Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.

Abstract: A key apparatus includes a housing with an opening, a printed circuit board (PCB) received in the housing, and a key mechanism. The key mechanism includes an electrode portion and a conducting portion sandwiched between the electrode portion and the PCB. The electrode portion is electrically connected to the PCB. The conducting portion is apart from the PCB. While the conducting portion connects with the connecting region, the electrode portion and the connecting region form a capacitor. The PCB generates different control signals based on different capacitances of the formed capacitors.

Abstract: A robot hand apparatus includes a base, three finger mechanisms, a thumb mechanism, and three motors for the three finger mechanisms. The base corresponds to a part of the hand of a human, i.e. a palm and dorsum of a human. Each of three finger mechanisms is elongated in almost the same direction from the end of the base and is adapted to be actuated by the motor. The thumb mechanism is elongated from the different portion from the base. The thumb mechanism and the finger mechanism close to the thumb mechanism are configured to define a U-shape space.

Abstract: A key apparatus includes a housing, a printed circuit board (PCB), a fixing mechanism, and a key mechanism. The fixing mechanism mounted on the PCB. The key mechanism is rotatably fixed on the fixing mechanism. Partial of the key mechanism is exposed from the housing. The fixing mechanism comprises a resistor portion for providing a changeable resistance to the PCB. The key mechanism drives the resistor portion to rotate simultaneously for changing a resistance of resistor portion provided to the PCB. A rotating axis of the key mechanism is coaxial with a rotating axis of the resistor portion.

Abstract: A key apparatus includes a housing with an opening, a printed circuit board (PCB) received in the housing, and a key mechanism. The key mechanism includes an electrode portion and a conducting portion sandwiched between the electrode portion and the PCB. The electrode portion is electrically connected to the PCB. The conducting portion is apart from the PCB. While the conducting portion connects with the connecting region, the electrode portion and the connecting region form a capacitor. The PCB generates different control signals based on different capacitances of the formed capacitors.

Abstract: A key apparatus includes a housing with an opening, a printed circuit board (PCB) received in the housing, and a key mechanism. The key mechanism includes at least one key and an elastic portion. The key and the elastic portion are partly exposed from the housing via the opening. The elastic portion deforms to generate an elastic force and the key remains in an original position. The elastic drives the key to move simultaneously for providing an elastic force. The key mechanism provides a two stage touch feeling to a user when being pressed.

Abstract: A flexible display apparatus comprises a main body with a casing and a slot, a flexible portion, and a supporting portion. The flexible display portion is received in the casing, and is capable of rolling out from the main body from the slot. The supporting portion is surrounding the main body and capable of unfolding with respect to the main body. While the flexible display portion is rolled out of the casing and being straightened, the supporting portion is straightened under the flexible display portion for supporting the flexible display portion.

Abstract: An electronic device includes a base, a cover rotatably connected to the base and a dampening mechanism. The dampening mechanism includes an engaging component secured to the base and a dampening component secured to the cover. When the cover is opened, the engaging component contacts with the dampening component for dampening the movement of the cover relative to the base.

Abstract: An LED light fixture includes a first substrate, a second substrate and a plurality of LED chips. The first substrate, on one side thereof, includes a plurality of spaced first electrodes, a first inner terminal electrically connected to the first electrodes, and a second inner terminal insulated from the first electrodes, and, on another side thereof, a first outer terminal electrically connected to the first inner terminal and a second outer terminal electrically connected to the second inner terminal. The second substrate includes a plurality of spaced second electrodes corresponding to the first electrodes, and a third inner terminal electrically connected to the second electrodes and the second inner terminal. The LED chips are arranged between the first and second substrates and electrically connected to the first and second electrodes of the first and second substrates, respectively.

Abstract: An LED includes a substrate, an LED die, and a packaging layer. The substrate has conductive pins extending therethrough. The LED die is arranged on the substrate and electronically connected to the conductive pins of the substrate. The packaging layer fills in the substrate to encapsulate the LED die therein. A plurality of fillers are distributed in the packaging layer. Each of the fillers has a plurality of nano-particles distributed therein for enhancing a light dispersion of light generated by the LED die.

Abstract: A method for self-assembling a plurality of microstructures onto a substrate comprising using a bonding material to make the microstructure assembled onto the substrate by a physical attraction force. The microstructures are self-aligned with the substrate, and further permanently fixed on and electrical connection with the substrate by the solder bumps between the microstructures and the substrate, which is formed by the solder bumps via reflow process. There is no need for the using of the conventional pick-and-place device in the present method. The present method could be applied to light emitting diodes, RFID tags, micro-integrated circuits or other types of microstructures.

