Patents by Inventor Chia Hung
Chia Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11925454Abstract: A respiratory function testing system includes an air transforming device, a sound reception device and an operation device. The air transforming device is configured to collect exhaled and/or inhaled air for a predetermined period and generate a wide frequency range sound signal according to the collected respired air. The wide frequency range sound signal at least contains an ultrasonic signal. The sound reception device is configured to receive and record the wide frequency range sound signal as an audio file. The operation device is in communication with the sound reception device and is configured to receive and compute the audio file to generate a respiratory function parameter. Besides, the recorded wide frequency range sound signal may be converted into a spectrogram for further applications, and the computation of the audio file can be replaced by analyzing the spectrogram. A respiratory function testing method corresponding to the respiratory function testing system is also provided.Type: GrantFiled: October 5, 2020Date of Patent: March 12, 2024Inventors: Chia-Chi Su, Hsiao-Pao Yen, Pei-Ling Hsu, Chia-Hung Chen
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Patent number: 11929318Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.Type: GrantFiled: May 10, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 11926698Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.Type: GrantFiled: December 18, 2020Date of Patent: March 12, 2024Assignee: CHANG CHUN PLASTICS CO., LTD.Inventors: An-Pang Tu, Chia-Hung Wu, Chien-Chun Chen
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Publication number: 20240079493Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a gate structure disposed on the substrate. The semiconductor device also includes a source region and a drain region disposed within the substrate. The substrate includes a drift region laterally extending between the source region and the drain region. The semiconductor device further includes a first stressor layer disposed over the drift region of the substrate. The first stressor layer is configured to apply a first stress to the drift region of the substrate. In addition, the semiconductor device includes a second stressor layer disposed on the first stressor layer. The second stressor layer is configured to apply a second stress to the drift region of the substrate, and the first stress is opposite to the second stress.Type: ApplicationFiled: September 1, 2022Publication date: March 7, 2024Inventors: GUAN-QI CHEN, CHEN CHI HSIAO, KUN-TSANG CHUANG, FANG YI LIAO, YU SHAN HUNG, CHUN-CHIA CHEN, YU-SHAN HUANG, TUNG-I LIN
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Publication number: 20240075291Abstract: A close-loop deep brain stimulation algorithm system for Parkinson's disease includes a memory and a processor. The processor includes a deep brain stimulation (DBS) simulation module, a virtual brain network module, a feature extraction module, and a reinforcement learning module. The deep brain stimulation simulation module is adapted to combine a deep brain stimulation waveform according to the stimulation frequency and the stimulation amplitude and output the deep brain stimulation waveform. The virtual brain network module is adapted to receive the deep brain stimulation waveform to output a synaptic signal and calculate a reward parameter. The feature extraction module is adapted to receive the synaptic signal and extract a plurality of feature values according to the synaptic signal.Type: ApplicationFiled: December 27, 2022Publication date: March 7, 2024Applicant: Industrial Technology Research InstituteInventors: Chii-Wann Lin, Chia-Hung Cho
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Publication number: 20240079483Abstract: A semiconductor device and a method of fabricating the semiconductor device are disclosed. The semiconductor device includes a substrate, a fin base disposed on the substrate, nanostructured channel regions disposed on a first portion of the fin base, a gate structure surrounding the nanostructured channel regions, a source/drain (S/D) region disposed on a second portion of the fin base, and an isolation structure disposed between the S/D region and the second portion of the fin base. The isolation structure includes an undoped semiconductor layer disposed on the second portion of the fin base, a silicon-rich dielectric layer disposed on the undoped semiconductor layer, and an air spacer disposed on the silicon-rich dielectric layer.Type: ApplicationFiled: March 22, 2023Publication date: March 7, 2024Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Hung LIN, I-Hsieh WONG, Tzu-Hua CHIU, Cheng-Yi PENG, Chia-Pin LIN
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Publication number: 20240072411Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.Type: ApplicationFiled: July 28, 2023Publication date: February 29, 2024Applicant: Pegatron CorporationInventors: Chien-Yi Wu, Hau Yuen Tan, Chao-Hsu Wu, Chih-Wei Liao, Chia-Hung Chen, Chen-Kuang Wang, Wen-Hgin Chuang, Chia-Hong Chen, Hsi Yung Chen
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Publication number: 20240071722Abstract: Embodiments described herein relate to plasma processes. A plasma process includes generating a plasma containing negatively charged oxygen ions. A substrate is exposed to the plasma. The substrate is disposed on a pedestal while being exposed to the plasma. While exposing the substrate to the plasma, a negative direct current (DC) bias voltage is applied to the pedestal to repel the negatively charged oxygen ions from the substrate.Type: ApplicationFiled: November 8, 2023Publication date: February 29, 2024Inventors: Sheng-Liang Pan, Bing-Hung Chen, Chia-Yang Hung, Jyu-Horng Shieh, Shu-Huei Suen, Syun-Ming Jang, Jack Kuo-Ping Kuo
