Abstract: The present invention generally relates to a hydroponic culture medium and a hydroponic planting system, more particularly to a Houttuynia cordata hydroponic culture medium, a Houttuynia cordata hydroponic planting system, Houttuynia cordata extracts, a method, and applications thereof. The Houttuynia cordata hydroponic culture medium includes a plant fertilizer and a Houttuynia cordata growth-promoting additive. The Houttuynia cordata growth-promoting additive is selected from the group consisting of: vitamin B complex, seaweed essence, amino acid, microorganism, and a combination thereof. An electronic conductivity of the Houttuynia cordata hydroponic culture medium is between 0.4 ms/cm and 2.0 ms/cm.

Abstract: The present disclosure provides a correction system and method for correcting a semiconductor circuit. The correction system includes a plurality of redundant circuit units, a plurality of switching circuit units and a control circuit. The redundant circuit units are coupled to the semiconductor circuit. The switching circuit units are coupled to the redundant circuit units and a plurality of basic circuit units of the semiconductor circuit. The control circuit is coupled to the semiconductor circuit and the switching circuit units, is configured to obtain a noise signal of the semiconductor circuit, is configured to determine whether the semiconductor circuit passes a noise test by recognizing a characteristic of the noise signal, and is configured to replace one of the basic circuit units with one of the redundant circuit units by controlling the switching circuit units when the semiconductor circuit does not pass the noise test.

Abstract: A method of displaying a rear-view image and a digital dashboard using the method are provided. The method includes: receiving a rear-view image; and displaying the rear-view image on a default area of a display in response to receiving a signal associated with a direction indicator light, wherein the default area corresponds to the direction indicator light.

Abstract: Disclosed is an adjustable cryoablation needle, comprising a needle rod (3), a front-segment heat-insulated tube (1), a rear-segment heat-insulated tube (2), and an gas inlet structure (7) penetrating the needle rod (3) and the front-segment heat-insulated tube (1), wherein the needle rod (3) can move relative to the rear-segment heat-insulated tube (2) in the axial direction of the rear-segment heat-insulated tube (2) so as to adjust a first axial distance between the front end of the rear-segment heat-insulated tube (2) and the front end of the needle rod (3); and the front-segment heat-insulated tube (1) can move relative to the rear-segment heat-insulated tube (2) in the axial direction of the rear-segment heat-insulated tube (2). The adjustable cryoablation needle can prevent the inconvenience caused by a doctor selecting the model of the cryoablation needle.

Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Abstract: A projection device includes a light source module, a display panel, a freeform-surface reflective mirror, and a projection lens. The light source module includes a light source, a first Fresnel lens element, and a second Fresnel lens element. The first Fresnel lens element and the second Fresnel lens element are parallel to each other and located between the light source and the display panel. The display panel is arranged between the light source module and the freeform-surface reflective mirror. The projection lens is configured to transmit an image beam out of the projection device, and a direction of an optical axis of the projection lens is different from a direction of a normal of the first Fresnel lens element.

Abstract: A voice-activated light system that includes a microphone for receiving one or more voice commands (which may be referred to as a “voice microphone”), one or more light sources (such as LEDs) coupled to a controller and a light driver. The light driver is for driving the light sources and the controller is for detecting a voice command in order to control the mode of operation of the one or more light sources. The controller can have multiple control commands each for selecting a different mode of operation of the light source(s). The modes can be controlled by a common voice input term followed by a second voice command corresponding to a mode of operation of the light source. The system may include a second microphone which may be referred to herein as a “music microphone”. The commands can include “light show,” “slow pulse,” “steady on,” “blinking,” or “off”.

Abstract: Provided is an organic light-emitting material. The light-emitting material is a series of metal complexes containing a ligand(s) based on isoquinoline which is substituted with deuterium at 3- and 4-position and a ligand(s) based on acetylacetone. The compounds can be used as the light-emitting material in an emissive layer of an organic electroluminescent device. These novel compounds can provide better device performance. Further provided are an electroluminescent device and a compound combination including the light-emitting material.

Abstract: A data processing system is for uploading an upload data, wherein the upload data comprises a data content and a table name. The data processing system comprises a relational database; a NoSQL database; a data processing unit, coupled to the relational database and the NoSQL database, configured to execute a program code; and a storage unit, coupled to the data processing unit, configured to store the program code to instruct the data processing unit to execute a data processing method. The data processing method comprises determining a structure type of the upload data according to the data content; determining a first table of a first database according to the structure type, the data content and the table name of the upload data; and storing the upload data in the first table of the first database; wherein the first database is the relational database or the NoSQL database.

