Patents by Inventor Chia-Ming Hsu

Chia-Ming Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220416090
    Abstract: Present disclosure provides a semiconductor structure, including a semiconductor fin having a first portion and a second portion over the first portion, a first conductive region abutting a first lateral surface of the first portion and a first lateral surface of the second portion, a metal gate having a bottom portion and an upper portion, the bottom portion being between the first portion and the second portion of the semiconductor fin, and the upper portion being over the second portion of the semiconductor fin, and a first spacer between the bottom portion of the metal gate and the first conductive region. A method for manufacturing the semiconductor structure described herein is also provided.
    Type: Application
    Filed: June 25, 2021
    Publication date: December 29, 2022
    Inventors: CHIA-MING HSU, YI-JING LI, CHIH-HSIN KO, KUANG-HSIN CHEN, DA-WEN LIN, CLEMENT HSINGJEN WANN
  • Publication number: 20220406768
    Abstract: A semiconductor structure includes a first metal-dielectric-metal layer, a first dielectric layer, a first conductive layer, a second conductive layer, and a second dielectric layer. The first metal-dielectric-metal layer includes a plurality of first fingers, a plurality of second fingers, and a first dielectric material. The first fingers are electrically connected to a first voltage. The second fingers are electrically connected to a second voltage different from the first voltage, and the first fingers and the second fingers are arranged in parallel and staggeredly. The first dielectric material is between the first fingers and the second fingers. The first dielectric layer is over the first metal-dielectric-metal layer. The first conductive layer is over the first dielectric layer. The second conductive layer is over the first conductive layer. The second dielectric layer is between the first conductive layer and the second conductive layer.
    Type: Application
    Filed: June 18, 2021
    Publication date: December 22, 2022
    Inventors: I-SHENG CHEN, YI-JING LI, CHIA-MING HSU, WAN-LIN TSAI, CLEMENT HSINGJEN WANN
  • Publication number: 20220387756
    Abstract: A urinary catheter conveying device includes a sleeve member, a conveying assembly and a controller. The sleeve member is for sleeving onto a glans of a penis and has a guiding hole to be registered with an external urethral orifice of the glans. The conveying assembly includes a casing removably mounted to the sleeve member, and a conveying mechanism for advancing the urinary catheter to the guiding hole such that the urinary catheter is inserted into the external urethral orifice. The controller controls the conveying mechanism to advance the urinary catheter to the guiding hole. A urinary catheterization system and a method of using the urinary catheterization system are also disclosed.
    Type: Application
    Filed: June 2, 2022
    Publication date: December 8, 2022
    Inventors: Chung-Cheng Wang, Yung-Ping Wang, Yi-Yuan Chen, Chia-Ming Hsu, Ming-Chien Chiu, Chia-Ch Lin
  • Patent number: 11508627
    Abstract: A method includes: providing a substrate; forming a first pair of source/drain regions in the substrate; disposing an interlayer dielectric layer over the substrate, the interlayer dielectric layer having a first trench between the first pair of source/drain regions; depositing a dielectric layer in the first trench; depositing a barrier layer over the dielectric layer; performing an operation on the substrate; removing the barrier layer from the first trench to expose the dielectric layer subsequent to the operation; and depositing a work function layer over the dielectric layer in the first trench.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: November 22, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yi-Jing Lee, Ya-Yun Cheng, Hau-Yu Lin, I-Sheng Chen, Chia-Ming Hsu, Chih-Hsin Ko, Clement Hsingjen Wann
  • Publication number: 20220349454
    Abstract: A drive device with multiple swinging blocks drivingly connected with each other includes a driven unit connected with a driven apparatus (such as a power generation motor or a generator), a driving unit drivingly connected with the driven unit and an actuating unit connected with the driving unit. The driven unit includes a flywheel. The driving unit includes three dynamic energy modules respectively connected with the flywheel at intervals. Each dynamic energy module has a gear engaged with the flywheel and a swinging block disposed on the gear. There is a 120-degree angle difference between the corresponding angular positions of each two adjacent swinging blocks. The actuating unit includes an actuating motor, a driving member driven by the actuating motor and connected with one of the dynamic energy modules and transmission members drivingly connected with the dynamic energy modules for driving the driven unit to together rotate.
