Patents by Inventor Chi Long

Chi Long has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250136650
    Abstract: Aspects of the present disclosure are directed to synthetic DNA binding peptides, as well as methods of generating such peptides and methods for use of such peptides in, for example, DNA binding, modifying gene expression, and treatment of various conditions such as cancer, fibrosis, and diabetes. Certain aspects provide synthetic DNA binding dimers comprising two modified bZIP peptides, each comprising a modified basic domain and a modified leucine zipper domain and linked via an interpeptide linker (e.g., a side-by-side interpeptide linker). Also disclosed are universal methods for generating high affinity synthetic DNA binding dimers from any bZIP protein.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 1, 2025
    Applicant: THE UNIVERSITY OF CHICAGO
    Inventors: Raymond MOELLERING, Zeyu QIAO, Scott OAKES, Shannon ELF, Marsha ROSNER, Chi Long NGUYEN
  • Patent number: 12274460
    Abstract: The present invention provides a catheter for treating occlusions in blood vessels. The catheter includes at least one electrode pair positioned inside of a flexible angioplasty balloon at the distal end of the catheter. In some designs, the electrode pairs are arranged in a low-profile or coplanar configuration, reducing the diameter of the distal end of the device and permitting treatment of tight and hard-to-cross occlusions. The flexible angioplasty balloon has an extremely low profile and does need to be folded before insertion of the catheter into the cardiovascular system. During treatment, the balloon can be expanded a relatively small amount sufficient to immerse the electrode pairs in a conductive fluid before generating shock waves across the electrodes to treat the occlusion. The balloon can be made of material having elastomeric properties such that it returns to its original low profile configuration when it is deflated following treatment.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 15, 2025
    Assignee: SHOCKWAVE MEDICAL, INC.
    Inventors: Huy Phan, Hoa Nguyen, Chi Long, Todd Jenkins
  • Patent number: 12232755
    Abstract: The present invention provides a catheter for treating occlusions in blood vessels. An exemplary catheter for treating occlusions in blood vessels comprises a tubular inner member including a base segment with a first lumen defining a fluid inlet port, and a second lumen defining a fluid outlet port. An extension segment is distal to the base segment. The extension segment has a reduced cross-section. An emitter assembly includes a first insulated wire extending through the second lumen and a second insulated wire, and a conductive sheath wrapped circumferentially around the first insulated wire, the second insulated wire, and the extension segment. A cap or balloon is sealably attached to the distal end of the catheter and surrounds the emitter assembly, said cap or balloon being fillable with conductive fluid.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: February 25, 2025
    Assignee: Shockwave Medical, Inc.
    Inventors: Huy Phan, Hoa Nguyen, Chi Long, Todd Jenkins
  • Patent number: 12183593
    Abstract: A manufacturing method for manufacturing a package structure is provided. The manufacturing method includes: (a) providing a carrier having a top surface and a lateral side surface, wherein the top surface includes a main portion and a flat portion connecting the lateral side surface, and a first included angle between the main portion and the flat portion is less than a second included angle between the main portion and the lateral side surface; (b) forming an under layer on the carrier to at least partially expose the flat portion; and (c) forming a dielectric layer on the under layer and covering the exposed flat portion.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: December 31, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia-Pin Chen, Chia Sheng Tien, Wan-Ting Chiu, Chi Long Tsai, Cyuan-Hong Shih, Yen Liang Chen
  • Publication number: 20240355763
    Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.
    Type: Application
    Filed: July 1, 2024
    Publication date: October 24, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: En Hao HSU, Kuo Hwa TZENG, Chia-Pin CHEN, Chi Long TSAI
  • Publication number: 20240268842
    Abstract: The present invention provides a catheter for treating occlusions in blood vessels. The catheter includes at least one electrode pair positioned inside of a flexible angioplasty balloon at the distal end of the catheter. In some designs, the electrode pairs are arranged in a low-profile or coplanar configuration, reducing the diameter of the distal end of the device and permitting treatment of tight and hard-to-cross occlusions. The flexible angioplasty balloon has an extremely low profile and does need to be folded before insertion of the catheter into the cardiovascular system. During treatment, the balloon can be expanded a relatively small amount sufficient to immerse the electrode pairs in a conductive fluid before generating shock waves across the electrodes to treat the occlusion. The balloon can be made of material having elastomeric properties such that it returns to its original low profile configuration when it is deflated following treatment.
    Type: Application
    Filed: April 11, 2024
    Publication date: August 15, 2024
    Applicant: Shockwave Medical, Inc.
