Abstract: An exemplary multi-window display control system comprises: a read module, a display module, and a display; the method for presenting a multi-window display is also provided, the method comprising: reading the size of a display by a read module; sending the size of the display to a display module; displaying two or more display areas on a display according to a predetermined ratio; and presenting one or more functional units in each of the display area. The multi-window display control system and the method for presenting a multi-window method can provide two or more display areas on an electronic platform simultaneously, as well as provide functional unit windows in the corresponding display areas, which improve the speed and convenience of the operation.

Abstract: A repair device for a PCB includes a clamp portion having a plurality of receptacles defined therein, a connector head having a plurality of contacts configured to connect with the PCB, a plurality of conductive lines arranged side by side, and a lead wire. One end of each of the conductive lines is clamped by the clamp portion and exposed to outside of the clamp portion via a corresponding receptacle of the clamp portion, the other end of each of the conductive lines is connected to a corresponding contact of the connector head. Two ends of the lead wire are electrically connected to two of the conductive lines via the corresponding receptacles, thereby switching signal transmission from one of the input terminal of the PCB to another input terminal of the PCB.

Abstract: Methods of fabricating a microelectromechanical structure are provided. An exemplary embodiment of a method of fabricating a microelectromechanical structure comprises providing a substrate. A first patterned sacrificial layer is formed on portions of the substrate, the first patterned sacrificial layer comprises a bulk portion and a protrusion portion. A second patterned sacrificial layer is formed over the first sacrificial layer, covering the protrusion portion and portions of the bulk portion of the first patterned sacrificial layer, wherein the second patterned sacrificial layer does not cover sidewalls of the first patterned sacrificial layer. An element layer is formed over the substrate, covering portions of the substrate, the first patterned sacrificial layer and second patterned sacrificial layer. The first and second patterned sacrificial layers are removed, leaving a microstructure on the substrate.

Abstract: Methods of fabricating a microelectromechanical structure are provided. An exemplary embodiment of a method of fabricating a microelectromechanical structure comprises providing a substrate. A first patterned sacrificial layer is formed on portions of the substrate, the first patterned sacrificial layer comprises a bulk portion and a protrusion portion. A second patterned sacrificial layer is formed over the first sacrificial layer, covering the protrusion portion and portions of the bulk portion of the first patterned sacrificial layer, wherein the second patterned sacrificial layer does not cover sidewalls of the first patterned sacrificial layer. An element layer is formed over the substrate, covering portions of the substrate, the first patterned sacrificial layer and second patterned sacrificial layer. The first and second patterned sacrificial layers are removed, leaving a microstructure on the substrate.

Abstract: The invention provides a method of fabricating a micromachined structure, and in particular to a method of forming a micro-electro-mechanical system (MEMS) structure. A thin silicon cantilevered or suspended structure used to make micromachined structures is first formed from a SOI wafer or a bulk silicon wafer, followed by formation of the micromachined structures by semiconductor manufacturing techniques.

Abstract: An optical film device made of flexible material; the optical film having at least one optical projections or optical recesses; wherein when light emits upon the optical film; illumination of the optical projection or optical recess will different from that of the optical film. The optical film is used as a backlight source device with an optical film by adding a light source; and a metal dome sheet below the metal dome sheet. A reflecting sheet is installed below the metal dome sheet. The optical film is installed with at least one optical projection and at least one optical recess for focusing or dispersing light so as to present different illuminations. The flexible optical film is suitable for plane or non-plane structure. Moreover, the flexible optical film can uniformly distribute light by using only one light source with low power consumption.

Abstract: Face-detection-based remote-control system and method and face-detection-based remote-controllable multimedia system are disclosed. The face-detection-based remote-control method includes the following steps. (a) By using a detection device, detection of at least one part of an existing face is made according to an operation mode of the multimedia system in order to output a face image signal. (b) According to the face image signal, analysis of at least the part of the existing face detected is performed to generate at least a characteristic parameter correspondingly. (c) Comparing at least the characteristic parameter to at least a conditional parameter is made to generate a comparison result, wherein the conditional parameter is associated with at least a control action of the operation mode. (d) According to the comparison result, at least an indication signal is generated to the multimedia system.

Abstract: The invention provides a method of fabricating a micromachined structure, and in particular to a method of forming a micro-electro-mechanical system (MEMS) structure. A thin silicon cantilevered or suspended structure used to make micromachined structures is first formed from a SOI wafer or a bulk silicon wafer, followed by formation of the micromachined structures by semiconductor manufacturing techniques.

