Patents by Inventor Chi Hsieh

Chi Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200122496
    Abstract: A PET synthetic paper is composed of a PET substrate and a soft ink absorbing coating coated on the PET substrate. The soft ink absorbing coating includes an acrylic coating and a polyurethane coating embossed on the acrylic coating. The acrylic coating has excellent printability and the polyurethane coating has velvety-soft tactility.
    Type: Application
    Filed: July 26, 2019
    Publication date: April 23, 2020
    Inventors: TE-CHAO LIAO, Wen-Cheng Yang, CHING-YAO YUAN, Chen-An Wu, Yu-Chi Hsieh
  • Publication number: 20200083591
    Abstract: A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposed on the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier.
    Type: Application
    Filed: August 19, 2019
    Publication date: March 12, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sheng-Chi HSIEH, Chen-Chao WANG, Teck-Chong LEE, Chien-Hua CHEN
  • Patent number: 10490341
    Abstract: An electrical device comprises a substrate, a first dielectric layer, a first die, an adjustable inductor and a second die. The substrate has a first surface. The first dielectric layer is disposed on the first surface of the substrate and has a first surface. The first die is surrounded by the first dielectric layer. The adjustable inductor is electrically connected to the first die. The adjustable inductor comprises a plurality of pillars surrounded by the first dielectric layer, a plurality of first metal strips disposed on the first surface of the first dielectric layer and electrically connected to the pillars, and a plurality of second metal strips disposed on the first surface of the first dielectric layer and electrically connected to the pillars. A width of at least one of the second metal strips is different than a width of at least one of the first metal strips. The second die is electrically connected to the adjustable inductor.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: November 26, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Yuan Kung, Hung-Yi Lin, Teck-Chong Lee, Sheng-Chi Hsieh, Chien-Hua Chen
  • Patent number: 10475734
    Abstract: A semiconductor device package includes: (1) a substrate having a first surface and a second surface opposite to the first surface; (2) a first patterned conductive layer on the first surface of the substrate and having a first surface and a second surface, wherein the second surface of the first patterned conductive layer is adjacent to the substrate and opposite to the first surface of the first patterned conductive layer; (3) a first insulation layer on the first surface of the substrate and having a first surface and a second surface, wherein the second surface of the first insulation layer is adjacent to the substrate and opposite to the first surface of the first insulation layer; and (4) a second patterned conductive layer extending from the first surface of the first insulation layer to the second surface of the substrate, the second patterned conductive layer electrically connected to the first patterned conductive layer.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: November 12, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chien-Hua Chen, Sheng-Chi Hsieh, Cheng-Yuan Kung
  • Publication number: 20190284589
    Abstract: Provided is a method of activating gene expression using a protein having 90% or more sequence identity to SEQ ID NO:45. The protein activates the expression of a gene upon induction with a medium-chain or long-chain alkane or a medium-chain or long-chain fatty acid methyl ester. Also provided is a whole-cell catalytic system regulated by a medium-chain or long-chain alkane or a medium-chain or long-chain fatty acid methyl ester. The system includes a recombinant microbial cell expressing the protein and an alkane monooxygenase. Also provided is a method of preparing a medium-chain or long-chain alkane terminal oxidation product using the whole-cell catalytic system.
    Type: Application
    Filed: November 15, 2018
    Publication date: September 19, 2019
    Inventors: Kung-Ta Lee, Shan-Chi Hsieh, Ching-Yeuh Su, Yu-Chen Lai
  • Publication number: 20190259078
    Abstract: In one aspect, this application describes a method for determining a version of a software application targeted for a computing device. The method includes receiving, at an application marketplace system and from a user associated with a computing device that operates remotely from the application marketplace system, a request that corresponds to a software application distributed by the application marketplace system, the software application having multiple versions on the application marketplace system. The method also includes determining one or more device attributes that are associated with the computing device, and identifying a particular version of the software application, from among the multiple versions on the application marketplace system, that is targeted for the computing device based on the device attributes. The method also includes providing, for display to the user and in response to the request, information related to the particular version of the software application.
    Type: Application
    Filed: May 2, 2019
    Publication date: August 22, 2019
    Inventors: Ilya Firman, Jasper S. Lin, Mark D. Womack, Yu-Kuan Lin, Sheng-chi Hsieh, Juliana Tsang
  • Patent number: 10376577
    Abstract: Disclosed herein is a refined product obtained from a rice hull, which consists essentially of a type II arabinogalactan having a number average molecular weight in the range of 56 to 103 kDa. Also disclosed are a process for producing the refined product and use of the refined product for enhancing the biological activity of innate immune cells, as well as for treating allergy and cancer.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: August 13, 2019
    Assignee: China Medical University
    Inventors: Wen-Chuan Lin, Li-Chan Yang, Chang-Chi Hsieh
  • Publication number: 20190181082
    Abstract: A semiconductor device package includes: (1) a substrate having a first surface and a second surface opposite to the first surface; (2) a first patterned conductive layer on the first surface of the substrate and having a first surface and a second surface, wherein the second surface of the first patterned conductive layer is adjacent to the substrate and opposite to the first surface of the first patterned conductive layer; (3) a first insulation layer on the first surface of the substrate and having a first surface and a second surface, wherein the second surface of the first insulation layer is adjacent to the substrate and opposite to the first surface of the first insulation layer; and (4) a second patterned conductive layer extending from the first surface of the first insulation layer to the second surface of the substrate, the second patterned conductive layer electrically connected to the first patterned conductive layer.
