Abstract: A prediction processing system includes a processing circuit and a reference data buffer. The processing circuit performs a first inter prediction operation upon a first prediction block in a frame to generate a first inter prediction result, and further performs a second inter prediction operation upon a second prediction block during a first period. The reference data buffer buffers a reference data derived from the first inter prediction result. The processing circuit further fetches the reference data from the reference data buffer, and performs a non-inter prediction operation according to at least the reference data during a second period, wherein the second period overlaps the first period.

Abstract: A package structure includes a carrier substrate, a circuit unit, and a packaging unit. The circuit unit includes an antenna circuit, and a conducting circuit that is flexible and that is electrically connected to the antenna circuit. At least a portion of the antenna circuit is disposed on the carrier substrate. The packaging unit is disposed on the carrier substrate by molding and encapsulates the circuit unit such that a portion of the circuit unit is exposed to permit said conducting circuit for electrical connection with the outside.

Abstract: A method for manufacturing a semiconductor device includes the following steps. A channel layer and a barrier layer are sequentially formed on a substrate by an epitaxial process to form a semiconductor device. The channel layer includes a first III-V compound and the barrier layer includes a second III-V compound. The semiconductor device is disposed within a cavity. A high-pressure fluid is introduced into the cavity to perform a passivation treatment on defects of the semiconductor device with the high-pressure fluid. The high-pressure fluid is doped with a compound composed of at least one of nitrogen, oxygen, and fluorine.

Abstract: A slurry monitoring device, a CMP system and a method of in-line monitoring a slurry are provided. The slurry monitoring device incudes a slurry metrology cell, a plurality of light sources and at least one optical detector. The slurry metrology cell is configured to accommodating a slurry. The light sources are configured to emit light beams on the slurry in the slurry metrology cell. The light sources include a first light source configured to emit a first light beam having a first wavelength, and a second light source configured to emit a second light beam having a second wavelength longer than the first wavelength. The at least one optical detector is configured to detect an intensity of the light beams scattered by abrasive particles in the slurry.

Abstract: A video processing apparatus implemented in a chip includes an on-chip prediction buffer and a processing circuit. The on-chip prediction buffer is shared by a plurality of coding tools for prediction, and is used to store reference data. The processing circuit supports the coding tools for prediction, reads a plurality of first reference data from the on-chip prediction buffer as input data of a first coding tool that is included in the coding tools and enabled by the processing circuit, and writes output data of the first coding tool enabled by the processing circuit into the on-chip prediction buffer as a plurality of second reference data.

Abstract: A thin profile gas transporting device includes a gas collecting plate, a valve sheet, a discharge sheet, and a gas pump. The gas pump is disposed on the gas collecting plate. The gas collecting plate, the valve sheet, and the discharge sheet are stacked and assembled sequentially. Through simplifying the structures of the gas collecting plate and the discharge sheet, the thicknesses of the gas collecting plate and the discharge sheet can be reduced. Moreover, through the arrangement of several pressure relief holes, the pressure relieving operation can be performed rapidly and quietly.

Abstract: A tire pressure monitoring system and tire pressure detector setting apparatus for tractor-trailer are disclosed. The tractor-trailer has a tractor and a trailer having a plurality of wheels, respectively. The tire pressure monitoring system includes a plurality of tire pressure detectors and a monitoring device. The tire pressure detectors are disposed on each of the wheels, detecting the tire pressure status of each wheel and generating a tire pressure information. Each tire pressure detector has a wheel code corresponding to one of the wheels, respectively. The monitoring device is disposed on the tractor for receiving the tire pressure information and the wheel codes of the corresponding tire pressure detector. When the tire pressure information and the wheel code are transmitted to the monitoring device, the monitoring device accurately monitors the tire pressure status of each wheel.

Abstract: A cycloid speed reducer includes an input shaft, a rolling assembly, first and second cycloid discs, a crankshaft and an output disc. The first and second cycloid discs are disposed around the input shaft and driven by the input shaft. The first and second cycloid discs are located at two opposite sides of the rolling assembly, respectively. The crankshaft includes first and second eccentric ends and first and second concentric ends integrally formed as a one-piece structure and arranged sequentially. The first and second eccentric ends are linked with the first and second cycloid discs respectively. An eccentricity value is between any neighboring two of the concentric and eccentric ends. The diameters of all the concentric and eccentric ends are equal. The output disc is linked with the first or second concentric end. The output disc is a power output end of the cycloid speed reducer.

Abstract: The present disclosure provides a method of forming an interconnect structure. The method includes forming a metal layer over a substrate, the metal layer including a first metal; forming a capping layer on the metal layer; patterning the capping layer and the metal layer, thereby forming trenches in the metal layer; depositing a first dielectric layer in the trenches; removing the capping layer, resulting in the first dielectric layer protruding from a top surface of the metal layer; depositing a second dielectric layer over the first dielectric layer and the metal layer; forming an opening in the second dielectric layer, thereby partially exposing the top surface of the metal layer; and forming a conductive feature in the opening and in electrical coupling with the metal layer, the conductive feature including a second metal.

Abstract: In an embodiment, a method includes: forming a differential contact etch stop layer (CESL) having a first portion over a source/drain region and a second portion along a gate stack, the source/drain region being in a substrate, the gate stack being over the substrate proximate the source/drain region, a first thickness of the first portion being greater than a second thickness of the second portion; depositing a first interlayer dielectric (ILD) over the differential CESL; forming a source/drain contact opening in the first ILD; forming a contact spacer along sidewalls of the source/drain contact opening; after forming the contact spacer, extending the source/drain contact opening through the differential CESL; and forming a first source/drain contact in the extended source/drain contact opening, the first source/drain contact physically and electrically coupling the source/drain region, the contact spacer physically separating the first source/drain contact from the first ILD.