    Type: Application
    Filed: March 31, 2022
    Publication date: November 3, 2022
    Inventors: PO-CHI HSU, YU-LIEN CHU HSU, CHIA MING HSU
  • Patent number: 11320327
    Abstract: A pressure sensing device includes a substrate, at least a pressure sensing module, and a packaging layer. The pressure sensing module is arranged at the substrate including a plurality of conductive units, a plurality of pressure sensing blocks and a plurality of buffer units. Each conductive unit has a first electrode and a second electrode. The pressure sensing blocks are respectively arranged at the conductive units. Each pressure sensing block has a circuit structure that electrically connects the first electrode and the second electrode of each corresponding conductive unit. Each buffer unit is arranged between each corresponding conductive unit and each corresponding pressure sensing block comprising a plurality of buffer bumps arranged in an array at the first electrode and the second electrode of each corresponding conductive units. The packaging layer is bonded to the substrate, the conductive units and the pressure sensing blocks.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: May 3, 2022
    Assignee: MEDX TECHNOLOGY INC.
    Inventors: Chia-Ming Hsu, Chun Lin
  • Publication number: 20220080689
    Abstract: An environmentally friendly shoe material and method of manufacturing the same is disclosed, wherein the method includes: mixing scraps and a foaming material to provide a shoe material mixture, the scraps including bottle scraps formed by crushing plastic bottles; putting the shoe material mixture into a mold and compression molding the shoe material mixture into the environmentally friendly shoe material; and separating the environmentally friendly shoe material from the mold. In this way, the environmentally friendly shoe material may not only maintain its due function, but also take environmental protection into account.
    Type: Application
    Filed: September 11, 2020
    Publication date: March 17, 2022
    Inventors: Chih-Jen HSU, Chia-Ming HSU, Chen-En KAO
  • Publication number: 20220071498
    Abstract: According to the present invention, a physiological sensing apparatus is detachably provided on a textile. The physiological sensing apparatus includes a sensing module and a processing module, and the sensing module is used for receiving a touch event to generate a physiological sensing signal. The sensing module includes a sensor element and a first film; the sensor element is used for detecting the physiological sensing signal; a first surface of the first film includes a conductive ink pattern; a first surface of the sensor element is superimposed on the first surface of the first film, so that the conductive ink pattern is in contact with the sensor element. The processing module is coupled with the sensing module and is used for receiving the physiological sensing signal to determine a physiological event corresponding to a change in physiological sensing signals.
    Type: Application
    Filed: December 10, 2019
    Publication date: March 10, 2022
    Applicant: MEDX TECHNOLOGY INC.
    Inventors: Chia-Ming Hsu, Yi-Yuan Chen
  • Publication number: 20220041857
    Abstract: Disclosed herein are composite masterbatch granules containing reprocessed PET derived from recycled PET bottles, a method for making the same, and a use of the same in a foamed shoe material. Recycled PET is melted and mixed with EVA and a compatibilizer until they form a new polymer alloy through chemical modification, and the polymer alloy is processed with a high-torque extruder to produce the composite masterbatch granules. The composite masterbatch granules can be further mixed with EVA and a thermoplastic elastic material in order to make a shoe material by a foaming and molding process. The disclosure is intended to contribute to the recycling and reuse of waste PET so as to reduce carbon dioxide emissions, protect the environment, and lower the demand for virgin PET polymer materials and hence for petrochemical materials in general. TABLE 3 Z-axis X-axis dimension, dimension, i.e., i.e., Type of raw Measuring width thickness material point (mm) (mm) r-PET #1 17.
    Type: Application
    Filed: August 6, 2020
    Publication date: February 10, 2022
    Inventors: Chih-Jen HSU, Chia-Ming HSU, Yi-Ju HUANG
  • Publication number: 20210356339
    Abstract: A fabric strain gauge includes a knitted fabric and a plurality of conductive measuring fibers, a first high conductivity fiber, and a second high conductivity fiber. The conductive measuring fibers are threaded with the knitted fabric, the first high conductivity conductive fiber is threaded with the knitted fabric, and connected to one or more ends of the conductive measuring fibers, and the second high conductivity fiber is threaded with the knitted fabric, and connected to the other ends of at least part of the conductive measuring fibers. In addition, a fabric pressure gauge and a smart clothing are also disclosed herein.
