Patents by Inventor Chia-Chun Hsu

Chia-Chun Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12127253
    Abstract: A method for determining Listen Before Talk (LBT) type and Channel Access Priority Class (CAPC) for signaling message transmission over signaling radio bearers (SRBs) in 5G New Radio-Unlicensed (NR-U) is proposed. A user equipment (UE) generates an SRB message to be transmitted to a serving base station over a control channel. Before the uplink (UL) transmission of an UL PDU containing the SRB message, the UE performs an LBT procedure using a set of LBT parameters associated with a CAPC value. In one embodiment, the CAPC is provided by the base station via an UL grant contained in a downlink control information (DCI). In another embodiment, the CAPC is determined by the UE based on an SRB type of the SRB message.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: October 22, 2024
    Assignee: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Abhishek Roy, Pavan Santhana Krishna Nuggehalli, Chia-Chun Hsu
  • Publication number: 20240347592
    Abstract: Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The structure includes a source/drain region disposed over a substrate, a first interlayer dielectric layer surrounding a first portion of the source/drain region, a second interlayer dielectric layer distinct from the first interlayer dielectric layer surrounding a second portion of the source/drain region, a silicide layer disposed on the source/drain region, and a conductive contact disposed over the source/drain region. The conductive contact is disposed in the second interlayer dielectric layer.
    Type: Application
    Filed: April 17, 2023
    Publication date: October 17, 2024
    Inventors: Hong-Chih CHEN, Je-Wei HSU, Ting-Huan HSIEH, Chia-Hao KUO, Fu-Hsiang SU, Shih-Hsun CHANG, Ping-Chun WU
  • Publication number: 20240320138
    Abstract: A control method for a non-volatile memory is provided. After the non-volatile memory is enabled, a judging step is performed to judge whether the non-volatile memory enters a read mode, a program mode or an erase mode. If the judging result indicates that the non-volatile memory enters the read mode, the program mode or the erase mode, a worst threshold voltage of plural reference cells of the non-volatile memory is searched. Then, at least one of a control voltage for read action, a control voltage for program verify and a control voltage for erase verify is determined. Then, a read action, a program action or an erase action is performed on plural data cells of the non-volatile memory.
    Type: Application
    Filed: March 12, 2024
    Publication date: September 26, 2024
    Inventors: Tsung-Mu LAI, Chang-Chun LUNG, Chia-Jung HSU, Cheng-Yen SHEN, Ching-Yuan LIN
  • Publication number: 20240302726
    Abstract: A projection apparatus and an overheating protection method thereof are provided. An initial stable temperature corresponding to an initial accumulated usage time during an initial usage period is obtained by using a temperature sensor in the projection apparatus. At least one stable temperature respectively corresponding to at least one accumulated usage time is obtained by using the temperature sensor in the projection apparatus. An estimated time corresponding to a target temperature is estimated according to the initial accumulated usage time, the initial stable temperature, the at least one stable temperature, and the at least one accumulated usage time. A temperature protection operation of the projection apparatus is executed in response to a current accumulated usage time of the projection apparatus exceeding the estimated time.
    Type: Application
    Filed: February 15, 2024
    Publication date: September 12, 2024
    Applicant: Qisda Corporation
    Inventors: Chia-Chun Hsu, Chih-Wei Cho
  • Patent number: 12089419
    Abstract: Provided are a non-volatile memory device and a manufacturing method thereof. The non-volatile memory device includes a substrate having a memory region and a dummy region surrounding the memory region, an interconnect structure, memory cells, conductive vias and dummy vias. The interconnect structure is disposed on the substrate and in the memory region. The memory cells are disposed on the interconnect structure and arranged in an array when viewed from a top view. The memory cells include first memory cells in the memory region and second memory cells in the dummy region. The conductive vias are disposed in the memory region and between the first memory cells and the interconnection structure to electrically connect each of the first memory cells to the interconnect structure. The dummy vias are disposed in the dummy region and surround the memory region.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: September 10, 2024
    Assignee: United Microelectronics Corp.
    Inventors: Cheng-Yi Lin, Tang Chun Weng, Chia-Chang Hsu, Yung Shen Chen, Chia-Hung Lin
  • Publication number: 20240296890
    Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.
    Type: Application
    Filed: May 13, 2024
    Publication date: September 5, 2024
    Inventors: Chen-Ming Huang, Wen-Tuo Huang, Yu-Hsiang Yang, Yu-Ling Hsu, Wei-Lin Chang, Chia-Sheng Lin, ShihKuang Yang, Yu-Chun Chang, Hung-Ling Shih, Po-Wei Liu, Shih-Hsien Chen
  • Publication number: 20240274461
    Abstract: A die bonding tool having a tool head including a plurality of openings fluidly coupled to a vacuum source to selectively secure a semiconductor die onto the tool head via the application of a suction force. The plurality of openings have non-uniform cross-sectional areas, including one or more first openings having a first cross-sectional area and one or more second openings having a second cross-sectional area that is greater than the first cross-section area. A first minimum offset distance between each of the first openings and any peripheral edge of the tool head is less than a second minimum offset distance between each of the second openings and any peripheral edge of the tool head. The configuration of the openings in the tool head may improve bonding of the semiconductor die to a substrate by inhibiting air becoming trapped between the semiconductor die and the substrate during the bonding process.
