Abstract: A connecting cable includes an insulative seat, a circuit board, a protective cover and a spring. The insulative seat includes a body. The body is formed with a slot and a conducting opening. The circuit board includes a substrate and conductive portions. The substrate is inserted into the slot. The conductive portions are exposed from the conducting opening. The protective cover is disposed on the body to cover the conducting opening and slidable. The spring has one end abutting against the body and another end fixed on the protective cover. The conducting opening may be opened by pushing the protective cover by the counterpart connector to compress the spring. The protective cover may be returned back to an original position by an elastic force from the spring.

Abstract: A memory circuit includes a substrate with a front side and a back side opposite the front side. An interconnect structure is situated on or over the substrate and has first and second metal layers and a via electrically connecting the first and second metal layers. A word line driver circuit is configured to output a word line enable signal to a word line of a memory array. The word line driver circuit has an inverter circuit configured to receive a word line signal, and an enable transistor electrically connected to an output of the inverter circuit by a metal line that includes the first metal layer, the second metal layer, and the via.

Abstract: An electronic device is provided that implements thermally conductive plastic supports that may replace the typical use of “feet” used in conventional electronic devices. The thermally conductive supports may extend through the bottom chassis cover (e.g. the “D cover”) of the electronic device, and be mechanically and thermally coupled to a heat pipe that is in turn coupled to a heat source for which thermal regulation is utilized. The thermally conductive plastic supports may provide a heat path from the heat source to the bottom chassis cover and, when the electronic device is disposed on a surface, an additional heat path may be provided from the heat source to this surface.

Abstract: The present disclosure provides a wafer chuck including a substrate and a heating/cooling wafer. The substrate includes a first surface facing a wafer to be carried and a second surface opposite to the first surface. The heating/cooling wafer is disposed on the first surface of the substrate and includes a plurality of heating/cooling units arranged in an array. In a direction perpendicular to the first surface, the positions of the heating/cooling units and the positions of a plurality of dies included in the wafer to be carried are corresponded with each other, and the heating/cooling units can heat or cool the corresponding dies individually.

Abstract: A method according to the present disclosure includes providing a first workpiece that includes a first substrate and a first interconnect structure, providing a second workpiece that includes a second substrate, a second interconnect structure, and a through via extending through a portion of the second substrate and a portion of the second interconnect structure, forming a first bonding layer on the first interconnect structure, forming a second bonding layer on the second interconnect structure, bonding the second workpiece to the first workpiece by directly bonding the second bonding layer to the first bonding layer, thinning the second substrate, forming a protective film over the thinned second substrate, forming a backside via opening through the protective film and the thinned second substrate to expose the through via, and forming a backside through via in the backside via opening to physically couple to the through via.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for electronic devices with tactile keyboards. An example electronic device includes a tactile keyboard having a plurality of rows of keys; a printed circuit board; a first row of switches on the printed circuit board, a first row of the plurality of rows of keys to interact with the first row of switches; and a second row of switches on a component adjacent to the printed circuit board, a second row of the plurality of rows of keys to interact with the second row of switches.

Abstract: A method for forming an indium gallium nitride quantum well structure is disclosed. The method includes forming a gallium nitride microdisk on a substrate, with the gallium nitride microdisk having an inverted pyramid form and an end face; and forming multiple quantum well layers on the end face, with each quantum well layer including an indium gallium nitride quantum well and a barrier layer. The indium gallium nitride quantum well is grown at a growth temperature adjusted using a trend equation within a temperature range of 480° C. to 810° C.

Abstract: A tool, such as a tape measure, including a spring-based retraction system is shown. The spring-based retraction system is driven by a spiral spring, that has a variable preformed stress profile along the length of the spring.

Abstract: The disclosure provides an electronic fuse (eFuse) device and an operation method thereof. The eFuse device includes an eFuse, a readout circuit, a register, and a safety control device. The readout circuit reads out target data recorded by the eFuse to the register and the safety control device. The safety control device compares the target data provided by the readout circuit with the target data provided by the register to determine whether a soft error occurs in the target data stored in the register. When the soft error occurs in the target data stored in the register, the readout circuit reads out the target data recorded by the eFuse again to the register and the safety control device.

Abstract: A device including functional blocks and dummy cells. The functional blocks include a first functional block and a second functional block. Each dummy cell having a cell boundary defined by non-functioning active areas and non-functioning gates for filling space between the functional blocks and including a dummy cell configured to be situated between the first functional block and the second functional block such that the dummy cell directly abuts each of the first functional block and the second functional block.

Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.

Abstract: A tool, such as a tape measure, including a spring-based retraction system is shown. The spring-based retraction system is driven by a spiral spring, that has a variable preformed stress profile along the length of the spring.

Abstract: A media docking device is provided and includes an input module, an output module, and a process module. The input module is electrically connected to a media source device. The output module is electrically connected to multiple media playing devices and obtains device data from the media playing devices. The process module transmits the device data and screen numbers to the media source device through the input module. When determining to perform a display switch procedure, the process module modifies the device data and the screen numbers, and transmits the modified device data and the modified screen numbers to the media source device through the input module. The process module also transmits media data from the media source device to the corresponding media playing device.

Abstract: An integrated circuit includes a semiconductor substrate, an isolation region extending into, and overlying a bulk portion of, the semiconductor substrate, a buried conductive track comprising a portion in the isolation region, and a transistor having a source/drain region and a gate electrode. The source/drain region or the gate electrode is connected to the buried conductive track.

Abstract: An integrated circuit includes a semiconductor substrate, an isolation region extending into, and overlying a bulk portion of, the semiconductor substrate, a buried conductive track comprising a portion in the isolation region, and a transistor having a source/drain region and a gate electrode. The source/drain region or the gate electrode is connected to the buried conductive track.

Abstract: Methods of manufacturing and processing semiconductor devices (i.e., electronic devices) are described. Embodiments of the disclosure advantageously provide electronic devices which meet reduced thickness, lower thermal budget, and Vt requirements, and have improved device performance and reliability. The electronic devices described herein comprise a source region, a drain region, and a channel separating the source region and the drain region, an interfacial layer on a top surface of the channel, a high-? dielectric layer on the interfacial layer, a dipole layer on the high-? dielectric layer, and a capping layer on the dipole layer. In some embodiments, the dipole layer comprises a metal oxynitride (MON), such as aluminum oxynitride (AlON). In some embodiments, the methods comprise annealing the substrate to drive atoms from the dipole layer into one or more of the interfacial layer or the high-? dielectric layer.

Abstract: Methods of forming metallic tungsten films selectively on a conductive surface relative to a dielectric surface are described. A substrate is exposed to a first process condition to deposit a tungsten-containing film that is substrate free of tungsten metal. The tungsten-containing film is then converted to a metallic tungsten film by exposure to a second process condition.

Abstract: A computing device permits distribution of power received from an external power source to one or more subsystems of the computing device. The computing device receives input requesting a power control operation and, responsive to the input, interrupts the distribution of the power to at least one of the subsystems.

Abstract: A passive radiator with adjustable working frequency, which includes a chassis, a vibrating plate movably coupled to the chassis by a suspension component, and an added weight device arranged outside the vibrating plate. The added weight device is replaceable to adjust the working frequency of the passive radiator.

Abstract: A core-shell particle includes a core and a shell that is wrapped around the core. The core includes aluminum nitride. The shell includes aluminum and a dopant, and the dopant is yttrium, calcium, magnesium, lanthanum, niobium, titanium, copper, or a combination thereof. The aluminum and the dopant in the shell have a weight ratio of 90:10 to 99.9:0.1. The core-shell particle can be sintered to form a ceramic bulk.