Abstract: A semiconductor device includes a substrate and a first transistor on a first side of the substrate. The semiconductor device further includes a first electrode contacting a first region of the first transistor. The semiconductor device further includes a spacer extending along a sidewall of the first transistor. The semiconductor device further includes a self-aligned interconnect structure (SIS) separated from at least a portion of the first electrode by the spacer, wherein the SIS extends through the substrate. The semiconductor device further includes a second electrode contacting a surface of the first electrode farthest from the substrate, wherein the second electrode directly contacts the SIS.

Abstract: An ultrasonic sensing device includes a housing, a piezoelectric assembly, a board and a plurality of fixing members. The housing includes a bottom wall, a top wall and a surrounding side wall connected between the top wall and the bottom wall. The piezoelectric assembly includes an encapsulating body and a piezoelectric sheet, wherein at least a portion of the piezoelectric sheet is enclosed by the encapsulating body and has a sensing surface exposed to the encapsulating body and facing the bottom wall. The board is disposed on the top wall of the housing and has a pressing surface facing the encapsulating body and the top wall. The plurality of fixing members is configured to fix the board to the top wall of the housing to press the board to the encapsulating body of the piezoelectric assembly, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.

Abstract: A semiconductor device includes a substrate and a first active region on a first side of the substrate. The semiconductor device further includes a first gate structure surrounding a first portion of the first active region. The semiconductor device further includes a second active region on a second side of the substrate, wherein the second side is opposite the first side. The semiconductor device further includes a second gate structure surrounding a first portion of the second active region. The semiconductor device further includes a gate via extending through the substrate, wherein the gate via directly connects to the first gate structure, and the gate via directly connects to the second gate structure.

Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, and a stiffener ring mounted on the top surface of the package substrate. The stiffener ring includes a reinforcement rib that is coplanar with the stiffener ring on the top surface of the package substrate. At least two compartments are defined by the stiffener ring and the reinforcement rib. At least two individual chip packages are mounted on chip mounting regions within the at least two compartments, respectively, thereby constituting a package array on the package substrate.

Abstract: The air compression system includes an air compressor and a detection device. A first pressure transducer is provided to measure an air pressure at an output port of the air compressor. A second pressure transducer in the detection device measures an air pressure in a channel of the detection device. A conduit in the detection device regulates an air flow to be compatible with that flowing through the inlet of the aerated object. The measurements from the first pressure transducer and the second pressure transducer are transmitted to and compared by a first control circuit of the air compressor, and an internal pressure of the aerated object is estimated. When the estimated internal pressure of the aerated object is smaller than a desired pressure, the air compressor pumps air into the object through the conduit of the detection device in a linear manner.

Abstract: A wear-preventive air-charger piston structure is provided. The piston rod has a top forming a piston top seat on which a piston ring is disposed. The piston ring is covered with a top cover that is combined with the piston top seat. The top cover is provided with an airtight plate mounted thereto to form a complete piston structure. A buffering element is arranged between the piston top seat and the piston ring. The buffering element has an outside diameter smaller than the piston ring, so that when the piston ring, which is driven by a crankshaft to do an up-and-down movement, is put in an inclined oscillating condition and at a high position of an oscillation side, the buffering element functions to absorb the stress acting on the piston ring at the high position of the oscillation side to effectively prevent detachment and breaking of the piston ring.

Abstract: A wear-preventive air-charger piston structure is provided. The piston rod has a top forming a piston top seat on which a piston ring is disposed. The piston ring is covered with a top cover that is combined with the piston top seat. The top cover is provided with an airtight plate mounted thereto to form a complete piston structure. A buffering element is arranged between the piston top seat and the piston ring. The buffering element has an outside diameter smaller than the piston ring, so that when the piston ring, which is driven by a crankshaft to do an up-and-down movement, is put in an inclined oscillating condition and at a high position of an oscillation side, the buffering element functions to absorb the stress acting on the piston ring at the high position of the oscillation side to effectively prevent detachment and breaking of the piston ring.

Abstract: A method for identifying a body region in a medical image includes obtaining a medical image including a number of consecutive bio-section images, inputting the medical image into a preset machine learning model to obtain a numerical value for each of the bio-section images corresponding to the body region to which the bio-section image belongs, determining whether the numerical values of the medical image are abnormal, adjusting the numerical values when the numerical values are abnormal, determining the body region corresponding to the numerical values or the adjusted numerical values, and labeling the body region in the medical image and outputting the labeled medical image. The bio-section images are cross-sectional images of a living body.

Abstract: An automatic pressure detection device of an inflation machine includes an inflation machine and an inflation control module. A first connector of a connection pipe connected to the inflation machine is connected in sequence to a first hose line and a nozzle in order to charge gas into an object-to-be-inflated (such as a tire) for inflation. A second connector of the connection pipe connected to the inflation machine is connected in sequence to a valve core passage element of the inflation control module, a regulation and control valve, and a pressure transducer, and the pressure transducer is electrically connected to a circuit board. The valve core passage element and the nozzle are arranged to have the same flow so that the inflation control module may simulate a flow of gas charged into an object-to-be-inflated.

Abstract: The air compression system includes an air compressor and a detection device. A first pressure transducer is provided to measure an air pressure at an output port of the air compressor. A second pressure transducer in the detection device measures an air pressure in a channel of the detection device. A conduit in the detection device regulates an air flow to be compatible with that flowing through the inlet of the aerated object. The measurements from the first pressure transducer and the second pressure transducer are transmitted to and compared by a first control circuit of the air compressor, and an internal pressure of the aerated object is estimated. When the estimated internal pressure of the aerated object is smaller than a desired pressure, the air compressor pumps air into the object through the conduit of the detection device in a linear manner.