    Type: Application
    Filed: May 14, 2021
    Publication date: November 18, 2021
    Applicant: MEDX TECHNOLOGY INC.
    Inventors: Chia-Ming Hsu, Yi-Yuan Chen, Chung-Cheng Wang
  • Publication number: 20210339429
    Abstract: A method of manufacturing graphene polyester chips including steps of: melt-mixing a polymer material and graphene powder having a mass fraction ?2 wt %, and melt-mixing a tackifier with a mass fraction between 1 wt % and 3 wt %, a toughener with a mass fraction between 1 wt % and 3 wt %, and a dispersant with a mass fraction between 1 wt % and 4 wt % sequentially. Finally, a molten raw material is made into a plurality of graphene polyester chips each in form of short cylindrical particle. The present disclosure further includes a method of manufacturing graphene diaphragm.
    Type: Application
    Filed: April 29, 2020
    Publication date: November 4, 2021
    Inventors: Wei-Lin TSENG, Yang-Ming SHIH, Chia-Lang CHAN, Chia-Ming HSU
  • Publication number: 20210342514
    Abstract: A method of operating an IC manufacturing system includes determining whether an n-type active region of a cell or a p-type active region of the cell is a first active region based on a timing critical path of the cell, positioning the first active region along a cell height direction in an IC layout diagram of a cell, the first active region having a first total number of fins extending in a direction perpendicular to the cell height direction. The method also includes positioning a second active region in the cell along the cell height direction, the second active region being the n-type or p-type opposite the n-type or p-type of the first active region and having a second total number of fins less than the first total number of fins and extending in the direction, and storing the IC layout diagram of the cell in a cell library.
    Type: Application
    Filed: July 15, 2021
    Publication date: November 4, 2021
    Inventors: Po-Hsiang HUANG, Fong-Yuan CHANG, Clement Hsingjen WANN, Chih-Hsin KO, Sheng-Hsiung CHEN, Li-Chun TIEN, Chia-Ming HSU
  • Publication number: 20210324155
    Abstract: A method for manufacturing a graphene plastic film includes the steps of providing plastic particles and graphene powder, mixing the plastic particles with the graphene powder in a weight ratio not greater than 2% to form a mixed material, heating the mixed material to form a melted material (100), pressing the melted material (100) to form a graphene plastic sheet (210), and radially stretching a periphery of the graphene plastic sheet (210) to expand and thin the graphene plastic sheet (210) to form a graphene plastic film (220). By adding graphene to the mixed material, physical properties of the graphene plastic film (220) can be enhanced. In comparison with the current technology, it is easier to be manufactured and wider to be applied.
    Type: Application
    Filed: April 21, 2020
    Publication date: October 21, 2021
    Inventors: Wei-Lin TSENG, Yang-Ming SHIH, Chia-Lang CHAN, Chia-Ming HSU
  • Patent number: 11080453
    Abstract: A method of operating an IC manufacturing system includes determining whether an n-type active region of a cell or a p-type active region of the cell is a first active region based on a timing critical path of the cell, positioning the first active region along a cell height direction in an IC layout diagram of a cell, the first active region having a first total number of fins extending in a direction perpendicular to the cell height direction. The method also includes positioning a second active region in the cell along the cell height direction, the second active region being the n-type or p-type opposite the n-type or p-type of the first active region and having a second total number of fins less than the first total number of fins and extending in the direction, and storing the IC layout diagram of the cell in a cell library.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: August 3, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Po-Hsiang Huang, Sheng-Hsiung Chen, Chih-Hsin Ko, Fong-Yuan Chang, Clement Hsingjen Wann, Li-Chun Tien, Chia-Ming Hsu
  • Patent number: 10996262
    Abstract: A reliability determination method, which is configured to test a batch of semiconductor devices, includes: obtaining a Welbull distribution of lifetime of the batch of semiconductor devices; dividing the Welbull distribution into at least a first section and a second section, wherein the first section and the second section meet a confidence interval; generating a first trend line of the first section and a second trend line of the second section according to the first confidence level, in which the first trend line has a first slope and the second trend line has a second slope; determining the first slope exceeds a second slope; and determining a predicted reliability of the batch of the semiconductor device under a target quality level according to the first section.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: May 4, 2021
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Sheng-Hui Liang, Huang-Lang Pai, Chia-Ming Hsu, Chia-Lin Chen
  • Patent number: 10980353
    Abstract: A mattress, bed, cushion, or other device to support a user in a pre-determined posture. The mattress, bed, cushion, or other device includes compressible cells configured to inflate based on characteristics of particular contact areas of the user, and contact, in response to inflating based on the characteristics, the user in various contact areas to support the pre-determined posture. In particular, inflating the compressible cells based on characteristics of particular contact areas reduces the risk of the user developing pressure ulcers.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: April 20, 2021
    Assignee: MEDICUSTEK, INC.