Abstract: A manufacturing method of a charge-trapping memory device is provided. This method includes forming a stacked structure having at least a charge-trapping medium. An annealing process in a hydrogen gas is then performed on the stacked structure subsequent to the device fabrication process. The annealing process is conducted at a temperature of about 350° C. to 450° C. and with the concentration of the hydrogen gas greater than 0.5 mole percent.

Abstract: Methods of fabricating a microelectromechanical structure are provided. An exemplary embodiment of a method of fabricating a microelectromechanical structure comprises providing a substrate. A first patterned sacrificial layer is formed on portions of the substrate, the first patterned sacrificial layer comprises a bulk portion and a protrusion portion. A second patterned sacrificial layer is formed over the first sacrificial layer, covering the protrusion portion and portions of the bulk portion of the first patterned sacrificial layer, wherein the second patterned sacrificial layer does not cover sidewalls of the first patterned sacrificial layer. An element layer is formed over the substrate, covering portions of the substrate, the first patterned sacrificial layer and second patterned sacrificial layer. The first and second patterned sacrificial layers are removed, leaving a microstructure on the substrate.

Abstract: A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the stereoscopic reinforced ribs and the electroformed metal shell mold to become an integrated body by electroforming; forming a metal thickened layer by metal spraying; forming a second electroformed cover and forming a metal key bond between the electroformed cover and the metal thickened layer. The method of the invention can shorten fabrication time of the electroformed mold insert and improve the mechanical strength and soldering affinity of the metal thickened layer.

Abstract: The present disclosure provides a system and method for recognizing a defect image associated with a semiconductor substrate. In one example, the method includes collecting defect data of the defect image by testing and measuring the semiconductor substrate, extracting a pattern from the defect data, normalizing a location, orientation, and size of the pattern, and identifying the pattern after the pattern is normalized.

Abstract: A method for fabricating a micro-lens mold comprises forming a thick film on a substrate, patterning the thick film to form a micro-capillary, filling the micro-capillary with a heat curing glue liquor, rotating the substrate so that the liquid in the micro-capillary presents a circular arc shape as a micro-lens because of the surface tension of the material itself and the adhesion of the micro-capillary, and curing and shaping the heat curing glue liquor by the irradiation of a light source or by heating.

Abstract: A thickening method of an electroforming shim is provided to increase the thickness of a metal shim. In this embodiment, an active solder with a rare earth element is used to increase the moisture on the substrate surface for the solder during the combining process. Afterwards the oxides of the rare earth element are expelled by mechanical stirring to produce a clean contact surface. The melted fillers moisturize on the substrate surface to achieve the combination.

Abstract: A method is designed to fasten a mold shell with a mold seat without causing the mold shell to crack. The method involves a first step in which a metal shell is formed on a model by electrocasting. The metal shell is then provided with at least one nut therewith by soldering through electrocasting. The metal shell is separated from the model and is then provided with a metal layer of a thickness by arc spraying, with the metal layer circumventing the nut. The mold seat is provided with at least one through hole. The mold shell is fastened with the mold seat by a bolt which is engaged with the nut via the through hole of the mold seat.

Abstract: A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the stereoscopic reinforced ribs and the electroformed metal shell mold to become an integrated body by electroforming; forming a metal thickened layer by metal spraying; forming a second electroformed cover and forming a metal key bond between the electroformed cover and the metal thickened layer. The method of the invention can shorten fabrication time of the electroformed mold insert and improve the mechanical strength and soldering affinity of the metal thickened layer.

Abstract: A reinforced and thickened mold insert and a method of manufacturing the same include the procedures of: first, providing an original mandrel that has an electroformed metal mold insert; next, forming a plurality of protrusive or indented coupling reinforced sections on the electroformed metal mold insert; finally forming a thickened metal layer on the electroformed metal mold insert and the coupling reinforced sections by metal spraying. The coupling reinforced sections can increase the bonding power between the electroformed metal mold insert and the thickened metal layer.

Abstract: A thermal spraying method is provided for manufacturing anti-sliding plates. The method uses a mask located upon a plate with a specific height. The mask has plural openings of a specific shape. When a thermal spraying device thermal-sprays thread material from the upper side of the mask, melted thread material passes through the openings to form anti-sliding spots of a specific shape on the plate. By means of thermal spraying on the mask with the openings, an anti-sliding plate with high roughness is efficiently produced.

Abstract: A method is designed to fasten a mold shell with a mold seat without causing the mold shell to crack. The method involves a first step in which a metal shell is formed on a model by electrocasting. The metal shell is then provided with at least one nut therewith by soldering through electrocasting. The metal shell is separated from the model and is then provided with a metal layer of a thickness by arc spraying, with the metal layer circumventing the nut. The mold seat is provided with at least one through hole. The mold shell is fastened with the mold seat by a bolt which is engaged with the nut via the through hole of the mold seat.