Abstract: A light emitting diode lamp includes a mounting base, a number of light emitting diodes, and a reflecting cover. The mounting base includes opposite first and second surfaces, and an outer surface interconnecting outer peripheries of the first and second surfaces. Outer size of the outer surface of the mounting base decreases from the first surface to the second surface. At least one of the light emitting diodes is arranged on the second surface, with at least one arranged on the outer surface of the mounting base. The reflecting cover surrounds the mounting base for reflecting the light of the plurality of light emitting diodes towards one side of the reflecting wall facing the second surface of the mounting base.

Abstract: An exemplary side-view light emitting diode (LED) includes a substrate, a housing, a LED chip, a capsulation material and a reflecting layer. The housing and the substrate cooperatively form a receiving space therebetween. The LED chip is received in the receiving space and electrically connected with the substrate. The capsulation material is filled in the receiving space and encapsulates the LED chip in the housing. An indent is defined in a top portion of the capsulation material to cave a top surface of the capsulation material. The reflecting layer is spread on the top surface of the capsulation material. The light emitted from the LED chip upwardly towards the top surface of the capsulation material is reflected to a lateral side of the housing by the reflecting layer. The indent has a horizontal section with a size decreased along a top-to-bottom direction. The housing has a diameter gradually increased along the top-to-bottom direction.

Abstract: An LED (20) includes a base (24), a chip (21) and an encapsulation (22) made of a transparent material. The base has a concave depression (240). The chip is mounted on a bottom of the concave depression. The first encapsulation is received in the depression for sealing the chip. The chip includes a light emitting surface (210). The encapsulation includes a light output surface (25) over the light emitting surface. The light output surface defines a plurality of recesses (26). A mixture (29) formed by mixing another transparent material (27) and fluorescent powder (28) is filled in each of the recesses.

Abstract: An LED lamp includes an LED, a reflector, a first lens and a second lens. The reflector includes an outer surface which is a total reflective surface. A receiving space extends into the reflector from a center of a top side of the reflector and defines an opening in the center of the top side. The LED is received in the receiving space and faces the top side of the reflector. The first lens couples to and seals the opening of the reflector. The second lens is arranged on the top side of the reflector surrounding the first lens. Light generated by the LED passes across both of the first and second lenses to an exterior during operation of the LED lamp.

Abstract: An LED lamp includes a reflecting portion and a plurality of LEDs. The reflecting portion is formed by rotating a half-parabola, a whole parabola of which has a vertex and a focal point located on the X-axis. The half-parabola extends from the vertex to the Y-axis, and rotates around the Y-axis to form the reflecting portion. The focal points of the half-parabolas of the reflecting portion form an arc-shaped trajectory, the vertexes of the half-parabolas of the reflecting portion form an arc and defining a first open side, and two outmost half-parabolas of the reflecting portion form a second open side of the reflecting portion. The plurality of LEDs are located on the trajectory, and face the reflecting portion. Light emitted by the plurality of LEDs travels to the reflecting portion and then is reflected parallelly therefrom to the second open side.

Abstract: A traffic light module (10) includes three substrates (14, 15, 16) and three groups of LEDs (11, 12, 13) respectively mounted on the substrates. The substrates are spaced from each other. The LEDs of each group are arranged in a particular shape to define a symbolic sign.

Abstract: An LED lamp includes a base, a plurality of LEDs arranged on the base, and a cover. Each LED has an emitting surface. The cover includes a mounting side attached to the base, and an opposite emitting side. A plurality of blind holes extends into the cover from the mounting side of the cover, and encases the plurality of LEDs therein, respectively. Each blind hole includes an open side facing the base, an opposite closed side facing the emitting surface of the LED, and a sidewall arranged between the open side and the closed side of the blind hole. An area of the closed side of each hole exceeds that of the open side of the blind hole. The sidewall surrounds the LED and reflects light of the LED to the closed side of the blind hole of the cover.