    Inventors: Huy PHAN, Hoa NGUYEN, Chi LONG, Todd JENKINS
  • Patent number: 12027469
    Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: July 2, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: En Hao Hsu, Kuo Hwa Tzeng, Chia-Pin Chen, Chi Long Tsai
  • Patent number: 11798859
    Abstract: An electronic device package includes an encapsulated electronic component, a substrate, a conductor and a buffer layer. The encapsulated electronic component includes a redistribution layer (RDL) and an encapsulation layer. The first surface is closer to the RDL than the second surface is. The encapsulation layer includes a first surface, and a second surface opposite to the first surface. The substrate is disposed on the second surface of the encapsulation layer. The conductor is disposed between the substrate and the encapsulated electronic component, and electrically connecting the substrate to the encapsulated electronic component. The buffer layer is disposed between the substrate and the encapsulated electronic component and around the conductor.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: October 24, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia-Pin Chen, Chia-Sheng Tien, Wan-Ting Chiu, Chi Long Tsai
  • Publication number: 20230326013
    Abstract: A method for predicting epidermal growth factor receptor (EGFR) mutations in lung adenocarcinoma is provided. The method utilizes a lung adenocarcinoma EGFR mutation classification model based on a deep learning model, and performs back-propagation training on the deep learning model by using whole-slide pathological images and corresponding pathological data. The trained lung adenocarcinoma EGFR mutation classification model can determine whether a to-be-classified slide-level image with lung adenocarcinoma features have EGFR mutations.
    Type: Application
    Filed: July 13, 2022
    Publication date: October 12, 2023
    Inventors: CHENG-YU CHEN, CHI-LONG CHEN, CHAO-YUAN YEH, CHI-CHUNG CHEN, TZU-HAO CHANG
  • Publication number: 20230165598
    Abstract: The present disclosure provides a catheter for treating lesions in a body lumen, such as calcified lesions and occlusions in vasculature. The catheter can include a dual-layer electrode assembly having a first conductive sheath and a second conductive sheath arranged circumferentially therearound. In some implementations, a first conductive sheath can be a flat coil. When a voltage is applied across the conductive sheaths, current flows across an arcing region, for example, from the distal side edge of the first sheath to the distal side edge of the second sheath to produce shock waves and/or cavitation bubbles. As a treatment continues, the sheaths slowly erode at the arcing region where current flows between the sheaths. To increase the lifespan of the electrode assembly, the distal side edges of the sheaths may be shaped to promote erosion of the sheaths in a predetermined or semi-controlled pattern.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 1, 2023
    Inventors: Hoa D. NGUYEN, Anna-Elodie KERLO, Chi LONG, Hester CHAN, Huy PHAN, Leela GOEL, Tommy NGUYEN
  • Publication number: 20230115954
    Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.
    Type: Application
    Filed: October 13, 2021
    Publication date: April 13, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: En Hao HSU, Kuo Hwa TZENG, Chia-Pin CHEN, Chi Long TSAI
  • Patent number: 11554124
    Abstract: The purpose of the invention is to provide a novel hematopoiesis-promoting agent and a medicament comprising the hematopoiesis-promoting agent as an active ingredient for preventing or treating anemia, in particular refractory anemia. The present invention provides a hematopoiesis-promoting agent comprising an S-adenosylmethionine synthase inhibitor.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: January 17, 2023
    Assignee: TOHOKU UNIVERSITY
    Inventors: Kazuhiko Igarashi, Hiroki Kato, Yusho Ishii, Chi Long Nguyen, Hideo Harigae
  • Publication number: 20220384208
    Abstract: A manufacturing method for manufacturing a package structure is provided. The manufacturing method includes: (a) providing a carrier having a top surface and a lateral side surface, wherein the top surface includes a main portion and a flat portion connecting the lateral side surface, and a first included angle between the main portion and the flat portion is less than a second included angle between the main portion and the lateral side surface; (b) forming an under layer on the carrier to at least partially expose the flat portion; and (c) forming a dielectric layer on the under layer and covering the exposed flat portion.
    Type: Application
    Filed: May 27, 2021
    Publication date: December 1, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chia-Pin CHEN, Chia Sheng TIEN, Wan-Ting CHIU, Chi Long TSAI, Cyuan-Hong SHIH, Yen Liang CHEN
  • Publication number: 20220367306
    Abstract: An electronic device package includes an encapsulated electronic component, a substrate, a conductor and a buffer layer. The encapsulated electronic component includes a redistribution layer (RDL) and an encapsulation layer. The first surface is closer to the RDL than the second surface is. The encapsulation layer includes a first surface, and a second surface opposite to the first surface. The substrate is disposed on the second surface of the encapsulation layer. The conductor is disposed between the substrate and the encapsulated electronic component, and electrically connecting the substrate to the encapsulated electronic component. The buffer layer is disposed between the substrate and the encapsulated electronic component and around the conductor.
