Abstract: A chip electrical property detection device and a method of manufacturing the same are provided. The chip electrical property detection device includes a circuit control substrate, an electrical detection module and a flexible conductive structure. The circuit control module includes multiple electrical conduction structures. The electrical detection module includes multiple movable carrying substrates, multiple electrical detection structures and multiple electrical connection structures. The movable carrying substrates are separately arranged on the flexible conductive structure. The electrical detection structures are respectively disposed on the movable carrying substrates and electrically connected to the electrical connection structures. The electrical connection structures penetrate the movable carrying substrates and electrically connect to the electrical conduction structures through the flexible conductive structure, respectively.

Abstract: Provided herein are pharmaceutical compositions containing at least one liposome, said liposome comprise an external lipid bilayer including at least one vesicle-forming phospholipid and less than 15 mole % of sterol; and an internal aqueous medium including a weak acid drug and weak acid salt. The pharmaceutical compositions reduce the burst release of the weak acid drug. Also provided is the use of the pharmaceutical composition disclosed herein to treat respiratory diseases and reduce the side effect of the weak acid drug.

Abstract: An electronic device includes a substrate, a signal line, a semiconductor, a first conductive portion and a second conductive portion. The signal line is disposed on the substrate. The semiconductor is disposed on the substrate and overlapped with the signal line. Wherein the semiconductor is electrically connected to the first conductive portion and the second conductive portion. Wherein in a top view, at least a portion of the signal line is disposed between the first conductive portion and the second conductive portion. Wherein the first conductive portion has a first curve edge, the second conductive portion has a second curve edge, and the first curve edge and the second curve edge are facing the at least a portion of the signal line and are convex toward the at least a portion of the signal line.

Abstract: A portable handheld cleaning device is provided capable of cleaning the surface of the substrate table without damaging the surface. The portable handheld cleaning device in accordance with the present disclosure includes a base having a first side and a second side (the first side and the second side overlapping each other), a hollow structure on the first side of the base, and a weight holding space within the hollow structure. A grinding pad is provided on the second side of the base. The grinding pad includes a cleaning surface, the cleaning surface having a plurality of substantial pyramid shaped grits.

Abstract: A light-emitting element array substrate includes a temporary base, an adhesive layer, light-emitting elements and at least one support member. The temporary storage base has a first surface and a second surface opposite to each other. The adhesive layer is disposed on the first surface of the temporary storage base. The light-emitting elements are disposed on the adhesive layer. The adhesive layer is located between the light-emitting elements and the temporary storage substrate. The at least one support member is disposed on at least one of the first surface and the second surface of the temporary storage base. In addition, a method for manufacturing a light-emitting element array substrate is also provided.

Abstract: A memory device includes a column of at least three memory cells and a source line coupled to the source terminal of each memory cell. A source line driver is coupled to the source line, a voltage terminal, and a program voltage source and is switchable between a program operation, an erase operation, and a read operation.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a semiconductor substrate, a dielectric layer, an etching stop layer, a silicide layer, and a contact metal. The semiconductor substrate has a groove. The dielectric layer and the etching stop layer are disposed in the groove. The silicide layer is located within the semiconductor substrate. The dielectric layer has a via in the groove. The etching stop layer has a through hole under the via of the dielectric layer. The silicide layer is aligned with an inner sidewall of the through hole of the etching stop layer. The contact metal is disposed in the via.

Abstract: A method for forming a layer includes following operations. A workpiece is received in an apparatus for deposition. The apparatus for deposition includes a chamber, a pedestal disposed in the chamber to accommodate the workpiece, and a ring disposed on the pedestal. The ring includes a ring body having a first top surface and a second top surface and a barrier structure disposed between the first top surface and the second top surface. A vertical distance is defined by a top surface of the barrier structure and a top surface of the workpiece. The vertical distance is between approximately 0 mm and approximately 50 mm. A target disposed in the apparatus for deposition is sputtered. A sputtered material is deposited onto a top surface of the workpiece to form a layer. The barrier structure alters an electrical density distribution during the depositing the sputter material.

Abstract: An air mattress includes a first air cell, a second air cell, a plurality of third air cells, and a body-lifting air cell. The second air cell includes a first air chamber, a second air chamber, and a structurally-weakened region. The body-lifting air cell is below the second air cell and at least one of the third air cells. The body-lifting air cell is inflated by an air source controlled by a control system. When the body-lifting air cell is inflated, a vertical distance between the top of second air cell and the bottom of air mattress is greater than a vertical distance between the top of first air cell and the bottom of air mattress. When the body-lifting air cell is inflated, the second air cell has a lower structural strength than the other air cells to have a cushioning effect against external forces.

Abstract: A lithography system includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket, a rail guide, and a first protective film. The first sliding member is coupled to the wafer stage. The second sliding member is coupled to an edge of the table body, in which the first sliding member is coupled to a track of the second sliding member. The first bracket fixes the first cable, the first bracket being coupled to a roller structure, in which the roller structure includes a body and a wheel coupled to the body. The rail guide confines a movement of the wheel of the roller structure. The first protective film is adhered to a surface of the rail guide, in which the roller structure is moveable along the first protective film on the surface of the rail guide.

