Abstract: In general, the invention relates to electro-conductive pastes comprising a glass which comprises molybdenum and lead as a constituent of a solar cell paste, and the use of such in the preparation of photovoltaic solar cells. More specifically, the invention relates to electroconductive pastes, precursors, processes for preparation of solar cells, solar cells and solar modules. The invention relates to an electro-conductive paste at least comprising as paste constituents: a) metallic particles; b) a glass; c) an organic vehicle; and d) an additive; wherein the glass comprises the following: i) Pb in the range from about 1 to about 94 wt. %; ii) Mo in the range from about 2 to about 30 wt. %; iii) O in the range from about 1 to about 50 wt. %; with the wt. % in each case being based on the total weight of the glass.

Abstract: An electroconductive paste composition including metallic particles, glass frit including lead oxide, silicon dioxide, and tungsten or a tungsten-containing compound, and an organic vehicle is provided. The invention also provides a solar cell produced by applying the electroconductive paste according to the invention to a silicon wafer and firing the silicon wafer. The invention further provides a solar cell module comprising electrically interconnected solar cells according to the invention. The invention also provides a method of producing a solar cell, including the steps of providing a silicon wafer having a front surface and a back surface, applying an electroconductive paste according to the invention to the silicon wafer, and firing the silicon wafer.

Abstract: A method of pairing mobile devices 102,104 is disclosed herein. In a described embodiment, the method includes (i) receiving pairing parameters from the mobile devices 102,104 to be paired, the pairing being initiated by shaking movement of the mobile devices 102,104 and the pairing parameters including respective shaking directions of the mobile devices 102,104; (ii) verifying the pairing parameters with pairing conditions to determine the two mobile devices 102,104 for pairing; (iii) determining if the shaking directions are to be used in the verification step (ii); and (iv) if the pairing conditions are satisfied, pairing the mobile devices 102,104. An apparatus for pairing mobile devices and other pairing methods are also disclosed.

Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.

Abstract: A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.

Abstract: A battery charging device with multiple power sources comprises a battery device having a battery; a power input adjusting and charging circuit connected to an external power source; a power charging control circuit for detecting voltages of the battery; a power charging device of an Ethernet power supply device having an input connected to a Ethernet power supplying device and having an output connected to a charging circuit; the charging circuit being connected to the battery device; a power charging control device for an Ethernet power supply device for controlling a charging voltage of the charging device to increase to a uniform charging voltage; and an inter-control device having a driver and a switch device; the driver being installed to the power input adjusting and charging circuit, and the switch device being installed to the power charging control device for an Ethernet power supply device.

Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.

Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, and a fourth coil connected in series with the second coil. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils.

Abstract: A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.

Abstract: A system for improving the performance of a combustion engine comprising a system control unit is disclosed. The system control unit comprises an input module, a transform module and a control module all interconnected to each other. The input module obtains a first set of combustion parameters of the engine through at least one sensor. The transform module transforms the first set of combustion parameters into a second set of combustion parameters. The control module controls fuel injection of the engine based on the second set of combustion parameters, and controls oxyhydrogen production and injection based on the second set of combustion parameters. The controlled fuel injection and the controlled oxyhydrogen production and injection contribute to an improved performance of said engine during combustion. A method of improving the performance of a combustion engine and a method of injecting oxyhydrogen into a combustion engine are also disclosed.

Abstract: A battery charging device with multiple power sources comprises a battery device having a battery; a power input adjusting and charging circuit connected to an external power source for determining the power charging of the battery; a power charging control circuit for detecting voltages of the battery for determining whether the power input adjusting and charging circuit is charged to the battery; a power charging device 4 of an Ethernet power supply device having an input connected to a Ethernet power supplying device and having an output connected to a charging circuit; the charging circuit being connected to the battery device; power charging control device 5 for an Ethernet power supply device for controlling a charging voltage of the charging device to increase to a uniform charging voltage; and an inter-control device having a driver and a switch device connected to the driver; the driver being installed to the power input adjusting and charging circuit, and the switch device being installed to the pow

Abstract: A method for manufacturing a shallow trench isolation (STI) structure is provided. In the method, a substrate is initially provided. Then, a patterned pad layer and a patterned mask layer are successively formed in order on the substrate. After that, a portion of the substrate is removed by using the patterned mask layer and the patterned pad layer as a mask to form trenches in the substrate. Next, a first insulation layer is formed in the trenches. Afterwards, a protection layer is conformally formed on the substrate. Then, a second insulation layer is formed on the protection layer above the first insulation layer. Next, the patterned mask layer and the patterned pad layer are removed. Finally, a portion of the protection layer and the second insulation layer are removed.

