Abstract: A cell culture device includes a culture unit, a gas supply unit, a first pressure unit, at least one inspecting unit and a control unit. The culture unit contains a cell culture liquid. The gas supply unit, connected with the culture unit, is used for transmitting a culture gas into the culture unit. The first pressure unit, connected with the culture unit, is used for applying a pressure to the cell culture liquid in the culture unit. The at least one inspecting unit, connected with the culture unit, is used for receiving the cell culture liquid for inspection. The control unit, electrically coupled with the culture unit, the first pressure unit, the gas supply unit and the at least one inspecting unit, is used for monitoring corresponding condition parameters to determine respective operations. In addition, a cell culture method for the cell culture device is also provided.

Abstract: A package structure includes a first substrate and a first device disposed on the first substrate. The first device includes at least one anchor structure, a film structure anchored by the anchor structure and an actuator configured to control the film structure to form a first vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal and a second volume connected to an ambient of a wearable sound device. The ear canal and the ambient are connected via the first vent when the first vent is opened. The first vent is opened by controlling a first membrane portion and a second membrane portion of the film structure, such that a difference between a first displacement of the first membrane portion and a second displacement of the second membrane portion is larger than a thickness of the film structure.

Abstract: A sound producing cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

Abstract: Systems and method are provided for a memory circuit that includes a bit cell responsive to a bit line signal line and a bit line bar signal line configured to store a bit of data. A pre-charge circuit is configured to charge one of the bit line and bit line bar signal lines prior to a read operation, where the pre-charge circuit includes a first pre-charge component and a second pre-charge component, the first and second pre-charge components being individually controllable for charging the bit line and bit line bar signal lines.

Abstract: A package structure includes a cover and a cell disposed within the cover. The cell includes a membrane, an actuating layer and an anchor structure. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other in a top view. The actuating layer is disposed on the first membrane subpart and the second membrane subpart in the top-view direction. The membrane is anchored by the anchor structure. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

Abstract: A supporter is provided. The supporter includes a base, a holder, a positioning member, a connecting rod assembly, and a power assembly. The holder is connected to the base and has a through-hole. The positioning member is disposed in the through-hole of the holder. The connecting rod assembly is disposed on the holder and connected to the positioning member. The power assembly is movably disposed on the holder via the connecting rod assembly. Accordingly, the power assembly is movable in response to the position of the electronic device, which achieves good recharge efficiency whether the electronic device is arranged upright or horizontally.

Abstract: A package substrate and a method for fabricating a chip assembly are provided. The method includes: providing a substrate, which has an upper substrate surface and a lower substrate surface, the upper substrate surface is divided into a plurality of scribe line regions that define a plurality of die-bonding regions, and any adjacent two of the die-bonding regions are separated by the scribe line regions. The die-bonding region is provided with a substrate conductor and a core material body, the substrate conductor penetrates the substrate and has upper and lower conductive ends exposed on the upper and lower substrate surfaces, respectively, and the core material body is disposed adjacent to the substrate conductor in the substrate. The method further includes: fixing chips in the die-bonding regions, respectively; and performing a dicing process along a plurality of scribe lines defined by the scribe line regions to form chip assemblies.

Abstract: The invention relates to a heat management structure with graphene and copper, and a formation method thereof, comprising a copper foil layer provided, then forming a graphene layer on the copper foil layer surface, and forming an electroplating copper layer on the graphene layer surface, and eventually forming an electroplating copper layer-graphene layer-copper foil layer sandwich heat management structure.

Abstract: A method for in vitro activation and/or expansion of immune cells is provided, including the steps of: a) providing magnetic particles having multi-protrusive surface modified with at least one type of immuno-inducing substance, in which each magnetic particle includes a copolymer core, a polymer layer, a magnetic substance layer, and a silicon-based layer from the inside to the outside; b) providing a cell solution including at least one type of immune cell in the cell solution; and c) bringing the magnetic particles in contact with the cell solution, in which the at least one type of immuno-inducing substance on the surface of the magnetic particle activates and/or expands the at least one type of immune cell in the cell solution.

Abstract: In an embodiment, a device includes: a passivation layer on a semiconductor substrate; a first redistribution line on and extending along the passivation layer; a second redistribution line on and extending along the passivation layer; a first dielectric layer on the first redistribution line, the second redistribution line, and the passivation layer; and an under bump metallization having a bump portion and a first via portion, the bump portion disposed on and extending along the first dielectric layer, the bump portion overlapping the first redistribution line and the second redistribution line, the first via portion extending through the first dielectric layer to be physically and electrically coupled to the first redistribution line.