    Type: Application
    Filed: May 11, 2021
    Publication date: November 17, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chia-Pin CHEN, Chia-Sheng TIEN, Wan-Ting CHIU, Chi Long TSAI
  • Publication number: 20220183708
    Abstract: The present invention provides a catheter for treating occlusions in blood vessels. An exemplary catheter for treating occlusions in blood vessels comprises a tubular inner member including a base segment with a first lumen defining a fluid inlet port, and a second lumen defining a fluid outlet port. An extension segment is distal to the base segment. The extension segment has a reduced cross-section. An emitter assembly includes a first insulated wire extending through the second lumen and a second insulated wire, and a conductive sheath wrapped circumferentially around the first insulated wire, the second insulated wire, and the extension segment. A cap or balloon is sealably attached to the distal end of the catheter and surrounds the emitter assembly, said cap or balloon being fillable with conductive fluid.
    Type: Application
    Filed: November 29, 2021
    Publication date: June 16, 2022
    Inventors: Huy PHAN, Hoa NGUYEN, Chi LONG, Todd JENKINS
  • Publication number: 20210085347
    Abstract: The present invention provides a catheter for treating occlusions in blood vessels. The catheter includes at least one electrode pair positioned inside of a flexible angioplasty balloon at the distal end of the catheter. In some designs, the electrode pairs are arranged in a low-profile or coplanar configuration, reducing the diameter of the distal end of the device and permitting treatment of tight and hard-to-cross occlusions. The flexible angioplasty balloon has an extremely low profile and does need to be folded before insertion of the catheter into the cardiovascular system. During treatment, the balloon can be expanded a relatively small amount sufficient to immerse the electrode pairs in a conductive fluid before generating shock waves across the electrodes to treat the occlusion. The balloon can be made of material having elastomeric properties such that it returns to its original low profile configuration when it is deflated following treatment.
    Type: Application
    Filed: September 15, 2020
    Publication date: March 25, 2021
    Inventors: Huy PHAN, Hoa NGUYEN, Chi LONG, Todd JENKINS
  • Publication number: 20210030765
    Abstract: The purpose of the invention is to provide a novel hematopoiesis-promoting agent and a medicament comprising the hematopoiesis-promoting agent as an active ingredient for preventing or treating anemia, in particular refractory anemia. The present invention provides a hematopoiesis-promoting agent comprising an S-adenosylmethionine synthase inhibitor.
    Type: Application
    Filed: February 25, 2019
    Publication date: February 4, 2021
    Applicant: TOHOKU UNIVERSITY
    Inventors: Kazuhiko IGARASHI, Hiroki KATO, Yusho ISHII, Chi Long NGUYEN, Hideo HARIGAE
  • Publication number: 20190280134
    Abstract: The invention provides a method of preparing a metallization structure on a solar cell. The method includes patterning a first composition on a surface of a semiconductor substrate; and applying a second composition over the first composition. An area covered by the first composition is 5-95% of an area covered by the second composition. The semiconductor substrate is then subjected to firing conditions. The invention also provides a metallization structure formed using the method described herein.
    Type: Application
    Filed: March 22, 2018
    Publication date: September 12, 2019
    Inventors: Li Yan, Vinodh Chandrasekaran, Lei Wang, Chi Long Chen, Lin Jiang, Cuiwen Guo, Weiming Zhang, Jing (Crystal) Han
  • Patent number: 9722102
    Abstract: In general, the invention relates to electro-conductive pastes comprising a glass which comprises molybdenum and lead as a constituent of a solar cell paste, and the use of such in the preparation of photovoltaic solar cells. More specifically, the invention relates to electroconductive pastes, precursors, processes for preparation of solar cells, solar cells and solar modules. The invention relates to an electro-conductive paste at least comprising as paste constituents: a) metallic particles; b) a glass; c) an organic vehicle; and d) an additive; wherein the glass comprises the following: i) Pb in the range from about 1 to about 94 wt. %; ii) Mo in the range from about 2 to about 30 wt. %; iii) O in the range from about 1 to about 50 wt. %; with the wt. % in each case being based on the total weight of the glass.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: August 1, 2017
    Assignee: Heraeus Precious Metals North America Conshohocken LLC
    Inventors: Devidas Raskar, Xiao Chao Song, Chi Long Chen
  • Publication number: 20170141248
    Abstract: An organic vehicle comprising at least about 0.5 wt % and no more than about 45 wt % of at least one of a natural essential oil, based upon 100% total weight of the organic vehicle, at least about 0.5 wt % and no more than about 10 wt % of at least one resin, an organic solvent, and a thixotropic agent is provided. The invention also provides a solar cell and a method of forming a solar cell with the electroconductive paste of the invention.
    Type: Application
    Filed: June 19, 2015
    Publication date: May 18, 2017
    Inventors: Lixin SONG, Toong J. SNG, Chi Long CHEN, YÍ ZHANG, Vineet DUE, David KAPP, YI YANG