Abstract: The present invention relates to a light emitting diode and a method for manufacturing the same. The light emitting diode includes a base, a light emitting chip on the base, a light permeable encapsulation encapsulating the light emitting chip to the base. The encapsulation defines a plurality of apertures extending from a bottom end toward a top end of the encapsulation.

Abstract: A side-view light emitting diode includes a substrate, a tubular, upwardly tapered light permeable housing disposed on the substrate, a receiving space formed between the substrate and the housing, a light emitting diode chip received in the receiving space, a light permeable capsulation material filled in the receiving space and encapsulating the light emitting diode chip in the housing, and a flat reflecting layer formed on a top end of the capsulation material. The housing forms a plurality of annular projections projecting outwardly. An outer surface of the housing has a coarse feature.

Abstract: A method for producing an LED includes steps of: providing a base (22), a chip body (21) and a die (40), wherein the base has a concave depression (23) defined therein and the die has a bottom wall (43) with an even surface having a surface roughness not smaller than 300 nanometers; disposing the chip body in the depression; heating a material which is used to seal the chip body on the base until the material is changed into liquid; pouring the liquefied material into the depression of the base; pressing the die toward a top surface of the liquefied material until the bottom wall of the die immerges in the top surface of the liquefied material; removing the die away from the depression when the liquefied material begins to cure; and (7) curing the liquefied material until all of it is solidified.

Abstract: A device for detecting an anodic oxide film during an anodic oxidation treatment includes a container receiving an electrolyte therein, an aluminum sheet immersed in the electrolyte, a power source supplying a current to the aluminum sheet to form an anodic oxide film on the aluminum sheet, a data acquisition unit measuring a potential of the anodic oxide film at a time, a data processor unit calculating a differential value of the potential, and a display unit displaying a differential curve generated according to the differential values of the potentials at different times. The quality of the anodic oxide film can be judged by reading the shape of the differential curve.

Abstract: A method of fabricating micro/nano optical wires is disclosed, which comprises: providing a micro/nano optical wire drawing device comprising a feeding wheel, a drawing wheel, and a heating unit; fastening one end of a micrometer-sized preform at the feeding wheel; making the other end of the preform pass through the heating unit and be fastened at the drawing wheel; and switching on the heating unit to heat the perform to a softening temperature of the preform and drawing the preform by the drawing wheel to form a micro/nano optical wire. A device of fabricating micro/nano optical wires is also disclosed.

Abstract: A light emitting diode (LED) covered with a reflective layer by imprinting process is provided. The imprinting process includes coating a plastic layer on a mold to form an imprinting substrate; coating a reflective layer on the plastic layer and modifying the shape of the reflective layer to fit the shape of outer surfaces of the light emitting diode; softening the plastic layer and impressing the mold covered with the reflective layer upon the LED structure so that the reflective layer adheres to the surfaces of LED; and removing the mold. Because the reflective layer has high reflectivity, the light emitted from the top surface and side surfaces of LED is reflected back to the light extraction direction, and thereby the light extraction efficiency is enhanced.

Abstract: A method for self-assembling microstructures onto a substrate includes using a bonding material to make the microstructure assembled onto the substrate by a physical attraction force. The microstructures are self-aligned with the substrate, and further are permanently fixed on and electrically connected with the substrate by the solder bumps between the microstructures and the substrate, which is formed by the solder bumps via reflow process. There is no need for the using of the conventional pick-and-place device in the method. The method could be applied to light emitting diodes, RFID tags, micro-integrated circuits or other types of microstructures.

Abstract: A light emitting diode (LED) covered with a reflective layer by imprinting process is provided. The imprinting process includes coating a plastic layer on a mold to form an imprinting substrate; coating a reflective layer on the plastic layer and modifying the shape of the reflective layer to fit the shape of outer surfaces of the light emitting diode; softening the plastic layer and impressing the mold covered with the reflective layer upon the LED structure so that the reflective layer adheres to the surfaces of LED; and removing the mold. Because the reflective layer has high reflectivity, the light emitted from the top surface and side surfaces of LED is reflected back to the light extraction direction, and thereby the light extraction efficiency is enhanced.