    Inventors: Aaron R. Clousing, Chia-Ming Hsu, Tsai-Yu Lin
  • Patent number: 10925410
    Abstract: A mattress for patient care. The mattress includes a number of compressible cells and a number of sensors corresponding to the number of compressible cells. Each compressible cell is configured to contact, when inflated, a user in a contact area of a plurality of contact areas of the user. Each sensor is configured to generate a number of measurements, wherein each measurement relates to the contact area of a corresponding compressible cell. Each sensor is further configured to send the number of measurements to a pressure control device.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: February 23, 2021
    Assignee: MedicusTek, Inc.
    Inventors: Chia-Ming Hsu, Yi-Yuan Chen, Tsai-Yu Lin, Lavina Che-Hsuan Thong, Aaron R. Clousing, Yu-Chun Hsu, Lee Lin
  • Publication number: 20210028069
    Abstract: A method includes: providing a substrate; forming a first pair of source/drain regions in the substrate; disposing an interlayer dielectric layer over the substrate, the interlayer dielectric layer having a first trench between the first pair of source/drain regions; depositing a dielectric layer in the first trench; depositing a barrier layer over the dielectric layer; performing an operation on the substrate; removing the barrier layer from the first trench to expose the dielectric layer subsequent to the operation; and depositing a work function layer over the dielectric layer in the first trench.
    Type: Application
    Filed: October 9, 2020
    Publication date: January 28, 2021
    Inventors: YI-JING LEE, YA-YUN CHENG, HAU-YU LIN, I-SHENG CHEN, CHIA-MING HSU, CHIH-HSIN KO, CLEMENT HSINGJEN WANN
  • Publication number: 20210018381
    Abstract: A pressure sensing device includes a substrate, at least a pressure sensing module, and a packaging layer. The pressure sensing module is arranged at the substrate including a plurality of conductive units, a plurality of pressure sensing blocks and a plurality of buffer units. Each conductive unit has a first electrode and a second electrode. The pressure sensing blocks are respectively arranged at the conductive units. Each pressure sensing block has a circuit structure that electrically connects the first electrode and the second electrode of each corresponding conductive unit. Each buffer unit is arranged between each corresponding conductive unit and each corresponding pressure sensing block comprising a plurality of buffer bumps arranged in an array at the first electrode and the second electrode of each corresponding conductive units. The packaging layer is bonded to the substrate, the conductive units and the pressure sensing blocks.
    Type: Application
    Filed: July 20, 2020
    Publication date: January 21, 2021
    Applicant: MEDX TECHNOLOGY INC.
    Inventors: Chia-Ming Hsu, Chun Lin
  • Publication number: 20200350416
    Abstract: A semiconductor device includes a source/drain region, a source/drain silicide layer formed on the source/drain region, and a first contact disposed over the source/drain silicide layer. The first contact includes a first metal layer, an upper surface of the first metal layer is at least covered by a silicide layer, and the silicide layer includes a same metal element as the first metal layer.
    Type: Application
    Filed: July 13, 2020
    Publication date: November 5, 2020
    Inventors: Chia-Ming HSU, Pei-Yu CHOU, Chih-Pin TSAO, Kuang-Yuan HSU, Jyh-Huei CHEN