Abstract: An LED includes a substrate, an LED die, and a packaging layer. The substrate has conductive pins extending therethrough. The LED die is arranged on the substrate and electronically connected to the conductive pins of the substrate. The packaging layer fills in the substrate to encapsulate the LED die therein. A plurality of fillers are distributed in the packaging layer. Each of the fillers has a plurality of nano-particles distributed therein for enhancing a light dispersion of light generated by the LED die.

Abstract: A method for fabricating a carbon nanotube-based field emission display includes providing a substrate, forming a cathode array on the substrate, forming a catalyst layer on the cathode array of the substrate by self-assembly of catalyst powders onto the cathode array, growing carbon nanotubes from the cathode array of the substrate, forming an insulating layer on an area of the substrate bearing no cathode array, forming a grid array on the insulating layer of the substrate; and packaging the substrate with a phosphor screen to form the field emission display.

Abstract: A method of making LEDs simultaneously includes steps of : a) providing a wafer having LED dies on a substrate; b) forming a passivation layer on the LED dies; c) forming an electrode layer on the passivation layer and the LED dies; d) assembling a conducting board on the electrode layer; e) removing the substrate to expose a light emitting surface of each LED die; f) forming a terminal on the light emitting surface; g) forming a channel at a lateral side of each LED die; h) assembling a cover onto the LED dies; i) wire bonding and encapsulating the LED dies to the LEDs connected with each other; and j) cutting through the interconnected LEDs to form the LEDs separated from each other.

Abstract: An LED includes a substrate, an LED die, and a packaging layer. The substrate has conductive pins extending therethrough. The LED die is arranged on the substrate and electronically connected to the conductive pins of the substrate. The packaging layer couples to the substrate to encapsulate the LED die therein. The packaging layer includes a contacting surface attached to the substrate, an outer surface opposite to the contacting surface and facing an ambient air, and a lateral surface between the contacting surface and the outer surface. The lateral surface of the packaging layer converges from the contacting surface to the outer surface. A refractive index of the packaging layer decreases from the contacting surface to the outer surface.

Abstract: An exemplary light emitting diode (LED) includes a substrate, a LED chip and an encapsulation unit. The encapsulation unit includes a first encapsulation material located over the LED chip and a second encapsulation material located around the first encapsulation material. A plurality of first particles with a first distributing density is distributed in the first encapsulation material. A plurality of second particles with a second distributing density is distributed in the second encapsulation material. The first distributing density is larger than the second distributing density, a central portion of light from the light emitting diode chip transmits through the first encapsulation material and exits the encapsulation unit from a top surface thereof, and a periphery portion of light from the light emitting diode chip transmits through the second encapsulation material and exits the encapsulation unit from the top surface thereof.

Abstract: An exemplary light emitting diode (LED) lamp includes a substrate, a plurality of LED chips mounted on the substrate, a lens, and a plurality of reflecting layers. The lens, above the LED chips, has a plurality of first protruding strips and a second protruding strip on a top thereof. Each of the first protruding strips includes a side surface angled with respect to the substrate and a vertical side surface perpendicular to the substrate. The second protruding strip includes two side surfaces, each angled with respect to the substrate. The reflecting layers are formed on the angled side surfaces of the first protruding strips and the second protruding strip, respectively.

Abstract: An LED includes a base having a depression, a chip disposed in the depression, an encapsulation received in the depression for encapsulating the chip, and a base. Two spaced electrodes are attached to a bottom of the base and electrically connect with the chips. A porous heat sink extends through the base and reaches the depression, contacting the chip.

Abstract: An LED (20) includes a base (24), a chip (21) and an encapsulation (22). The base has a concave depression (240). The chip is mounted at a bottom of the concave depression. The encapsulation is received in the depression for encapsulating the chip. The chip includes a light emitting surface (210). The encapsulation includes a light output surface (25) over the light emitting surface. The light output surface defines a plurality of recesses (26) for respectively receiving a plurality of deposition points (28). The deposition points have a refractive index larger than that of the encapsulation.

Abstract: An LED (20) includes a chip (21), a base (22) and an encapsulation (24). The chip is disposed on a top of the base in a concave depression (220) thereof. The encapsulation is received in the depression encapsulating the chip. The encapsulation includes a light output surface (240) facing the chip. The light output surface includes a middle convergent surface (240A) and a reflective surface (240B) around the convergent surface. The reflective surface is a part of a spherical surface and a centre (F) of the spherical surface of the reflective surface is below the chip. The convergent surface is curved and protrudes upwardly relative to the reflective surface.

Abstract: An exemplary light emitting diode (LED) structure includes a heat sink and a light emitting diode mounted on a top surface of the heat sink. The heat sink includes a first fin unit and a second fin unit facing the first fin unit. Each of the first fin unit and the second fin unit includes a main body and a plurality of fins extending outwardly from the main body. The first fin unit and the second fin unit are thermally connected to each other and electrically insulated from each other. The light emitting diode is mounted on a top surface of the heat sink. The light emitting diode is thermally connected with the first fin unit and the second fin unit. The light emitting diode has two electrodes being electrically connected to electrical layers formed on the first fin unit and the second fin unit, respectively.