Abstract: A high density magnetic recording film by using a rapid thermal annealing process is provided. The high density magnetic recording film includes a substrate; and a ferromagnetic layer formed on the substrate; wherein the rapid thermal annealing process is performed for the ferromagnetic layer at a temperature range of 600 to 800° C. for 5 to 180 seconds with a heating ramp rate of 60 to 100° C./sec so as to obtain the high density magnetic recording film.

Abstract: Apparatus and method to perform therapeutic treatment and diagnosis of a patient's vasculature through the use of an intravascular device having an optical fiber disposed therein. In an embodiment of this invention, the apparatus includes a therapeutic guidewire and at least one optical fiber disposed through the therapeutic guidewire, the optical fiber capable of providing diagnostic information before, during, and after the therapeutic treatment. In an embodiment, diagnostic information includes vessel and blood characteristics such as hemodynamic characteristics, hematological parameters related to blood and blood components, and thermal parameters of the vasculature.

Abstract: The perpendicular magnetic recording medium of the present invention includes a substrate, a non-magnetic layer, a ferromagnetic layer and an antiferromagnetic oxide. The non-magnetic layer is formed on the substrate and the ferromagnetic layer is formed on the non-magnetic layer. The antiferromagnetic oxide is formed in the ferromagnetic layer after the perpendicular magnetic recording medium is annealed by an annealing process. An exchange coupling interaction between the antiferromagnetic oxide and the ferromagnetic materials is introduced.

Abstract: A wafer fabricating method at least includes the steps of providing a wafer having an active surface with a plurality of pads, forming a plurality of bumps on the pad, and forming an organic protective layer on the bump and the active surface. Besides improving the quality of the wafer, the wafer structure according to the invention is oxidation-resistant, thus avoiding the cold-joint problem when soldered to the substrate.

Abstract: A method of forming bump protective collars is disclosed. A wafer has an active surface with a plurality of bonding pads and a passivation layer. A plurality of reflowed bumps are formed over the bonding pads. A photoresist is coated on the active surface. Using the reflowed bumps as a photo mask, the photoresist is exposed and developed. After removing the photoresist, a plurality of bump protective collars are formed on the passivation layer and around the reflowed bumps for improving the reliability of the reflowed bumps.

Abstract: A method for manufacturing a shallow trench isolation (STI) structure is provided. In the method, a substrate is initially provided. Then, a patterned pad layer and a patterned mask layer are successively formed in order on the substrate. After that, a portion of the substrate is removed by using the patterned mask layer and the patterned pad layer as a mask to form trenches in the substrate. Next, a first insulation layer is formed in the trenches. Afterwards, a protection layer is conformally formed on the substrate. Then, a second insulation layer is formed on the protection layer above the first insulation layer. Next, the patterned mask layer and the patterned pad layer are removed. Finally, a portion of the protection layer and the second insulation layer are removed.

Abstract: A structure of bumps formed on an under bump metallurgy layer (UBM layer) and a method for making the same, wherein the structure includes a wafer, a UBM layer, a second photo resist and a bump. The wafer has a plurality of solder pads and a protection layer, and the protection layer covers the surface of the wafer and exposes parts of the solder pads. The UBM layer is disposed on the solder pads and the protection layers, and has an undercut structure. The second photo resist is disposed in the undercut structure. The bump is disposed on the UMB layer, so that the UMB layer will not react with the bump during a reflow process and the problem of stress concentration will be avoided so as to make the bump more stable.

Abstract: A method for forming bumps is disclosed. First, a substrate having an adhesive, a barrier, and a wetting layer thereon is provided. Next, a patterned photoresist is formed on the wetting layer, in which the patterned photoresist includes at least one opening for exposing a portion of the wetting layer. Next, a solder is deposited in the opening, and a stripping process is performed to remove the patterned photoresist. Next, a first etchant is utilized to perform a first etching process for etching a portion of the wetting and barrier layers by utilizing the solder as a mask, in which the first etchant is selected from the group consisting of: sulfuric acid, phosphoric acid, ferric chloride, ammonium persulfate, and potassium monopersulfate. Next, a second etchant is utilized to perform a second etching process removing a portion of the adhesive layer, and a reflow process is performed to form a bump.