Abstract: A method of forming interconnects for three dimensional integrated circuits comprises attaching a metal layer on a first carrier, attaching a first side of a packaging component on the metal layer, wherein the packaging component comprises a plurality of through vias. The method further comprises filling the plurality of through vias with a metal material using an electrochemical plating process, wherein the metal layer functions as an electrode for the electrochemical plating process, attaching a second carrier on a second side of the packaging component, detaching the first carrier from the packaging component, forming a photoresist layer on the metal layer, patterning the photoresist layer and detaching exposed portions of the metal layer.

Abstract: Methods for forming a pattern in a lithography process for semiconductor wafer manufacturing are provided. In an example, a method includes forming a photoresist layer over a material layer; performing a first exposure process on the photoresist layer, thereby forming an exposed photoresist layer having soluble portions and unsoluble portions; treating the exposed photoresist layer, wherein the treating includes one of performing a second exposure process on the exposed photoresist layer and forming an adsorbing chemical layer over the exposed photoresist layer; and developing the exposed and treated photoresist layer to remove the soluble portions of the photoresist layer, wherein the unsoluble portions of the photoresist layer form a photoresist pattern that exposes portions of the material layer.

Abstract: Methods for forming a pattern in a lithography process for semiconductor wafer manufacturing are provided. In an example, a method includes forming a photoresist layer over a material layer; performing a first exposure process on the photoresist layer, thereby forming an exposed photoresist layer having soluble portions and unsoluble portions; treating the exposed photoresist layer, wherein the treating includes one of performing a second exposure process on the exposed photoresist layer and forming an adsorbing chemical layer over the exposed photoresist layer; and developing the exposed and treated photoresist layer to remove the soluble portions of the photoresist layer, wherein the unsoluble portions of the photoresist layer form a photoresist pattern that exposes portions of the material layer.

Abstract: An exemplary method for controlling a charging current is adapted to a charging device. The charging device receives an input voltage to thereby output the charging current. The method includes the following steps of: making the charging current have a first value; judging whether the input voltage is less than a preset reference voltage; and if the input voltage is judged to be less than the preset reference voltage, decreasing the charging current from the first value step by step until the input voltage retrieves back above the preset reference voltage.

Abstract: A circuit and method for power path management track the input voltage at a power input terminal to generate a reference voltage, and generate a control signal for controlling a charger control circuit coupled between a power output terminal and a charger output terminal according to the difference between the voltage at the power output terminal and the reference voltage.

Abstract: A method an apparatus for fabricating an interconnection structure. A substrate is provided with a dielectric layer thereon. The dielectric layer comprises at least one opening therein. A gap-filling material is applied on the substrate filling the at least one opening. The gap-filling material is planarized using a template to create a substantially planarized surface.

Abstract: Provided is a system for overlay measurement in semiconductor manufacturing that includes a generator for exposing an overlay target to radiation and a detector for detecting reflected beams of the overlay target. The reflected beams are for overlay measurement and include at least two different beams.

Abstract: A charger including a regulator, a controller and a compensation-adjusting unit for accurately charging to a battery device is provided. The regulator provides a charging current to the battery device. The controller is coupled to the regulator for controlling the charging current. The compensation-adjusting unit is coupled to the regulator and the battery device for receiving a first reference voltage. In a first operation mode, the compensation-adjusting unit outputs the first reference voltage to the regulator. In a second operation mode, the controller instructs the regulator to transiently generate a first charging current and a second charging current. Responsive to the first and the second charging currents, the output voltage of the battery device presents a first output voltage and a second output voltage. The compensation-adjusting unit pre-estimates a parasitic resistance of the battery device by detecting the first and the second output voltage, thus compensating the first reference voltage.

Abstract: Provided is a system for overlay measurement in semiconductor manufacturing that includes a generator for exposing an overlay target to radiation and a detector for detecting reflected beams of the overlay target. The reflected beams are for overlay measurement and include at least two different beams.

Abstract: A method for semiconductor manufacturing includes forming an overlay target having a pattern formed by a first mask layer and an adjacent layer. The overlay target is exposed to radiation. As a result, reflective beams can be detected from the pattern and the adjacent layer and the location of the pattern can be identified based on the reflective beams.

Abstract: An auxiliary operation interface of a digital recording/reproducing apparatus includes a targeting item, a switching button set and an audio prompt generator. The targeting item is optionally triggered to have the digital recording/reproducing apparatus execute a selected function. The audio prompt generator is enabled to generate an audio prompt when the targeting item is triggered. The audio prompt generator is optionally enabled or disabled by an operation of the switching button set.

Abstract: A method an apparatus for fabricating an interconnection structure. A substrate is provided with a dielectric layer thereon. The dielectric layer comprises at least one opening therein. A gap-filling material is applied on the substrate filling the at least one opening. The gap-filling material is planarized using a template to create a substantially planarized surface.

Abstract: An isotropic-diffusion filling method uses a thermal process on a result structure comprising a photoresist layer and an organic material layer to create a cross-linking layer there between, which minimizes step height differences between isolated and dense via-pattern regions for optimizing a subsequent trench process and simplifying process steps.

Abstract: A method for semiconductor manufacturing includes forming an overlay target having a pattern formed by a first mask layer and an adjacent layer. The overlay target is exposed to radiation. As a result, reflective beams can be detected from the pattern and the adjacent layer and the location of the pattern can be identified based on the reflective beams.

Abstract: A method an apparatus for fabricating an interconnection structure. A substrate is provided with a dielectric layer thereon. The dielectric layer comprises at least one opening therein. A gap-filling material is applied on the substrate filling the at least one opening. The gap-filling material is planarized using a template to create a substantially planarized surface.

Abstract: An isotropic-diffusion filling method uses a thermal process on a result structure comprising a photoresist layer and an organic material layer to create a cross-linking layer there between, which minimizes step height differences between isolated and dense via-pattern regions for optimizing a subsequent trench process and simplifying process steps.

Abstract: An auxiliary operation interface includes a guiding menu and an audio prompt generator. The guiding menu has a targeting item optionally triggered to have the digital recording/reproducing apparatus execute a selected function. The audio prompt generator is enabled to generate a first audio prompt when the targeting item is triggered to enter a first function and generate a second audio prompt when the targeting item is triggered to enter a second function.

Abstract: A remote controller includes at least a button and an audio prompt generator is disclosed. The button is used for cooperating with a digital recording/reproducing apparatus. The audio prompt generator generates an audio prompt in response to a triggering operation done on the button.

Abstract: An auxiliary operation interface of a digital recording/reproducing apparatus includes a targeting item, a switching button set and an audio prompt generator. The targeting item is optionally triggered to have the digital recording/reproducing apparatus execute a selected function. The audio prompt generator is enabled to generate an audio prompt when the targeting item is triggered. The audio prompt generator is optionally enabled or disabled by an operation of the switching button set.

Abstract: A task confirmation method is used in a task executing apparatus. A scheduled task is going to be executed by the task executing apparatus at a preset time point. After the scheduling operation, whether conditions of the task executing apparatus are ready for executing the scheduled task at the preset time point are checked in response to a power-off signal of the task executing apparatus and/or an awaking signal for waking up the powered-off task executing apparatus. If the conditions of the task executing apparatus are not ready for executing the scheduled task at the preset time point, a warning message will be outputted.