Abstract: A wireless transceiving apparatus for audio signals comprises a bluetooth transceiver for transmitting and receiving digital signals, a bluetooth base-band unit electrically connected to the bluetooth transceiver, a processing unit electrically connected to the bluetooth base-band unit, and a codec unit electrically connected to the processing unit. The processing unit includes a first processing module for cell phone signals and a second processing module for stereo signals, and the processing priority of the first processing module is higher than the processing priority of the second processing module. The codec unit comprises an input port capable of being connected to a sound-to-voltage transducer such as a microphone, and an output port capable of being connected to a sound output device such as a headphone. The bluetooth transceiver can be coupled to an electrical device via a bluetooth transmitter.

Abstract: A wireless audio transmitter is capable of converting audio signals into wireless Bluetooth signals. The transmitter comprises an ADC converting input analog audio signals into digital signals. A CPU outputs original data complying with Bluetooth communication protocols. The original data are sequentially processed by a Bluetooth base band processor and a Bluetooth RF processor, and are converted into RF signals. Finally, the RF signals are transmitted in a wireless microwave manner by an antenna.

Abstract: Disclosed herein are various high-impedance surfaces having high capacitance and inductance properties. One exemplary high-impedance surface includes a plurality of conductive structures arranged in a lattice, wherein at least a subset of the conductive structures include a plurality of conductive plates arranged along a conductive post so that the conductive plates of one conductive structure interleave with one or more conductive plates of one or more adjacent conductive structure. Another exemplary high-impedance surface includes a plurality of conductive structures arranged in a lattice, where the conductive structures include one or more fractalized conductive plates having either indentions and/or projections that are coextensive with corresponding projections or indentations, respectively, of one or more adjacent conductive structures. Also disclosed are various exemplary implementations of such high-impedance surfaces.

Abstract: Disclosed herein are various high-impedance surfaces having high capacitance and inductance properties and methods for their manufacture. One exemplary high-impedance surface includes a plurality of conductive structures arranged in a lattice, wherein at least a subset of the conductive structures include a plurality of conductive plates arranged along a conductive post so that the conductive plates of one conductive structure interleave with one or more conductive plates of one or more adjacent conductive structure. Another exemplary high-impedance surface includes a plurality of conductive structures arranged in a lattice, where the conductive structures include one or more fractalized conductive plates having either indentions and/or projections that are coextensive with corresponding projections or indentations, respectively, of one or more adjacent conductive structures. Also disclosed are various exemplary implementations of such high-impedance surfaces.