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Patent number: 11913876Abstract: An optical water-quality detection apparatus includes a detection device, a biofilm-inhibition light source, a detection light source and a sensor. The detection device includes a detection chamber. The biofilm-inhibition light source is disposed outside the detection chamber and configured to emit biofilm-inhibition light. The detection light source is disposed outside the detection chamber and configured to emit detection light. The sensor is configured to sense the detection light penetrating the detection chamber. A beam of the detection light and a beam of the inhibition light overlaps as penetrating the detection chamber.Type: GrantFiled: August 10, 2022Date of Patent: February 27, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chia-Jung Chang, Jui-Hung Tsai, Ying-Hao Wang, Chih-Hao Hsu
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Patent number: 11916314Abstract: A mobile device includes a housing, a first radiation element, a second radiation element, a third radiation element, a first switch element, and a second switch element. The first radiation element has a first feeding point. The second radiation element has a second feeding point. The first radiation element, the second radiation element, and the third radiation element are distributed over the housing. The first switch element is closed or open, so as to selectively couple the first radiation element to the third radiation element. The second switch element is closed or open, so as to selectively couple the second radiation element to the third radiation element. An antenna structure is formed by the first radiation element, the second radiation element, and the third radiation element.Type: GrantFiled: May 12, 2022Date of Patent: February 27, 2024Assignee: HTC CorporationInventors: Cheng-Hung Lin, Szu-Po Wang, Chia-Te Chien, Chun-Chieh Wang, Kang-Ling Li, Chun-Hsien Lee, Yu-Chieh Chiu
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Patent number: 11916025Abstract: A device die including a first semiconductor die, a second semiconductor die, an anti-arcing layer and a first insulating encapsulant is provided. The second semiconductor die is stacked over and electrically connected to the first semiconductor die. The anti-arcing layer is in contact with the second semiconductor die. The first insulating encapsulant is disposed over the first semiconductor die and laterally encapsulates the second semiconductor die. Furthermore, methods for fabricating device dies are provided.Type: GrantFiled: August 13, 2021Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shih-Wei Chen, Tzuan-Horng Liu, Chia-Hung Liu, Hao-Yi Tsai
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Patent number: 11916273Abstract: A rotary joint includes a shaft having a first end, a second end, and a cavity. The rotary joint includes a first waveguide section having a first proximal end and a first distal end. The first proximal end of the first waveguide section is positioned within the cavity and secured to the inner surface of the shaft. The rotary joint includes a second waveguide section that includes a second proximal end and a second distal end. The second proximal end of the second waveguide section is positioned within the cavity of the shaft and unsecured to the inner surface of the shaft to form a radial gap between an outer surface of the second proximal end and a laterally adjacent portion of the inner surface of the shaft. The shaft and the first waveguide section are configured to rotate about the rotational axis and relative to the second waveguide section.Type: GrantFiled: October 9, 2020Date of Patent: February 27, 2024Assignee: Waymo LLCInventors: Zhe Li, Samuel Lenius, Chia-Hung Lin, Craig Moriwaki, William Martin Peters, Jr., Kelvin Kwong, Robert J. Lockwood, Peng Ye
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Patent number: 11917436Abstract: A base station (BS) and a method for wireless communication are provided. The method includes transmitting a first radio resource control (RRC) configuration that configures a radio link monitoring configuration that includes a beam failure detection (BFD) timer and a beam failure indication (BFI) count threshold. The first RRC configuration enables a user equipment (UE) to: start or restart the BFD timer by a medium access control (MAC) entity of the UE each time a BFI is received from a lower layer; and initiate a beam failure recovery (BFR) procedure upon determining that the number of the received BFIs is greater than or equal to the BFI count threshold. The method further includes transmitting a second RRC configuration that reconfigures the radio link monitoring configuration. The second RRC configuration enables the UE to set the BFI counter to zero in response to receiving the second RRC configuration.Type: GrantFiled: March 7, 2023Date of Patent: February 27, 2024Assignee: FG Innovation Company LimitedInventors: Chia-Hung Wei, Chie-Ming Chou
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Publication number: 20240061110Abstract: A radar system includes an ultrasonic radar unit and a warning device. The ultrasonic radar unit is configured to be detachably mounted on a vehicle, and is configured to output a pairing signal when a pairing function is activated and output a warning signal upon detecting an object that is within a range. The warning device is configured to be electrically connected to the ultrasonic radar unit and to be mounted inside the vehicle. The warning device is configured to wirelessly communicate with the ultrasonic radar unit to receive the warning signal and the pairing signal; when receiving the pairing signal, couple the ultrasonic radar unit to one of a plurality of warning areas that is on the warning device according to the pairing signal; control one of the warning areas that is coupled to the ultrasonic radar unit to output a visual warning upon receiving the warning signal.Type: ApplicationFiled: July 3, 2023Publication date: February 22, 2024Inventors: TIEN-BOU WAN, CHUNG-HSIAO LO, CHIEN-LIANG PAN, AN-HUN CHENG, CHIA-HUNG WU