Abstract: An LED lamp includes a lamp holder, a lens, and at least one LED. The lamp holder includes a substrate and a reflector expanding from an outer periphery of the substrate. The lens couples to the reflector of the lamp holder to seal a receiving space of the lamp holder. The at least one LED is received in the receiving space and arranged on the substrate. The lens includes an incident surface facing the receiving space and an opposite emitting surface. At least one micro-structure is formed on the incident surface of the lens corresponding to the at least one LED. The at least one micro-structure is located on a central axis of the at least one LED, for diffusing the light generated by the at least one LED.

Abstract: An LED includes an LED die forming an emitting surface for emitting light generated thereby and a packaging layer encapsulating the LED die. The packaging layer includes an end surface facing the emitting surface of the LED die, and a lateral surface extending downwardly from an outer periphery of the end surface along an axial direction of the packaging layer. The end surface forms a convex portion confronting the LED die and an emitting portion surrounding the convex portion. Light of the LED die traveling to the convex portion is reflected to the lateral surface, and then is reflected to the emitting portion, and finally travels through the emitting portion to an outside.

Abstract: An LED includes a base having a depression, a chip disposed in the depression and an encapsulation received in the depression for encapsulating the chip and a heat sink. The heat sink includes a plurality of fins formed on a top of the base and a heat-conductive material filled in the space between adjacent fins. The heat-conductive material has a plurality of pores therein.

Abstract: An LED includes a base, a plurality of chips, a first lens made of a first light penetrable material and a second lens made of a second light penetrable material. The base has a concave depression. The chips are mounted at a bottom of the concave depression. The first lens is received in the depression for encapsulating the chips. The second lens is received in the depression and located on the first lens. The second lens includes a light input surface facing the chips and a plurality of recesses defined in the light input surface corresponding to the chips. Each recess has an internal wall with an uneven surface.

Abstract: An LED light fixture includes a first substrate, a second substrate and a plurality of LED chips. The first substrate, on one side thereof, includes a plurality of spaced first electrodes, a first inner terminal electrically connected to the first electrodes, and a second inner terminal insulated from the first electrodes, and, on another side thereof, a first outer terminal electrically connected to the first inner terminal and a second outer terminal electrically connected to the second inner terminal. The second substrate includes a plurality of spaced second electrodes corresponding to the first electrodes, and a third inner terminal electrically connected to the second electrodes and the second inner terminal. The LED chips are arranged between the first and second substrates and electrically connected to the first and second electrodes of the first and second substrates, respectively.

Abstract: An LED lamp includes a concave lamp enclosure, a base, a plurality of LEDs and a lens. The base is received in the lamp enclosure and located at a bottom of the lamp enclosure. The base has a curved, concave top surface. The LEDs are distributed on the top surface of the base. The lens is received in the lamp enclosure and located over the LEDs. The lens has a curved, convex light input surface. The light input surface faces and spaces from the top surface of the base to define a space between the light input surface of the lens and the top surface of the base.

Abstract: An LED lamp (100) includes a cover (10) having two concave reflective surfaces (121, 123), a base (21) disposing over the cover, a lens (40) locating in a middle of the base, and two LEDs (30) mounted on a bottom surface of the base. The lens and the LEDs face the reflective surfaces of the cover. The reflective surfaces each are a part of an ellipsoid. The reflective surfaces share a common focus O within an area of the lens. The LEDs are respectively located at other two focuses M1, M2 of the reflective surfaces. Light rays generated by the at least two LEDs are directed to the reflective surfaces, then reflected towards the lens of the base, and finally reach an outside of the LED lamp through the lens.

Abstract: An exemplary light emitting diode (LED) structure includes a base, a plurality of LED chips and an encapsulation material. The base defines a plurality of first channels located adjacent to a top surface thereof and a plurality of second channels located adjacent to a bottom surface thereof. Each of the first and the second channels extends along a vertical axis of the base. A projection of the first channels on the bottom surface of the base does not overlap with the projection of the second channels on the bottom surface of the base. The projection of the second channels on the bottom surface of the base is closer to the projection of one corresponding LED chip on the bottom surface of the base with respect to the projection of the first channels. A plurality of heat dissipation poles are filled in the first and the second channels.

Abstract: A method of making a plurality of light emitting diodes simultaneously includes steps of: a) providing a wafer and a first bonding layer, and adhering the first bonding layer to a bottom side of the wafer; b) cutting the wafer to form a plurality of LED dies on the first bonding layer; c) adhering a second bonding layer on top sides of the plurality of LED dies; d) removing the first bonding layer; e) mounting the second bonding layer with the plurality of LED dies on a base having a plurality of recesses; f) removing the second bonding layer and letting the plurality of LED dies fall into the recesses of the base; g) electrically connecting the LED dies to electric poles in the base; h) encapsulating the LED dies; and i) cutting the base to form the plurality of LEDs.

Abstract: An exemplary light emitting diode (LED) device includes a base, a plurality of LED chips, a plurality of encapsulation materials and a heat dissipation substrate. The LED chips are mounted on a top surface of the base. The encapsulation materials are provided on the top surface of the base and encapsulate the LED chips therein. The heat dissipation substrate is fixedly attached to a bottom surface of the base. The heat dissipation substrate is of a porous material and defines a plurality of pores therein. The pores communicate with each other.