Patents by Inventor Chi Wu
Chi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250147108Abstract: A battery resistance measuring method, applied to a battery with a battery resistance, comprising: (a) acquiring charge variation of the battery for a measuring time interval; (b) acquiring a voltage difference between a first battery voltage and a second battery voltage for the measuring time interval, wherein the first battery voltage is a battery voltage with loading and the second battery voltage is a battery voltage without loading; and (c) computing a battery resistance according to the charge variation and the voltage difference, and updating the battery resistance to a battery resistance table of the battery. The above-mentioned steps (a), (b) and (c) may be performed by the electronic device, which can be a mobile electronic device such as a mobile phone or a plate computer.Type: ApplicationFiled: November 7, 2023Publication date: May 8, 2025Applicant: MEDIATEK INC.Inventors: Jia-You Chuang, Jui-Chi Wu, Kuan-Yu Chen
-
Publication number: 20250149439Abstract: A device includes a semiconductor substrate, an active region over the semiconductor substrate extending lengthwise in a first direction, a gate structure over the active region extending lengthwise in a second direction perpendicular to the first direction, a source feature and a drain feature on the active region and interposed by the gate structure, a source contact on the source feature, a drain contact on the drain feature, and a via rail over the substrate spaced from the active region. The via rail includes a main portion extending lengthwise in the first direction having a sidewall surface facing opposite the end surface of the drain contact, and a jog via extending from the main portion along the second direction and having a sidewall surface facing the second direction, each of the main portion and the jog via contacting the source contact.Type: ApplicationFiled: January 13, 2025Publication date: May 8, 2025Inventors: Hao Kuang, Tung-Heng Hsieh, Sheng-Hsiung Wang, Bao-Ru Young, Wang-Jung Hsueh, Pang-Chi Wu
-
Patent number: 12290827Abstract: Systems and methods are provided for securement of parts. One embodiment is a method for securing a part during fabrication. The method includes forming an interference fit between a pin and a wall defining a hole, supporting a weight of the part with the interference fit, and rotating the part around an axis of the part while the weight of the part is supported.Type: GrantFiled: August 3, 2020Date of Patent: May 6, 2025Assignee: The Boeing CompanyInventors: John Shinozaki, Jerry Deming Chungbin, Steven Kuan-chi Wu
-
Patent number: 12293521Abstract: Methods, systems, and apparatuses for image segmentation are provided. For example, a computing device may obtain an image, and may apply a process to the image to generate input image feature data and input image segmentation data. Further, the computing device may obtain reference image feature data and reference image classification data for a plurality of reference images. The computing device may generate reference image segmentation data based on the reference image feature data, the reference image classification data, and the input image feature data. The computing device may further blend the input image segmentation data and the reference image segmentation data to generate blended image segmentation data. The computing device may store the blended image segmentation data within a data repository. In some examples, the computing device provides the blended image segmentation data for display.Type: GrantFiled: September 1, 2022Date of Patent: May 6, 2025Assignee: QUALCOMM IncorporatedInventors: Chung-Chi Tsai, Shubhankar Mangesh Borse, Meng-Lin Wu, Venkata Ravi Kiran Dayana, Fatih Murat Porikli, An Chen
-
Publication number: 20250140642Abstract: A thermoelectric cooler (TEC) is positioned to move heat away from a hot spot on a semiconductor chip and toward a dielectric substrate. This approach to thermal management is particularly effective when used in conjunction with a buried rail and back side power delivery. The TEC may be in a layer that contains solder connections be between two device layers an IC package. Alternatively, the TEC may be in a metal interconnect structure over the semiconductor substrate such as in a passivation stack at the top of the metal interconnect structure. TECs at either of these locations may be formed by wafer-level processing.Type: ApplicationFiled: March 6, 2024Publication date: May 1, 2025Inventors: Cheng-Ming Lin, Che Chi Shih, Wei-Yen Woon, Szuya Liao, Isha Datye, Sam Vaziri, Po-Yu Chen, Cheng Hung Wu, Wei-Pin Changchien, Xinyu Bao
-
Publication number: 20250139372Abstract: An apparatus for analyzing emotions of diaries and generating feedback response on diaries is provided. The apparatus includes a recorder, a negative-text analysis module, a positive-text adding module, and a visualization module. The recorder is configured to receive and store a text article. The negative-text analysis module is configured to analyze the text article and determine a negativity level and generate a basis for judgment according to an analyzing result with respect to the text article. The positive-text adding module is configured to receive the basis from the negative-text analysis module, generate feedback response that is positively oriented relative to the text article, and combine the text article with the feedback response to form a content. The visualization module is configured to visualize the content for creating a visual image.Type: ApplicationFiled: October 30, 2023Publication date: May 1, 2025Inventors: Yanjie SONG, Chi-Kin John LEE, Kaiyi WU, Qing LI