    Type: Application
    Filed: February 15, 2023
    Publication date: August 15, 2024
    Inventors: Chia-Yin CHEN, I-Chun HSU, Yu-Sheng LIN, Yan-Zuo TSAI, Yung-Chi LIN, Tsang-Jiuh WU, Wen-Chih CHIOU
  • Publication number: 20240274100
    Abstract: A frame rate control method is provided. A primary scenario and a non-primary scenario are identified according to two or more windows displayed on a screen. Each of the primary scenario and the non-primary scenario is performed by an individual application. A frame rate of the non-primary scenario is decreased when a performance index indicates that a first condition is present. The application corresponding to the non-primary scenario is disabled when the performance index indicates that a second condition is present after decreasing the frame rate of the non-primary scenario, so as to remove the window corresponding to the non-primary scenario from the screen.
    Type: Application
    Filed: January 18, 2024
    Publication date: August 15, 2024
    Inventors: Chung-Yang CHEN, Chia-Chun HSU, Jei-Feng LI, Yi-Hsin SHEN, Guo LI, Ta-Chang LIAO, Yu-Chia CHANG, Hung-Hao CHANG, Po-Ting CHEN, Yu-Hsien LIN
  • Patent number: 12054382
    Abstract: A micro-electromechanical-system (MEMS) device may be formed to include an anti-stiction polysilicon layer on one or more moveable MEMS structures of a device wafer of the MEMS device to reduce, minimize, and/or eliminate stiction between the moveable MEMS structures and other components or structures of the MEMS device. The anti-stiction polysilicon layer may be formed such that a surface roughness of the anti-stiction polysilicon layer is greater than the surface roughness of a bonding polysilicon layer on the surfaces of the device wafer that are to be bonded to a circuitry wafer of the MEMS device. The higher surface roughness of the anti-stiction polysilicon layer may reduce the surface area of the bottom of the moveable MEMS structures, which may reduce the likelihood that the one or more moveable MEMS structures will become stuck to the other components or structures.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: August 6, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsi-Cheng Hsu, Kuo-Hao Lee, Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang, Lavanya Sanagavarapu, Chia-Yu Lin, Chia-Chun Hung, Jia-Syuan Li, Yu-Pei Chiang
  • Publication number: 20240239059
    Abstract: A molding method of a support rod that first passing a plurality of long fibers through a resin bath for impregnating with resin, then passing the plurality of long fibers impregnated with resin through a bundling hole of a position-constrained vertical plate on a machine to preliminarily form a bundle end; providing a coating layer on the machine, one end of the coating layer obliquely passes through a guiding portion on the position-constrained vertical plate to downwardly contact the bundle end; then placing the one end of the coating layer and the bundle end into a mold cavity of a mold at the same time to form a long rod body; and then cutting the long rod body into multi-segment support rods through a cutting process.
    Type: Application
    Filed: May 17, 2023
    Publication date: July 18, 2024
    Inventors: Che-Yuan Liu, Chang-Hsing Lee, Ming-Chuan Liu, Zhao-Xu Lai, Pen-Chien Yu, Shu-Fen Wang, Chia-Chang Hsu, Ren-Wei Tsai, Zong-You Chen, Da-Chun Chien
  • Patent number: 11991572
    Abstract: Methods and apparatus are provided for UE-triggered handover and early preparation with coexistence of the network-triggered handover. In one novel aspect, the UE is configured early measurement report configuration, receives an early handover command from the serving base station with a handover candidate cell list, monitors handover triggering conditions for each candidate cell on the handover candidate cell list based on a UE-triggered handover configuration and performs the UE-triggered handover to a candidate cell when the corresponding triggering condition is met for the candidate cell. In one embodiment, the UE receives a network-triggered handover command to a target cell, suspends the UE-triggered handover configuration and performs the network-triggered handover to the target cell. The UE discards the UE-triggered handover configuration upon success of the network-triggered handover and resumes the UE-triggered handover configuration upon failure of the network-triggered handover.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: May 21, 2024
    Assignee: MEDIATEK INC.
    Inventors: Li-Chuan Tseng, Yuanyuan Zhang, Yung-Hsiang Liu, Chun-Fan Tsai, Chia-Chun Hsu
  • Publication number: 20240114385
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. In certain configurations, the UE establishes a connection supporting an extended reality (XR) application service with a base station. The UE reports, to the base station under a trigger condition, a buffer status report (BSR) to indicate a buffer size for data to be transmitted to the base station. The BSR includes information related to a corresponding BSR table. The UE receives a configuration instruction from the base station. The UE configures resources on the UE.