Abstract: A light emitting diode includes a base, a first and second conductive members through the base and a light emitting diode chip on the base. The light emitting diode chip includes an upper surface, a bottom surface, a first sidewall and a second sidewall. The first sidewall and the second sidewall interconnect the upper surface and bottom surface. A first and second heat dissipating layers are respectively located on the first and second sidewalls. The first and second heat dissipating layers connect with the first and second conductive members, respectively. A bottom face of the chip electrically and thermally connects with the second conductive member. A gold wire electrically connects an electrode on a top face of the chip and the first heat dissipating layer.

Abstract: An illumination lamp includes a housing, light source, a light reflecting device and a light path conversion device. The housing defines a light emitting window therein. The light source is disposed in the housing. The light reflecting device is disposed in the housing and has a reflecting surface. The light path conversion device is disposed in the housing. The light path conversion device is configured for converting light rays emitted from the light source into parallel light rays and directing the parallel light rays toward the light reflecting surface of the light reflecting device. The light reflecting device reflects the parallel light rays out of the housing via the light emitting window.

Abstract: An exemplary light emitting diode (LED) includes a substrate, a LED chip and an encapsulation unit. The encapsulation unit includes a first encapsulation material located over the LED chip and a second encapsulation material located around the first encapsulation material. A plurality of first particles with a first distributing density is distributed in the first encapsulation material. A plurality of second particles with a second distributing density is distributed in the second encapsulation material. The first distributing density is larger than the second distributing density, a central portion of light from the light emitting diode chip transmits through the first encapsulation material and exits the encapsulation unit from a top surface thereof, and a periphery portion of light from the light emitting diode chip transmits through the second encapsulation material and exits the encapsulation unit from the top surface thereof.

Abstract: A method of making a plurality of light emitting diodes simultaneously includes steps of: a) providing a wafer and a first bonding layer, and adhering the first bonding layer to a bottom side of the wafer; b) cutting the wafer to form a plurality of LED dies on the first bonding layer; c) adhering a second bonding layer on top sides of the plurality of LED dies; d) removing the first bonding layer; e) mounting the second bonding layer with the plurality of LED dies on a base having a plurality of recesses; f) removing the second bonding layer and letting the plurality of LED dies fall into the recesses of the base; g) electrically connecting the LED dies to electric poles in the base; h) encapsulating the LED dies; and i) cutting the base to form the plurality of LEDs.

Abstract: A light emitting diode lamp includes a lampshade and a light source. The lampshade is a portion of a hollow ellipsoid with one focus of the ellipsoid located therein. The lampshade is symmetric to a major axis of the ellipsoid. The lampshade has a vertex located on the major axis and defines a light extraction opening at one end thereof opposite to the vertex. A reflecting layer is formed on an inner surface of the lampshade. The light source is received in the lampshade and localized at the one focus of the ellipsoid. The light source includes a plurality of light emitting diodes facing the inner surface of the lampshade and the light extraction opening, respectively.

Abstract: A light emitting diode includes a light emitting diode chip and first and second encapsulation units respectively of first and second encapsulating materials. The first encapsulation unit encapsulates the light emitting diode chip. The first encapsulation unit includes a light emitting surface defining a plurality of recesses therein and forming a plurality of first protrusions between the recesses. The first protrusions are alternately arranged with the recesses. The second encapsulation unit covers the light emitting surface of the first encapsulation unit. The second encapsulation unit includes a plurality of filling portions filling the recesses of the first encapsulation unit, respectively, and a plurality of second protrusions on the first protrusions, respectively.

Abstract: A head light system of an automobile includes a normal head light and an auxiliary head light. The normal head light is fixedly mounted at a front end of the automobile. The auxiliary head light is provided at the front end of the automobile and includes a lamp body and a supporting member. The lamp body has a center of gravity. One end of the supporting member is fixedly mounted to the automobile. The lamp body is pivotally connected to another end of the supporting member. A pivotal connection point between the lamp body and the supporting member is located just above the center of gravity of the lamp body.

Abstract: A light emitting diode includes a base, a first and second conductive members through the base and a light emitting diode chip on the base. The light emitting diode chip includes an upper surface, a bottom surface, a first sidewall and a second sidewall. The first sidewall and the second sidewall interconnect the upper surface and bottom surface. A first and second heat dissipating layers are respectively located on the first and second sidewalls. The first and second heat dissipating layers connect with the first and second conductive members, respectively. A bottom face of the chip electrically and thermally connects with the second conductive member. A gold wire electrically connects an electrode on a top face of the chip and the first heat dissipating layer.

Abstract: An LED (20) includes a base (24), a chip (21) and an encapsulation (22) made of a transparent material. The base has a concave depression (240). The chip is mounted on a bottom of the concave depression. The first encapsulation is received in the depression for sealing the chip. The chip includes a light emitting surface (210). The encapsulation includes a light output surface (25) over the light emitting surface. The light output surface defines a plurality of recesses (26). A mixture (29) formed by mixing another transparent material (27) and fluorescent powder (28) is filled in each of the recesses.