-
Patent number: 12288740Abstract: According to various examples, a device is described. The device may include a first package substrate. The device may also include a first mold layer with a first thickness. The device may also include a second mold layer with a second thickness proximal to the first mold layer. The second thickness may be larger than the first thickness. The first mold layer may include a plurality of first interconnects coupled to the first package substrate. The second mold layer may include a plurality of second interconnects configured to couple the first package substrate to a printed circuit board.Type: GrantFiled: July 6, 2021Date of Patent: April 29, 2025Assignee: Intel CorporationInventors: Bok Eng Cheah, Chia Chuan Wu, Jackson Chung Peng Kong, Kooi Chi Ooi
-
Publication number: 20250132162Abstract: A semiconductor substrate processing method includes: providing a substrate to be processed, where the substrate to be processed has a side to be processed and a bonding side which are opposite to each other; providing a hole supply substrate; and bonding the hole supply substrate to the bonding side of the substrate to be processed by a wafer bonding process so as to obtain a substrate pair, and performing a material process. By the semiconductor substrate processing method, the purpose of rapid electrochemical etching can be achieved.Type: ApplicationFiled: April 12, 2024Publication date: April 24, 2025Inventors: Tien-Hsi LEE, CHUN-HUANG WU, YU-SHENG CHIOU, SHU-CHENG LI, JING-SYONG HUANG, GUAN-YU LIN, WEI-CHI HUANG
-
Publication number: 20250133688Abstract: This disclosure provides a heat dissipation assembly and an electronic device. The heat dissipation assembly includes a first fan, a first fin assembly, a second fan, a second fin assembly, a vapor chamber and a heat dissipation sheet. The second fan has a second inlet, at least one second outlet and a side outlet. The at least one second outlet and the side outlet are in fluid communication with the second inlet. A direction of the side outlet directs toward the first fan. The vapor chamber is thermally coupled to the first fin assembly and the second fin assembly. The heat dissipation sheet is in thermal contact with a side of the vapor chamber, and located between the first fan and the second fan.Type: ApplicationFiled: December 28, 2023Publication date: April 24, 2025Applicants: MICRO-STAR INT’L CO., LTD., MSI ELECTRONIC (KUN SHAN) CO., LTD.Inventors: Chia-Ming CHANG, Ching-Chi WU
-
Publication number: 20250124694Abstract: The present application provides a medical image recognition method. The method includes obtaining a fundus image. A feature extraction model is invoked to extract features from the fundus image to obtain a fundus feature map. Once the fundus feature map is input into an attention mechanism model to obtain an attention-weighted feature map, a classification model is invoked to classify the attention-weighted feature map to obtain a target disease label of the fundus image. The present application also provides a method for training a medical image recognition model and an electronic device.Type: ApplicationFiled: July 30, 2024Publication date: April 17, 2025Inventors: SHENG-CHI WENG, Han-Wei Wu, Chan-Pang Kuok
-
Patent number: 12278166Abstract: A method according to the present disclosure includes providing a first workpiece that includes a first substrate and a first interconnect structure, providing a second workpiece that includes a second substrate, a second interconnect structure, and a through via extending through a portion of the second substrate and a portion of the second interconnect structure, forming a first bonding layer on the first interconnect structure, forming a second bonding layer on the second interconnect structure, bonding the second workpiece to the first workpiece by directly bonding the second bonding layer to the first bonding layer, thinning the second substrate, forming a protective film over the thinned second substrate, forming a backside via opening through the protective film and the thinned second substrate to expose the through via, and forming a backside through via in the backside via opening to physically couple to the through via.Type: GrantFiled: June 2, 2022Date of Patent: April 15, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Harry-Haklay Chuang, Wen-Tuo Huang, Wei-Cheng Wu, Yu-Ling Hsu, Pai Chi Chou, Ya-Chi Hung
-
Patent number: 12271654Abstract: An audio dose monitoring circuit includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.Type: GrantFiled: March 10, 2022Date of Patent: April 8, 2025Assignee: REALTEK SEMICONDUCTOR CORP.Inventors: Yu Wei Liu, Chi Wu, Chia Chun Hung
-