    Type: Application
    Filed: February 15, 2019
    Publication date: June 13, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Sheng-Chi HSIEH, Cheng-Yuan KUNG
  • Publication number: 20190143334
    Abstract: An apparatus for amplifying a nucleic acid sequence in a polymerase chain reaction (PCR) is provided. The apparatus comprises a microprocessor configured to communicatively couple with a user input device and receive instructions from the user input device and implement the received instructions; an electromagnetic radiation (EMR) generator configured to generated EMR at frequencies ranging from 300 THz to 400 THz and communicatively coupled with the microprocessor; a reaction vessel, communicatively coupled with the microprocessor, to house the nucleic acid, sequence, necessary reagents to the PCR, and particles comprising a transition metal material, and to receive the EMR generated by the EMR generator; and a temperature sensor communicatively coupled with the reaction vessel and the microprocessor.
    Type: Application
    Filed: January 10, 2019
    Publication date: May 16, 2019
    Inventors: Dar-Bin SHIEH, Chih-Chia HUANG, Chen-Min CHANG, Tsung-Ju LI, Po-Yang CHANG, Ming-Chi HSIEH
  • Patent number: 10290035
    Abstract: In one aspect, this application describes a method for determining a version of a software application targeted for a computing device. The method includes receiving, at an application marketplace system and from a user associated with a computing device that operates remotely from the application marketplace system, a request that corresponds to a software application distributed by the application marketplace system, the software application having multiple versions on the application marketplace system. The method also includes determining one or more device attributes that are associated with the computing device, and identifying a particular version of the software application, from among the multiple versions on the application marketplace system, that is targeted for the computing device based on the device attributes. The method also includes providing, for display to the user and in response to the request, information related to the particular version of the software application.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: May 14, 2019
    Assignee: Google LLC
    Inventors: Ilya Firman, Jasper S. Lin, Mark D. Womack, Yu-Kuan Lin, Sheng-chi Hsieh, Juliana Tsang
  • Patent number: 10213785
    Abstract: Method and apparatus for amplifying a target nucleic acid sequence of a reaction mixture in a Polymerase Chain Reaction (PCR). The method includes contacting the reaction mixture with EMR frequency absorbing particles formed from a material having a transition metal, transition metal oxide or a transition metal hydroxide, or a nitride, a phosphide or an arsenide of a Group III metal doped with the transition metal or a transition metal oxide, or silicon dioxide doped with the transition metal, transition metal oxide, or transition metal hydroxide; and irradiating the EMR absorbing particles with EMR having a frequency of about 200 kHz to 500 THz to amplify the target nucleic acid sequence, wherein the Group III metal is any one of Al, Ga, and In, and the transition metal is any one of Mn, Fe, Co and Cu.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: February 26, 2019
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Dar-Bin Shieh, Chih-Chia Huang, Chen-Min Chang, Tsung-Ju Li, Po-Yang Chang, Ming-Chi Hsieh
  • Patent number: 10216358
    Abstract: A touch display apparatus and an operating method of the touch display apparatus are provided. An application icon is converted into a corresponding startup gesture icon if a touch operation conforms to an icon conversion operation. Here, the startup gesture icon indicates a gesture operation required for starting up an application corresponding to the startup gesture icon.
    Type: Grant
    Filed: April 27, 2014
    Date of Patent: February 26, 2019
    Assignee: Acer Incorporated
    Inventor: Yu-Chi Hsieh
  • Publication number: 20190057809
    Abstract: An electrical device comprises a substrate, a first dielectric layer, a first die, an adjustable inductor and a second die. The substrate has a first surface. The first dielectric layer is disposed on the first surface of the substrate and has a first surface. The first die is surrounded by the first dielectric layer. The adjustable inductor is electrically connected to the first die. The adjustable inductor comprises a plurality of pillars surrounded by the first dielectric layer, a plurality of first metal strips disposed on the first surface of the first dielectric layer and electrically connected to the pillars, and a plurality of second metal strips disposed on the first surface of the first dielectric layer and electrically connected to the pillars. A width of at least one of the second metal strips is different than a width of at least one of the first metal strips. The second die is electrically connected to the adjustable inductor.