    Type: Application
    Filed: September 12, 2023
    Publication date: April 4, 2024
    Inventors: Ming-Yuan Cheng, Pradeep Jose, Chia-Chun Hsu
  • Publication number: 20240114380
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. In certain configurations, the UE establishes a connection supporting an extended reality (XR) application service with a base station. The UE reports, to the base station, a delay status report (DSR) to indicate a buffer size for data to be transmitted to the base station. The DSR includes timing information. The UE receives a configuration instruction from the base station. The UE configures resources on the UE according to the configuration instruction to transmit the data to the base station.
    Type: Application
    Filed: September 13, 2023
    Publication date: April 4, 2024
    Inventors: Ming-Yuan Cheng, Pradeep Jose, Chia-Chun Hsu, Sheng-Yi Ho
  • Publication number: 20240114359
    Abstract: Apparatus and methods are provided for AI-ML model storage and transfer in the wireless network. In one novel aspect, the AI-ML model is stored at the AI server and transferred through the user plane (UP). In one embodiment, UE downloads the AI-ML model from the AI server through the UP connection. In one embodiment, the AI-ML model is updated at the RAN node, and the UE downloads the AI-ML model through the AI server. In another embodiment, the AI-ML model is updated at the UE, and the UE uploads the AI-ML model to the AI server through the UP connection. In another embodiment, the UE uploads the AI-ML model to the RAN through the AI server. In one embodiment, the UE mobility triggers the AI-ML model transfer. In one novel aspect, the AI dataset is shared and transferred among different entities through the UP connection or a new AI plane.
    Type: Application
    Filed: September 14, 2023
    Publication date: April 4, 2024
    Inventors: Ta-Yuan Liu, Hao Bi, CHIA-CHUN HSU
  • Publication number: 20240107597
    Abstract: This invention presents methods leveraging artificial intelligence and machine learning (AI/ML) models to enhance wireless communications efficiency in 5G/6G networks. The processes involve storing, configuring, and transferring AI/ML models within base stations and user equipment devices (UE), allowing for localized decision-making and improved network performance. Features include dynamic model activation/deactivation, model compression/decompression, and encoding/decoding method negotiation. Periodic or condition-driven model updates ensure responsiveness to network changes, while model replacements enable upgrades and iterations. The system facilitates seamless handovers between base stations, with information sharing about model capabilities and UE specifics. Model storage and configuration can also occur in the UE, empowering it for local decision-making in variable or challenging network conditions.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 28, 2024
    Inventors: Abhishek Roy, Hao Bi, CHIA-CHUN HSU
  • Publication number: 20240106510
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be wireless equipment. The wireless equipment selects a first subset of beams to be utilized for beam management. The beams are from a set of first type of beams used for communication with a base station or a UE. The wireless equipment measures signals transmitted on a second subset of beams. The beams are from the set of first type of beams or from a set of second type of beams. The wireless equipment measures the signals over a time window. The wireless equipment inputs the measurements to a computational model. The wireless equipment receives predictions of channel measurements on the first subset of beams from the computational model.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 28, 2024
    Inventors: Abhishek Roy, Vaibhav Pradeep Bhosale, Gyu Bum Kyung, Chia-Chun Hsu
  • Patent number: 11913132
    Abstract: A method for manufacturing a package includes generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode; depositing metal on a central region of the substrate with a first deposition rate; depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate; and reducing the first deposition rate.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: February 27, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia Chun Hsu, Chin-Feng Wang
  • Publication number: 20240056275
    Abstract: Apparatus and methods are provided for efficient bandwidth adaptation for wideband carrier. In one novel aspect, the UE starts a BWP timer upon detecting one or more BWP timer starting triggering events, resets the BWP timer upon detecting BWP resetting triggering events, and switches to the default BWP upon expiration of the BWP timer. The BWP timer starting triggering events comprises decoding a command to switch away from the default BWP, the detection of end of DL data transmission in DRX mode. In another novel aspect, the UE only decodes the DCI indication for active BWP switching in the first three OFDM symbols of a subframe or a slot. In yet another novel aspect, when the SPS is configured for the serving cell for a UE with multiple BWPs, the SPS is configured for all the BWPs accordingly.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 15, 2024
    Inventors: Pei-Kai Liao, Chia-Chun Hsu
  • Patent number: 11889415
    Abstract: Aspects of the disclosure provide methods and apparatuses for wireless communication. In some embodiments, a first mobile device can receive a first indication of a first transmit activity pattern associated with a second mobile device that transmits data to the first mobile device via a radio interface without passing through a base station. The first mobile device can compute a first receive activity pattern that is inclusive of at least the first transmit activity pattern. The first mobile device monitors the radio interface according to the first receive activity pattern.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: January 30, 2024
    Assignee: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Nathan Edward Tenny, Tao Chen, Chia-Chun Hsu
  • Publication number: 20240023074
    Abstract: A UE includes an application processor that generates application data to be transmitted to a base station. The UE also includes a modem that determines a downlink active time period. The modem or the application processor determines whether the application data is available before the downlink active time period. The modem or the application processor withholds the transmission of the application data to the base station until the downlink active time period. The modem transmits the application data to the base station during the downlink active time period.
    Type: Application
    Filed: June 7, 2023
    Publication date: January 18, 2024
    Inventors: Ming-Yuan Cheng, Chia-Chun Hsu