Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.

Abstract: A sensor includes a housing having a accommodating room, a flexible plate provided in the accommodating room and moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component for sensing the pressure change. The pressure sensing component and the flexible plate are assembled and moveable together. In the sensor of the present invention, after an external signal to be sensed is transmitted to the sensor, the flexible plate moves to induce air disturbances, and then the pressure sensing component receives a pressure change induced by the air disturbances and performs signal sensing. Compared with the conventional sound sensor, the sensor of the present invention provides no opening communicating with the external environment. Therefore, the impact of foreign objects, noise and other environmental factors on the sensor can be avoided, and the signal generated by the object not to be sensed can be effectively reduced.

Abstract: A pixel driving device includes a capacitance, a reset circuit, a compensation circuit, a driving transistor and a first transistor. Reset circuit and compensation circuit are coupled to a first end and a second end of capacitance. First transistor is coupled between second end of driving transistor and second end of capacitance. Reset circuit resets first end of capacitance at a power supply voltage and reset second end of capacitance at a reference voltage according to a first sweep signal respectively. Compensation circuit writes a data voltage into first end of capacitance via driving transistor and second end of capacitance is maintained at reference voltage according to a second sweep signal. First transistor generates a driving voltage difference between first end and second end of capacitance according to a control signal. Driving transistor outputs a current to a luminous element according to driving voltage difference.

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate joined with an insert molding plastic part, and a protective treatment layer on the light metal substrate and the insert molding plastic part. A transparent primer coating on the protective treatment layer, and a paint coating on the transparent primer coating. A milled edge along the insert molding plastic part, wherein the milled edge cuts through the paint coating to expose the transparent primer coating.

Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.

Abstract: Example of backlit switches are described. In an example, a backlit switch includes a printed circuit board (PCB) and a dome-type button coupled to the PCB. The dome-type button has a light transmitting portion. A light source is mounted on a first side of the PCB, and a tact switch is mounted on a second side of the PCB that is opposite to the first side. Further, a projection is provided to trigger the tact switch, in response to pressing of the dome-type button.

Abstract: A semiconductor package includes a circuit substrate, a die, a frame structure, a heat sink lid and conductive balls. The die is disposed on a front surface of the circuit substrate and electrically connected with the circuit substrate. The die includes two first dies disposed side by side and separate from each other with a gap between two facing sidewalls of the two first dies. The frame structure is disposed on the front surface of the circuit substrate and surrounding the die. The heat sink lid is disposed on the die and the frame structure. The head sink lid has a slit that penetrates through the heat sink lid in a thickness direction and exposes the gap between the two facing sidewalls of the two first dies. The conductive balls are disposed on the opposite surface of the circuit substrate and electrically connected with the die through the circuit substrate.

Abstract: A pixel circuit including a driving transistor, a light emission element, a compensation circuit, a storage capacitor, and a writing circuit is provided. The light emission control circuit is configured to selectively conduct the light emission element to the driving transistor. The compensation circuit is coupled with the light emission control circuit and a control terminal of the driving transistor, and is configured to form a diode-connected structure with the driving transistor. The storage capacitor includes a first terminal and a second terminal. The first terminal of the storage capacitor is coupled with the control terminal of the driving transistor, and the light emission control circuit is configured to selectively conduct the second terminal of the storage capacitor to a first power terminal. The writing circuit is configured to provide different voltages to the first terminal of the storage capacitor and the second terminal of the storage capacitor.

Abstract: A semiconductor device including a circuit substrate, a chip package, and a stiffener ring is provided. The chip package is disposed on and electrically connected to the circuit substrate, the chip package includes a pair of first parallel sides and a pair of second parallel sides shorter than the pair of first parallel sides. The stiffener ring is disposed on the circuit substrate, the stiffener ring includes first stiffener portions extending along a direction substantially parallel with the pair of first parallel sides and second stiffener portions extending along the direction substantially parallel with the pair of second parallel sides. The first stiffener portions are connected to the second stiffener portions, and the second stiffener portions is mechanically weaker than the first stiffener portions. A semiconductor device including stiffener lids is also provided.

Abstract: A package includes a first dielectric layer, a device die over and attached to the first dielectric layer, an active through-via and a dummy through-via, and an encapsulating material encapsulating the device die, the active through-via, and the dummy through-via. The package further includes a second dielectric layer over and contacting the device die, the active through-via, and the dummy through-via. An active metal cap is over and contacting the second dielectric layer and electrically coupling to the active through-via. The active metal cap overlaps the active through-via. A dummy metal cap is over and contacting the second dielectric layer. The dummy metal cap overlaps the dummy through-via. The dummy metal cap is separated into a first portion and a second portion by a gap. A redistribution line passes through the gap between the first portion and the second portion of the dummy metal cap.

Abstract: In one example, an electronic device may include a housing having an opening and an antenna assembly disposed in the housing. The antenna assembly may include an antenna mounted to the housing, an antenna module disposed corresponding to the opening, and a cable to connect the antenna to the antenna module via routing the cable through the opening.

Abstract: A pixel circuit including a driving transistor, a light emission element, a compensation circuit, a storage capacitor, and a writing circuit is provided. The light emission control circuit is configured to selectively conduct the light emission element to the driving transistor. The compensation circuit is coupled with the light emission control circuit and a control terminal of the driving transistor, and is configured to form a diode-connected structure with the driving transistor. The storage capacitor includes a first terminal and a second terminal. The first terminal of the storage capacitor is coupled with the control terminal of the driving transistor, and the light emission control circuit is configured to selectively conduct the second terminal of the storage capacitor to a first power terminal. The writing circuit is configured to provide different voltages to the first terminal of the storage capacitor and the second terminal of the storage capacitor.

Abstract: Example of backlit switches are described. In an example, a backlit switch includes a printed circuit board (PCB) and a dome-type button coupled to the PCB. The dome-type button has a light transmitting portion. A light source is mounted on a first side of the PCB, and a tact switch is mounted on a second side of the PCB that is opposite to the first side. Further, a projection is provided to trigger the tact switch, in response to pressing of the dome-type button.

Abstract: A semiconductor device including a circuit substrate, a chip package, and a stiffener ring is provided. The chip package is disposed on and electrically connected to the circuit substrate, the chip package includes a pair of first parallel sides and a pair of second parallel sides shorter than the pair of first parallel sides. The stiffener ring is disposed on the circuit substrate, the stiffener ring includes first stiffener portions extending along a direction substantially parallel with the pair of first parallel sides and second stiffener portions extending along the direction substantially parallel with the pair of second parallel sides. The first stiffener portions are connected to the second stiffener portions, and the second stiffener portions is mechanically weaker than the first stiffener portions. A semiconductor device including stiffener lids is also provided.

Abstract: A display apparatus includes a pixel array, a plurality of gate lines and a plurality of de-load lines. The pixel array includes a plurality of display rows, each of the display rows includes a plurality of pixel circuits, and each of the pixel circuits includes a first transistor and a second transistor coupled in series between a data line and a display pixel. A control end of the first transistor of each of the pixel circuits is coupled to one of the gate lines for receiving a gate driving signal. A control end of the second transistor of each of the pixel circuits is coupled to one of the de-load lines for receiving a de-loading signal. Where an enable time period of the de-loading signal received by each of the pixel circuits covers an enable time period of the gate driving signal received by each of the pixel circuits.

Abstract: A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.