    Type: Application
    Filed: August 17, 2017
    Publication date: February 21, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Hung-Yi LIN, Teck-Chong LEE, Sheng-Chi HSIEH, Chien-Hua CHEN
  • Patent number: 10211137
    Abstract: A method for manufacturing a semiconductor device package includes providing a substrate having a first surface and a second surface opposite to the first surface; disposing a passive component layer on the first surface of the substrate; after disposing the passive component layer, forming at least one via in the substrate, wherein the via penetrates the substrate and the passive component layer; and disposing a conductive layer on the passive component layer and filling the via with the conductive layer.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: February 19, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chien-Hua Chen, Sheng-Chi Hsieh, Cheng-Yuan Kung
  • Publication number: 20180358291
    Abstract: A method for manufacturing a semiconductor device package includes providing a substrate having a first surface and a second surface opposite to the first surface; disposing a passive component layer on the first surface of the substrate; after disposing the passive component layer, forming at least one via in the substrate, wherein the via penetrates the substrate and the passive component layer; and disposing a conductive layer on the passive component layer and filling the via with the conductive layer.
    Type: Application
    Filed: June 8, 2017
    Publication date: December 13, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Sheng-Chi HSIEH, Cheng-Yuan KUNG
  • Patent number: 10146344
    Abstract: A touch apparatus and a touch method are provided. The touch apparatus includes a touch panel and a processing unit. The touch panel includes a plurality of sensing electrodes. The touch panel has a first contact surface and a second contact surface. The processing unit is configured to the touch panel. The processing unit receives a touch signal generated by the touch panel sensing a touch operation. The processing unit determines whether the operation is located on the first contact surface or on the second contact surface of the touch panel according to the touch signal and a preset condition. The preset condition is determined by a sensing signal generated by sensing the touch operation touching first contact surface or the second contact surface of the touch panel using at least one of the sensing electrodes.
    Type: Grant
    Filed: August 23, 2015
    Date of Patent: December 4, 2018
    Assignee: Wistron Corporation
    Inventors: Yao-Tsung Chang, Chih-Chung Chiang, Wen-Hua Chang, Meng-Chi Hsieh
  • Publication number: 20180264131
    Abstract: The present disclosure provides compounds with a hydrophilic self-immolative linker, which is cleavable under appropriate conditions and incorporates a hydrophilic group to provide better solubility of the compound. The compounds of the present disclosure comprise a drug moiety, a targeting moiety capable of targeting a selected cell population, and a linker which contains an acyl unit, an optional spacer unit for providing distance between the drug moiety and the targeting moiety, a peptide linker which can be cleavable under appropriate conditions, a hydrophilic self-immolative linker, and an optional second self-immolative spacer or cyclization self-elimination linker.
    Type: Application
    Filed: March 13, 2018
    Publication date: September 20, 2018
    Inventors: Rong-Hwa LIN, Shih-Yao LIN, Yu-Chi HSIEH, Chiu-Chen HUANG
  • Patent number: 10075154
    Abstract: An analog front end circuit of an optical pulse energy digitizer includes a multiphase clock circuit, a demultiplexer configured to demultiplex a current pulse stream into demultiplexed current pulse streams, and integrate-and-dump circuits coupled with the demultiplexer. Each ingrate and dump circuit is configured to convert one of the demultiplexed current pulse streams to provide a demultiplexed voltage pulse stream. The multiphase clock circuit includes latches having outputs coupled to a combination logic circuit. The combination logic circuit is configured to provide clock signals for the integrate-and-dump circuits.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: September 11, 2018
    Assignee: ROCKWELL COLLINS, INC.
    Inventor: Han Chi Hsieh
  • Publication number: 20180247904
    Abstract: The present disclosure relates to a semiconductor package and a method of manufacturing the same. In some embodiments, a semiconductor package includes a substrate, at least one die, a sealing ring and an inductor. The at least one die is mounted on the substrate and includes a plurality of component structures operating with acoustic waves. The component structures are arranged on a side of the at least one die that faces the substrate. The sealing ring is disposed between the at least one die and the substrate and surrounds the component structures. The inductor is disposed in the substrate.
    Type: Application
    Filed: February 24, 2017
    Publication date: August 30, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sheng-Chi HSIEH, Hung-Yi LIN, Cheng-Yuan KUNG, Pao-Nan LEE, Chien-Hua CHEN
  • Patent number: 10014250
    Abstract: A semiconductor device includes a substrate and at least one inductor on the substrate. The inductor includes top portions separated from one another, bottom portions separated from one another, and side portions separated from one other. Each side portion extends between one of the top portions and one of the bottom portions. A semiconductor device includes a substrate, a first patterned conductive layer on the substrate, a second patterned conductive layer, and at least one dielectric layer between the first patterned conductive layer and the second patterned conductive layer. The first patterned conductive layer defines bottom crossbars separated from each other, each bottom crossbar including a bend angle. The second patterned conductive layer defines top crossbars separated from each other, wherein each top crossbar is electrically connected to a bottom crossbar.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: July 3, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Sheng-Chi Hsieh, Chih-Pin Hung