Abstract: A display module for use as a front dashboard, a center console, a passenger entertainment display, or an instrument panel is described. The display module includes a display assembly that is joined to a cover lens via an optically clear adhesive layer. The display assembly is arranged as a flat planar device, and the cover lens is arranged as a curved planar surface that includes an inner laminate sheet that is joined to an outer laminate sheet via a second adhesive layer.

Abstract: In an embodiment, a device includes: a die stack over and electrically connected to an interposer, the die stack including a topmost integrated circuit die including: a substrate having a front side and a back side opposite the front side, the front side of the substrate including an active surface; a dummy through substrate via (TSV) extending from the back side of the substrate at least partially into the substrate, the dummy TSV electrically isolated from the active surface; a thermal interface material over the topmost integrated circuit die; and a dummy connector in the thermal interface material, the thermal interface material surrounding the dummy connector, the dummy connector electrically isolated from the active surface of the topmost integrated circuit die.

Abstract: In an approach for an API key access authorization, a processor receives a transaction identity, a part of a token, and an API key identity attribute from a server. The transaction identity is generated in the server associated with generating the token. A processor receives a request from a client with the transaction identity for the part of the token. A processor looks up a transaction table via the transaction identity as an index. The transaction identity is associated with the part of the token and the API key identity attribute. A processor retrieves a client identity attribute through a second server via an IP address of the client. The second server registers the client. A processor matches a policy via the API key identity attribute and the client identity attribute. A processor sends the part of the token to the client.

Abstract: A flexible and soft smart driving device comprises a flexible frame, a driving mechanism and a creeping structure. The driving mechanism uses an intrinsic strain of an intelligent soft material to generate a driving force. A creeping structure is used to implement autonomous activities of the flexible and soft smart driving device. The driving mechanism and the creeping structure are attached to the flexible frame. The driving mechanism generates the driving force by contraction and relaxation of a driving membrane. The flexible and soft smart driving device is made from flexible materials and has advantages of good creeping speed, flexible control, small noise and high human body compatibility.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor includes a substrate, a block bonded on the substrate, a first die bonded on the block, a second die disposed over the first die, and a heat spreader covering the block and having a surface facing toward and proximal to the block. A thermal conductivity of the heat spreader is higher than a thermal conductivity of the block.

Abstract: A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.

Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.

Abstract: A method for estimating a state of charge of a battery includes obtaining a discharge voltage and discharge capacity curve of a battery under a preset discharge current, in responding to an order for estimating the state of charge of the battery; matching the discharge voltage and discharge capacity curve with a plurality of standard curves in a database, thereby obtaining an optimal matching curve with respect to the discharge voltage and discharge capacity curve; and calculating the state of charge of the battery according to the optimal matching curve, under a preset discharge stage. The present method can accurately calculate the state of charge of the battery with simple calculation manners.

Abstract: A lighting device includes a wavelength conversion unit, a driving unit, and a light source. The wavelength conversion unit includes a main body and a fluorescent powder layer. The main body has a cylindrical outer surface. The fluorescent powder layer is disposed on the cylindrical outer surface. The driving unit is configured to drive the wavelength conversion unit to rotate around an axis. The cylindrical outer surface surrounds the axis. The light source is configured to emit light toward the fluorescent powder layer.

Abstract: In an embodiment, a device includes: a die stack over and electrically connected to an interposer, the die stack including a topmost integrated circuit die including: a substrate having a front side and a back side opposite the front side, the front side of the substrate including an active surface; a dummy through substrate via (TSV) extending from the back side of the substrate at least partially into the substrate, the dummy TSV electrically isolated from the active surface; a thermal interface material over the topmost integrated circuit die; and a dummy connector in the thermal interface material, the thermal interface material surrounding the dummy connector, the dummy connector electrically isolated from the active surface of the topmost integrated circuit die.

Abstract: A lighting device includes a wavelength conversion unit, a driving unit, and a light source. The wavelength conversion unit includes a main body and a fluorescent powder layer. The main body has a cylindrical outer surface. The fluorescent powder layer is disposed on the cylindrical outer surface. The driving unit is configured to drive the wavelength conversion unit to rotate around an axis. The cylindrical outer surface surrounds the axis. The light source is configured to emit light toward the fluorescent powder layer.

Abstract: The present disclosure provides a wavelength conversion device including a first thermal conductive plate, a wavelength conversion layer and a second thermal conductive plate. The wavelength conversion layer is disposed on the first side of the first thermal conductive plate and configured to perform a wavelength conversion. The second thermal conductive plate is disposed on the second side of the first thermal conductive plate. The first thermal conductive plate and the second thermal conductive plate are combined to conduct the heat generated by the wavelength conversion layer during the wavelength conversion. Since the thermal conductivity coefficients of the at least two thermal conductive plates are increased along the heat transferring path, it is advantageous to minimize the thermal resistance of the heat transferring path.