Abstract: The present disclosure provides a method for manufacturing a terahertz (THz) device. The method includes a step of forming a light-absorbing structure on a substrate by using a chemical vapor deposition (CVD) process. The substrate includes a semiconductor structure, a sapphire substrate, a quartz substrate, or a combination thereof. The light-absorbing structure includes a semiconductor material, a two-dimensional material, a low-dimensional material, a magnetic material, a topological material, or a combination thereof.

Abstract: A behavior detection platform may obtain video data of an environment including a guest and may determine a set of normal guest behaviors associated with the environment. The platform may analyze, using a first machine learning model, the video data to identify features of the guest and analyze, using a second machine learning model, the video data and the features to determine an actual guest behavior of the guest. The platform may predict, using the second machine learning model, a predicted guest behavior of the guest based on the actual guest behavior. The behavior detection platform may determine that at least one of the actual guest behavior or the predicted guest behavior is not included in the set of normal guest behaviors. The platform may cause assistance to be provided to the guest based on determining that the actual guest behavior or the predicted guest behavior are not included.

Abstract: Provided is a cold plate including: a heat absorption space for a working medium to be filled therein; a heat transfer structure disposed on a base within the heat absorption space for transferring thermal energy generated from a heat source that is in contact with the base to the working medium; and a flow guide structure disposed in the heat absorption space for guiding the working medium. The flow guide structure of the cold plate can effectively improve the efficiency of thermal energy absorption of the working medium.

Abstract: Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes a large package component, such as a CoWoS, adhered to a large package substrate, such as a printed circuit board, an underfill material disposed between the large package component and the large package substrate, and a stress-release structure with high elongation values formed from photolithography encapsulated by the underfill material. The stress-release structure helping to reduce stress in the underfill material to reduce the risk of underfill cracking caused by the difference in coefficients of thermal expansion between the large package component and the large package substrate.

Abstract: The present disclosure relates to a cable anchoring system for securing a cable to another structure such as a bracket of an enclosure. The cable anchoring system includes a cable anchoring body and an anchoring attachment slidably mounted within a slot of the cable anchoring body.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive bump over and electrically connected to the chip. The chip package structure includes a ring-like structure over and electrically insulated from the chip. The ring-like structure surrounds the conductive bump, and the ring-like structure and the conductive bump are made of a same material.

Abstract: The present application provides a method for determining a gene alteration, such as a gene fusion. The present application also provides a kit for determining a gene alteration. The present application further provides a method for treating a subject by determining whether a subject is at risk for a particular cancer type or genotype and administering proper treatment.

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, a supporting layer having a ring-shape and being sandwiched between the sensor chip and the light-permeable layer, and an encapsulant that is formed on the substrate. The supporting layer has an inner roughened surface being ring-shaped and having an irregular pattern. The light-permeable layer, the inner roughened surface of the supporting layer, and the sensor chip jointly define an enclosed space. The sensor chip, the supporting layer, and the light-permeable layer are embedded in the encapsulant, and at least part of outer surface of the light-permeable layer is exposed from the encapsulant. The inner roughened surface is configured to scatter light passing through the light-permeable layer to arrive thereon.

Abstract: A sensor lens assembly includes a circuit board, an optical module assembled onto the circuit board, and a sensing module that is surrounded by the optical module. The sensing module includes a sensor chip disposed on and electrically coupled to the circuit board, a supporting layer having a ring shape and disposed on the sensor chip, and a light-permeable layer. The light-permeable layer is disposed on the supporting layer through a ring-shaped segment thereof, so that the light-permeable layer, the supporting layer, and the sensor chip jointly define an enclosed space. The ring-shaped segment has a ring-shaped roughened region. A projection space defined by orthogonally projecting the ring-shaped roughened region toward the sensor chip is located outside of a sensing region of the sensor chip and overlaps an entirety of the supporting layer and a part of the enclosed space.

Abstract: Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes a package component with one or more integrated circuits adhered to a package substrate, a hybrid thermal interface material utilizing a combination of polymer based material with high elongation values and metal based material with high thermal conductivity values. The polymer based thermal interface material placed on the edge of the package component contains the metal based thermal interface material in liquid form.