Abstract: An example compute cabinet assembly includes an equipment room configured to implement electrical components therein, an air inlet channel coupled to a first side of the equipment room, and a cabinet fan module coupled to a second side of the equipment room opposite the first side. A first air outlet channel is coupled to the cabinet fan module and extends along a third side of the equipment room towards a first outlet of the first air outlet channel. Moreover, electric fans are positioned in the cabinet fan module, the electric fans being configured to create an airflow path originating at an inlet of the air inlet channel. The airflow path further extends through the equipment room and cabinet fan module. A guide plate is also positioned adjacent to an inlet of the equipment room, the guide plate being configured to uniformly distribute the airflow path through the equipment room.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a phase change material element over a substrate, a first conductive structure, a second conductive structure, a heating structure and a first capping layer. The phase change material element includes a body portion and a surface portion on a top surface of the body portion. A nitrogen concentration of the surface portion is larger than a nitrogen concentration of the body portion. The first conductive structure is physically and electrically connected to the phase change material element. The second conductive structure is physically and electrically connected to the phase change material element. The first conductive structure and the second conductive structure are laterally spaced apart. The heating structure is configured to heat the phase change material structure. The first capping layer is disposed on the surface of the phase change material element.

Abstract: Methods and systems for generating a feature map from an image is disclosed. The vision system includes a vision model or processing the image to generate the feature map according a neural network. The vision model includes a first convolutional block for downsampling a set of image data to obtain a first stage convoluted data; a second convolutional block for downsampling the first stage convoluted data to obtain a second stage convoluted data, wherein one or both of the first convolutional block and the second convolutional block is a mobile convolution block (MBConv) that includes: a first Gaussian Error Linear Unit (GELU) layer, a depth-wise convolution (DWConv) layer having, and a resizing convolution layer; and a transformer block (TFB) generating the feature map from the second stage convoluted data.

Abstract: An optical photographing lens assembly includes two lens element groups, the two lens element groups include six lens elements, the two lens element groups being, in order from an object side to an image side along an optical path, a first lens element group and a second lens element group. The six lens elements are, in order from the object side to the image side along the optical path, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. Each of the six lens elements has an object-side surface towards the object side and an image-side surface towards the image side.

Abstract: A method and system for generating snapshot of video under recording, wherein the method comprises retrieving a header information of the original video file as a first header information when a read instruction requesting the original video file under recording is received; replacing a first unique material identifier (UMID) stored in the first header information with a second UMID to form a second header information; storing the second header information as a header information of a snapshot header file; and generating a snapshot video file and providing the snapshot video file to a client when the snapshot header file is requested by the client, wherein a header information of the snapshot video file is generated in accordance with the second header information, and a snapshot content of the snapshot video file is generated by retrieving a part of the original video file defined by the snapshot header file.

Abstract: A light emitting element array substrate includes a temporary storage base, light emitting elements, and adhesive structures. The light emitting elements are disposed on the temporary storage base. The adhesive structures are respectively located on the light emitting elements. Each of the adhesive structures includes a first adhesive member and a second adhesive member stacked on the first adhesive member. In addition, a manufacturing method of the light emitting element array substrate is also provided.

Abstract: The present disclosure provides an electronic device including a conductive element, a first insulating layer, an extending element, and a second insulating layer disposed on a substrate. At least a portion of the first insulating layer is located between the conductive element and the extending element. The second insulating layer is disposed on the conductive element and the extending element. In a cross-sectional view, a thickness of the first insulating layer is different from a thickness of the second insulating layer. In a top view, the extending element has a first portion extending to an edge of the substrate, the extending element has a second portion connecting the first portion and disposed between the first portion and the conductive element, and the first minimum width of the first portion is less than the second minimum width of the second portion.

Abstract: A static auto-tuning system and method for controlling operation of a motor in a system. A speed reference signal is generated resulting in a speed response of the motor. Closed-loop feedback magnifies the rotating friction effect to an observable level. Inertia and rotating friction coefficient values of the system are estimated based on the speed frequency response and a virtual damping coefficient. A fixed low frequency speed signal may result in a first frequency response function for determining virtual damping, and a variable frequency excitation signal may result in a second frequency response function for determining the inertia and rotating friction characteristics. Closed-loop gains are determined based on these characteristics. The excitation signal may be sampled and a peak value in each interval may be identified and stored to produce an envelope of peak values for determining the gain response. Operation of the motor is controlled using the determined gains.

Abstract: A touch pad device includes a base unit, a touch unit and a resilient unit. The base unit includes a bottom plate and a supporting member disposed on the bottom plate. The touch unit includes a touch pad, a circuit board connected to the touch pad, and a switch button disposed the circuit board. The switch button corresponds in position to the supporting member. The resilient unit is disposed between the bottom plate and the circuit board, and includes a resilient plate connected to the bottom plate, and a reinforcing frame connected between the resilient plate and the circuit board. The resilient plate has two resilient piece portions, and an abutment portion connected to the resilient piece portions and supported by the supporting member. The abutment portion is positioned between the switch button and the supporting member. The reinforcing frame is connected to the resilient piece portions.

Abstract: A water-cooling apparatus includes a chassis, a structure assembly, a controller, a tray assembly, and a leakage sensor. The chassis is configured to accommodate at least one tray assembly, power and cooling medium circulation being supplied to the tray assembly through a power supply circuit and a cooling circulation pipeline. The structure assembly is arranged on a front side and a rear side of the tray assembly and configured to fix or release the tray assembly. A direction in which the tray assembly slides after being released is the rear side. The front side is opposite the rear side. A power source of the power supply circuit and a valve of the cooling circulation pipeline of the tray assembly are turned off after the tray assembly is released by the structure assembly.