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Publication number: 20240055491Abstract: A semiconductor device includes parallel channel members, a gate structure, source/drain features, a silicide layer, and a source/drain contact. The parallel channel members are spaced apart from one another. The gate structure is wrapping around the channel members. The source/drain features are disposed besides the channel members and at opposite sides of the gate structure. The silicide layer is disposed on and in direct contact with the source/drain features. The source/drain contact is disposed on the silicide layer, wherein the source/drain contact includes a first source/drain contact and a second source/drain contact stacked on the first source/drain contact, and the second source/drain contact is separate from the silicide layer by the first source/drain contact.Type: ApplicationFiled: August 11, 2022Publication date: February 15, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Hung Chu, Shuen-Shin Liang, Chung-Liang Cheng, Sung-Li Wang, Chien Chang, Harry CHIEN, Lin-Yu Huang, Min-Hsuan Lu
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Publication number: 20240057111Abstract: A method for a unified Transmission Configuration Indication (TCI) state operation performed by a user equipment (UE) is provided. The method includes receiving a first Radio Resource Control (RRC) configuration for configuring a first set of TCI states and a second set of TCI states; receiving a first indication for associating the first set of TCI states with a first channel, the first channel including a Physical Downlink Control Channel (PDCCH); receiving a second indication for associating the second set of TCI states with a second channel, the second channel being scheduled by first Downlink Control Information (DCI) received on the first channel; receiving a third indication for indicating at least one third TCI state to be applied on the second channel; and transmitting or receiving the second channel after applying the at least one third TCI state.Type: ApplicationFiled: August 11, 2023Publication date: February 15, 2024Inventors: WAN-CHEN LIN, CHIA-HUNG LIN, MEI-JU SHIH
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Publication number: 20240057310Abstract: A semiconductor memory device includes a substrate, and a plurality of contact pads and a capacitor array structure disposed on an array region of the substrate. The capacitor array structure includes a plurality of capacitors respectively disposed on the contact pads and a middle supporting layer extending laterally between waist portions of the capacitors to define an upper portion and a lower portion of each of the capacitors. The lower portions of the capacitors near the edge of the array region are tilted. The upper portions of the capacitors near the edge of the array region have misalignments to the contact pads. The stress in the capacitor array structure of the semiconductor memory device may be reduced.Type: ApplicationFiled: December 26, 2022Publication date: February 15, 2024Applicant: Fujian Jinhua Integrated Circuit Co., Ltd.Inventors: Yincong Hong, Chia-Hung Wang, Yue Liu, Chung-Ping Hsia
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Patent number: 11899368Abstract: A method of manufacturing a semiconductor device is as below. An exposed photoresist layer is developed using a developer supplied by a developer supplying unit. An ammonia gas by-product of the developer is discharged through a gas outlet of the developer supplying unit into a treating tool. The ammonia gas by-product is retained in the treating tool. A concentration of the ammonia gas by-product is monitored.Type: GrantFiled: August 9, 2022Date of Patent: February 13, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Kai Chen, Chia-Hung Chung, Ko-Bin Kao, Su-Yu Yeh, Li-Jen Wu, Zhi-You Ke, Ming-Hung Lin
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Publication number: 20240048727Abstract: A computer-implemented method of video coding comprises receiving at least one frame of a video sequence of an interactive application interface associated with at least one asset displayable on the interface in response to a user action related to the interface. The method includes encoding the at least one frame. The method also includes transmitting the at least one asset and the encoded at least one frame to a remote device. The transmitting operation refers to performing the transmitting regardless of whether a request to display the at least one asset exists. The asset can be a non-persistent asset on the frame only while a user performs a continuous action or maintains a cursor at a specific place on the interface. The asset also can be a persistent asset on the frame in response to a first action and is removed from the display in response to a second action.Type: ApplicationFiled: October 17, 2023Publication date: February 8, 2024Applicant: Intel CorporationInventors: Jason Tanner, Stanley Baran, Kristoffer Fleming, Chia-Hung S. Kuo, Sankar Radhakrishnan, Venkateshan Udhayan
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Publication number: 20240047393Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a conductive electrode, and a first layer. The conductive electrode and the first layer are disposed on the base, the first layer surrounds the conductive electrode and overlaps an edge portion of the conductive electrode. In a cross-sectional view, the first layer is divided into a first part and a second part, the conductive electrode is located between the first part and the second part, and a width of the first part is different from a width of the second part.Type: ApplicationFiled: October 19, 2023Publication date: February 8, 2024Applicant: Innolux CorporationInventors: Chueh Yuan Nien, Chao-Chin Sung, Chia-Hung Hsieh, Mei Cheng Liu