Abstract: A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.

Abstract: A package structure including a reconstructed wafer, a heat dissipation substrate, a semiconductor device, and a fixing mechanism is provided. The heat dissipation substrate is disposed on a side of the reconstructed wafer and includes an inlet, a base plate located between the inlet and the reconstructed wafer, and a connection member located and coupled between the inlet and the base plate. The connection member has an inclined fluid channel that descends from the inlet to the base plate. The semiconductor device is disposed on another side of the reconstructed wafer, wherein the heat dissipation substrate and the semiconductor device are respectively located on opposite sides of the reconstructed wafer. The fixing mechanism fixes the reconstructed wafer, the heat dissipation substrate, and the semiconductor device together.

Abstract: A wavelength conversion device includes a substrate, a reflective layer, a phosphor layer and a thermal conductive layer. The substrate has a surface. The reflective layer is disposed on the surface of the substrate. The phosphor layer is disposed on the reflective layer and has a conversion region configured to perform a wavelength conversion. The thermal conductive layer is disposed on the surface of the substrate and thermally directly connected to the conversion region for conducting a heat generated at the conversion region during the wavelength conversion. The thermal resistance of the reflective layer is high and causes heat in the conversion region to accumulate. By disposing the thermal conductive layer adjacent to a side of the phosphor layer, the thermal conductive layer is thermally directly connected to the conversion region, so that the heat generated at the conversion region during the wavelength conversion is efficiently dissipated.

Abstract: A wavelength conversion device includes a wavelength conversion plate, a reflective layer, a driving component and a thermal conductive layer. The wavelength conversion plate includes a lateral edge, at least one surface and a conversion region. The reflective layer is disposed on the surface of the wavelength conversion plate. The driving component is disposed near the lateral edge of the wavelength conversion plate and configured to displace the wavelength conversion plate. The thermal conductive layer is disposed on the surface of the wavelength conversion plate and thermally connected to the conversion region for conducting heat generated by the conversion region during a wavelength conversion. By disposing the thermal conductive layer on the surface of the wavelength conversion plate, the thermal conductive layer is thermally directly connected to the conversion region, so that the heat generated at the conversion region during the wavelength conversion is efficiently dissipated.

Abstract: A method of fabricating a semiconductor structure including the following steps is provided. A mask layer is formed on a semiconductor substrate. The semiconductor substrate revealed by the mask layer is anisotropically etched until a cavity is formed in the semiconductor substrate, wherein anisotropically etching the semiconductor substrate revealed by the mask layer comprises performing a plurality of first cycles and performing a plurality of second cycles after performing the first cycles, each cycle among the first and second cycles respectively includes performing a passivating step and performing an etching step after performing the passivating step. During the first cycles, a first duration ratio of the etching step to the passivating step is variable and ramps up step by step. During the second cycles, a second duration ratio of the etching step to the passivating step is constant, and the first duration ratio is less than the second duration ratio.

Abstract: The invention relates to crystalline forms of the bis-HCI salt of a compound represented by Structural Formula 1, and pharmaceutical compositions comprising crystalline forms of the bis-HCL salt of a compound represented by Structural Formula 1 described herein. The crystalline forms of the bis-HCl salt of a compound of Structural Formula 1 and compositions comprising the crystalline forms of the compound of Structural Formula 1 provided herein, in particular, crystalline Form I, crystalline Form J, crystalline Form A, and crystalline Form B, or mixtures thereof, can be incorporated into pharmaceutical compositions, which can be used to treat various disorders. Also described herein are methods for preparing the crystalline forms (e.g., Forms I, J, B and A) of the bis-HCI salt of a compound represented by Structural Formula 1.

Abstract: Provided are compositions, optionally pharmaceutical compositions, that include a plurality of exosomes generated from stem cells, optionally ESCs and/or iPSCs, that have been modified to express a granulocyte-macrophage colony stimulating factor (GM-CSF) polypeptide, optionally a human GM-CSF polypeptide. Also provided are methods for employing the presently disclosed compositions for preventing and/or inhibiting tumor growth in subjects in need thereof, for preventing and/or inhibiting metastases in subject in need thereof, for inducing anti-tumor immune responses in subjects, and uses of the presently disclosed compositions for prevention and/or treatment of tumors and/or cancers and for the preparation of medicaments for treatment of tumors and/or cancers.

Abstract: A method for machine learning deployment that comprises steps of: determining a machine learning algorithm based on a training dataset; using the machine learning algorithm to build a machine learning model based on the training dataset; creating an executable file corresponding to the machine learning model, the executable file containing programming information for a programmable circuit; and loading the executable file into the programmable circuit so as to program the programmable circuit to allow the programmable circuit to use the machine learning model to process data.