Publication number: 20250108114Abstract: Provided is an isolated nucleic acid molecule comprising a NKp30 transmembrane domain, and a chimeric antigen receptor comprising the same. The isolated nucleic acid molecule comprising a NKp30 transmembrane domain comprises nucleic acid sequences encoding (a) an extracellular antigen binding domain, comprising a heavy chain variable region; (b) a hinge domain; (c) a NKp30 transmembrane domain; and (d) a NKp30 cytoplasmic domain. By introducing nucleic acid sequences of the NKp30 transmembrane domain and the NKp30 cytoplasmic domain in combination with the extracellular antigen binding domain into a T cell, the resulting CAR-T cell is a multi-chain CAR-T cell with a NKp30 receptor complex. Consequently, the resulting CAR-T cell forms stable immune synapses with cancer cells and exhibits excellent cytotoxicity against cancer cells.Type: ApplicationFiled: September 26, 2024Publication date: April 3, 2025Inventors: Felix HSU, Wei-Chi LIN, Wen-Ting WU, Chen-Lung LIN
-
Patent number: 12266577Abstract: A semiconductor structure can include a high voltage region, a first moat trench isolation structure electrically insulating the high voltage region from low voltage regions of the semiconductor structure, and a second moat trench isolation structure electrically insulating the high voltage region from the low voltage regions of the semiconductor structure. The first moat trench isolation structure can include dielectric sidewall spacers and a conductive fill material portion located between the dielectric sidewall spacers. The second moat trench isolation structure can include only at least one dielectric material, and can include a dielectric moat trench fill structure having a same material composition as the dielectric sidewall spacers and having a lateral thickness that is greater than a lateral thickness of the dielectric sidewall spacers and is less than twice the lateral thickness of the dielectric sidewall spacers.Type: GrantFiled: August 10, 2022Date of Patent: April 1, 2025Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Hung-Ling Shih, Tsung-Yu Yang, Yun-Chi Wu, Po-Wei Liu
-
Patent number: 12266852Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.Type: GrantFiled: January 2, 2024Date of Patent: April 1, 2025Assignee: INNOLUX CORPORATIONInventors: Chia-Ping Tseng, Ker-Yih Kao, Chia-Chi Ho, Ming-Yen Weng, Hung-I Tseng, Shu-Ling Wu, Huei-Ying Chen
-
Patent number: 12268054Abstract: An electronic device and a display panel are provided. The display panel includes a substrate, a light-emitting unit, a blocking structure and an encapsulation layer. The substrate has a through hole, a display area, and a non-display area disposed between the through hole and the display area. The light-emitting unit is arranged on the display area. The blocking structure is arranged on the non-display area. The encapsulation layer extends from the display area to the non-display area, and includes an organic layer and a first inorganic layer. A portion of the organic layer is disposed between the blocking structure and the first inorganic layer.Type: GrantFiled: May 24, 2022Date of Patent: April 1, 2025Assignee: Innolux CorporationInventors: Yuan-Lin Wu, Mei-Chi Hsu, Meng-Kai Huang
-
Publication number: 20250106743Abstract: An out-of-service recovery search method includes establishing a frequency list including at least one searchable frequency, searching a suitable cell of a network according to the frequency list when the user terminal is in an out-of-service state, determining at least one first skip condition of the user terminal, performing a full-band power scan mechanism for scanning received signal strength indication (RSSIs) of user terminal supported frequency bands when the at least one first skip condition of the user terminal is absent and no suitable cell of the network is searched within the searchable frequency of the frequency list, skipping the full-band power scan mechanism when the at least one first skip condition of the user terminal is present and no suitable cell of the network is searched within the searchable frequency, and performing an RSSI sniffer for scanning a signal power of each frequency of the searchable frequency.Type: ApplicationFiled: September 24, 2024Publication date: March 27, 2025Applicant: MEDIATEK INC.Inventors: Jia-Hao Wu, Tzyuan Shiu, Da-Wei Wang, Lu-Chi Lin, Mu-Chi Fang, Wen-Yang Chou, Tsung-Sheng Tang, Chung-Pi Lee
-
Publication number: 20250100917Abstract: A treatment method for waste water is provided. The method includes providing the waste water. The waste water includes monoethanolamine, and COD of the wastewater is in a range between 5000 mg/L and 30000 mg/L. The method further includes adjusting pH value of the wastewater to be not smaller than 11.5; transferring the wastewater to a tank, and controlling a temperature of the tank to 20° C. to 32° C.; and adding hydrogen peroxide solution and ozone into the tank, thereby obtaining degraded waste water. By controlling treatment condition of the waste water, the waste water with the monoethanolamine and high COD can be degraded by using the hydrogen peroxide solution and the ozone.Type: ApplicationFiled: September 20, 2024Publication date: March 27, 2025Inventors: Kuan-Hung WU, Wen-Hsien TSAI, Yi-Kuo CHANG, Yuan-Hung LIU, Yu-Chi CHANG
-
Patent number: D1072151Type: GrantFiled: January 11, 2024Date of Patent: April 22, 2025Assignee: Fourstar Group Inc.Inventor: Yu Chi Wu
-
Patent number: D1073220Type: GrantFiled: December 23, 2022Date of Patent: April 29, 2025Assignee: Starbucks CorporationInventors: Claudia Ying Yu Lee, Hau Yan Lai, Ming Yim Wu, Wing Chi Tam, Sheryl Wing Yan Tu