking ring layer; dropping a colorant onto the inner surface, making the masking ring layer surround the colorant, irradiating the colorant with an ultraviolet light and then heating and fixing the colorant to form a dyed layer on the inner surface; and placing the dry lens body in water to hydrate and removing the masking ring layer to obtain a wet lens body.

Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.

Abstract: 4-Alkoxypyrrolo[2,1-f][1,2,4]triazine compounds for treating various diseases and pathologies are disclosed. More particularly, the present disclosure concerns the use of 4-alkoxypyrrolo[2,1-f][1,2,4]triazine compounds or analogs thereof, in the treatment of disorders characterized by overexpression of DYRK1A (e.g., cancer, Down syndrome, Alzheimer's disease, diabetes, viral infections, and osteoarthritis).

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: An orthodontic appliance for movably disposed inside dental patient's mouth. The dental patient's mouth has a maxillary dental arch, a mandibular dental arch, and defines a lingual side, a labial side, and a buccal side. The orthodontic appliance has a hard maxillary retainer corresponding to patient's upper jaw, a hard mandibular retainer corresponding to patient's lower jaw, and a soft retainer rigidly attached to the hard maxillary retainer and hard mandibular retainer. The hard maxillary retainer and hard mandibular retainer can be prefabricated according to expected Cusp-to-Fossa Relationship of dental patient, and then be manufactured in an injection mold. The orthodontic appliance can have function to treat teeth deviation, dislocation, malocclusion, or teeth unmatch.

Abstract: The present invention provides a physical card capable of improving authenticity identification and a method of using thereof. The physical card is provided with two electronic tags of different wavebands. When a physical card is to be traded, the purchaser can perform an appearance inspection of the physical card, or use a first reader in the purchaser's mobile phone to directly read a high-frequency electronic tag of the physical card and obtain a card first information, so that purchaser can quickly and automatically determine the authenticity of the physical card. In addition, an UHF electronic tag in the physical card can be read by a second reader of a verification agency, and then a second information of the physical card can be obtained. Since the physical card is used without leaving the holder of the physical card during the whole process, the contactless transaction mode maintains a social safety distance, which can improve the security of the physical card when in use.

Abstract: The present invention provides a physical card capable of improving authenticity identification and a method of using thereof. The physical card is provided with two electronic tags of different wavebands. When a physical card is to be traded, the purchaser can perform an appearance inspection of the physical card, or use a first reader in the purchaser's mobile phone to directly read a high-frequency electronic tag of the physical card and obtain a card first information, so that purchaser can quickly and automatically determine the authenticity of the physical card. In addition, an UHF electronic tag in the physical card can be read by a second reader of a verification agency, and then a second information of the physical card can be obtained. Since the physical card is used without leaving the holder of the physical card during the whole process, the contactless transaction mode maintains a social safety distance, which can improve the security of the physical card when in use.

Abstract: A method for fabricating orthodontic appliance using bone expansion for dental alignment is provided.

Abstract: Provided is a semiconductor device including: a substrate, a plurality of isolation structures, a plurality of channel layers, and a gate structure. The substrate includes a plurality of fins thereon. The plurality of isolation structures are respectively disposed between the plurality of fins. A top surface of the plurality of isolation structures is higher than a top surface of the plurality of fins to form a plurality of openings. The plurality of channel layers are respectively disposed in the plurality of openings. Each channel layer is in contact with a corresponding fin and extends to cover a lower sidewall of a corresponding isolation structure, thereby forming a U-shaped structure. The gate structure is filled in the plurality of openings and extends to cover the top surface of the plurality of isolation structures.

Abstract: Pyrrolo[2,1-f][1,2,4]triazine compounds for treating various diseases and pathologies are disclosed. More particularly, the present disclosure concerns the use of pyrrolo[2,1-f][1,2,4]triazine compounds or analogs thereof, in the treatment of disorders characterized by overexpression of DYRK1A (e.g., cancer, Down syndrome, Alzheimer’s disease, diabetes, viral infections, and osteoarthritis).

Abstract: Isoquinoline compounds for treating various diseases and pathologies are disclosed. More particularly, the present invention concerns the use of an isoquinoline compound or analogs thereof, in the treatment of disorders characterized by the activation of Wnt pathway signaling (e.g., cancer, abnormal cellular proliferation, angiogenesis, fibrotic disorders, bone or cartilage diseases, and osteoarthritis), the modulation of cellular events mediated by Wnt pathway signaling, as well as genetic diseases and neurological conditions/disorders/diseases due to mutations or dysregulation of the Wnt pathway and/or of one or more of Wnt signaling components. Also provided are methods for treating Wnt-related disease states.

Abstract: A three-dimensional semiconductor device includes multiple semiconductor device layers on a substrate, wherein each layer includes a first stacked structure, a first gate dielectric layer, a first semiconductor layer, a first channel layer, a first source region, a first drain region, and a first resistive random access memory cell. The first stacked structure on the substrate includes a first insulating layer and a first gate conductor layer. The first gate dielectric layer surrounds a sidewall of the first stacked structure. The first semiconductor layer surrounds a sidewall of the first gate dielectric layer. The first channel layer is in the first semiconductor layer. The first source region and the first drain region are on both sides of the first channel layer in the first semiconductor layer. The first resistive random access memory cell is on a first sidewall of the first semiconductor layer and connected to the first drain region.