Abstract: A computer-assisted needle insertion method is provided. The computer-assisted needle insertion method includes the following steps. A first machine learning model and a second machine learning model are obtained. A computed tomography image and a needle insertion path are obtained, a suggested needle insertion path is generated according to the first machine learning model, the computed tomography image, and the needle insertion path, and the needle is instructed to approach a needle insertion point on a skin of a target. The needle insertion point is located on the suggested needle insertion path. A breath signal of the target is obtained, and whether a future breath state of the target is normal is estimated according to the second machine learning model and the breath signal. A suggested needle insertion period is output according to the breath signal in response to determining that the future breath state is normal.

Abstract: An optical element driving system is provided. The optical element driving system includes an optical element driving mechanism and a control assembly. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used for connecting to an optical element. The movable portion is movable relative to the fixed portion. The movable portion is in an accommodating space in the fixed portion. The driving assembly is used for driving the movable portion to move relative to the fixed portion. The control assembly provides a driving signal to the driving assembly to control the driving assembly. The driving assembly includes a first driving element, and the material of the first driving element includes shape memory alloy.

Abstract: An improved work function layer and a method of forming the same are disclosed. In an embodiment, the method includes forming a semiconductor fin extending from a substrate; depositing a dielectric layer over the semiconductor fin; depositing a first work function layer over the dielectric layer; and exposing the first work function layer to a metastable plasma of a first reaction gas, a metastable plasma of a generation gas, and a metastable plasma of a second reaction gas, the first reaction gas being different from the second reaction gas.

Abstract: The present disclosure provides a data processing method, a device, a computer apparatus and a storage medium, wherein the method includes: in response to a target disk receiving at least one write request within a preset time period, determining a size threshold value for classifying a data update type according to a size of write data respectively indicated by each write request; determining a data update type corresponding to each write request according to a size of each write request and the size threshold value; dividing write data of the write request to obtain a data block according to a preset data block size, and caching the data block in a cache region of the target disk corresponding to the data update type, the target disk has multiple types of cache regions configured therein, different cache regions are configured to support caching of data with different update frequencies.

Abstract: A light-emitting diode (LED) packaging module includes a plurality of LED chips spaced apart from one another, an encapsulating layer that fills in a space among the LED chips, a light-transmitting layer disposed on the encapsulating layer, a wiring assembly disposed on and electrically connected to the LED chips, and an insulation component that covers the encapsulating layer and the wiring assembly. Each of the LED chips includes an electrode assembly including first and second electrodes. The light-transmitting layer includes a light-transmitting layer that has a light transmittance greater than that of the encapsulating layer.

Abstract: A bracket structure, a bracket module, and a wall mount module are proposed. The bracket structure includes a board and two sideboards. The two sideboards are connected to two sides of the board respectively. A virtual connection line is extended between the two sideboards. A gap is between the virtual connection line and a first surface of the board. The two sideboards include a first sideboard and a second sideboard. The first sideboard includes an extension part, and a groove is formed between the extension part and the board. The second sideboard includes a fastening part. Thus, the bracket structure of the present disclosure can be applied to various types of wall mount supports.

Abstract: Some implementations described herein provide techniques and apparatuses for an integrated circuit device including a trench capacitor structure that has a merged region. A material filling the merged region is different than a material that is included in electrode layers of the trench capacitor structure. Furthermore, the material filling the merged region includes a coefficient of thermal expansion and a modulus of elasticity that, in combination with the architecture of the trench capacitor structure, reduce thermally induced stresses and/or strains within the integrated circuit device relative to another integrated circuit device having a trench capacitor structure including a merged region and electrode layers of a same material.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a substrate comprising first opposing sidewalls defining a first trench and second opposing sidewalls defining a second trench laterally offset from the first trench. A stack of layers comprises a plurality of conductive layers and a plurality of dielectric layers alternatingly stacked with the conductive layers. The stack of layers comprises a first segment in the first trench and a second segment in the second trench. A first lateral distance between the first segment and the second segment aligned with a first surface of the substrate is greater than a second lateral distance between the first segment and the second segment below the first surface of the substrate.

Abstract: A method for permission management includes: generating a plurality of job roles with different permissions according to organization permission table; generating first permission structure directed graph according to the job roles; selecting one of the job roles in first permission structure directed graph as target job role; generating minimum directed spanning graph in first permission structure directed graph according to target job role; determining whether permission of each of the job roles in first permission structure directed graph matches job of each of the job roles in first permission structure directed graph; and adjusting permission and job of each of the job roles to generate second permission structure directed graph if it is determined that permission of each of the job roles in first permission structure directed graph does not match job of each of the job roles in first permission structure directed graph.

Abstract: A light-emitting device includes a number (N) of light-emitting units, a number (a) of first metal pads and a number (b) of second metal pads. Each of the light-emitting units includes a number (n) of light-emitting chips each having two distinct terminals, where N and n are integers and N>1, n>?3. The numbers (a) and (b) are integers and a>1, b>1, and the terminals of each of the light-emitting chips are electrically connected to a unique combination of one of the number (a) of first metal pads and a number (b) of second metal pads, respectively. The numbers (N), (n), (a) and (b) satisfy the equation: a*b=n*N.