Abstract: A sensor lens assembly includes a circuit board, an optical module assembled onto the circuit board, and a sensing module that is surrounded by the optical module. The sensing module includes a sensor chip disposed on and electrically coupled to the circuit board, a supporting layer having a ring shape and disposed on the sensor chip, and a light-permeable layer. The light-permeable layer is disposed on the supporting layer through a ring-shaped segment thereof, so that the light-permeable layer, the supporting layer, and the sensor chip jointly define an enclosed space. The ring-shaped segment has a ring-shaped roughened region. A projection space defined by orthogonally projecting the ring-shaped roughened region toward the sensor chip is located outside of a sensing region of the sensor chip and overlaps an entirety of the supporting layer and a part of the enclosed space.

Abstract: A sensor package structure and a chip-scale sensor package structure are provided. The chip-scale sensor package structure includes a sensor chip, a supporting layer having a ring-shape, and a light-permeable layer. A top surface of the sensor chip includes a sensing region and a carrying region that surrounds the sensing region. The supporting layer is disposed on the carrying region, and the light-permeable layer is disposed on the supporting layer through a ring-shaped segment thereof, so that the light-permeable layer, the supporting layer, and the sensor chip jointly define an enclosed space. The ring-shaped segment has a ring-shaped roughened region. A projection space defined by orthogonally projecting the ring-shaped roughened region toward the top surface of the sensor chip is located outside of the sensing region and overlaps an entirety of the supporting layer and a part of the enclosed space.

Abstract: Package structures and methods of forming package structures are discussed. A package structure, in accordance with some embodiments, includes a package component with one or more integrated circuits adhered to a package substrate, a hybrid thermal interface material utilizing a combination of polymer based material with high elongation values and metal based material with high thermal conductivity values. The polymer based thermal interface material placed on the edge of the package component contains the metal based thermal interface material in liquid form.

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically coupling the substrate and the sensor chip, a frame fixed on the substrate, and a light-permeable layer that is disposed on the frame. The light-permeable layer has a transparent segment and a ring-shaped segment that surrounds the transparent segment. The ring-shaped segment is disposed on a top end surface of the frame, so that the light-permeable layer, the frame, and the substrate jointly define an enclosed space that accommodates the sensor chip and the metal wires therein. The ring-shaped segment has an inner ring-shaped roughened region that is arranged on an inner surface thereof and that is fixed onto the top end surface of the frame. Moreover, an inner edge of the inner ring-shaped roughened region is arranged in the enclosed space.

Abstract: A light-emitting device is provided. The light-emitting device generates a white light and includes at least one light-emitting diode. The at least one light-emitting diode generates a light beam with a broadband blue spectrum and includes a first semiconductor layer, a second semiconductor layer and a multiple quantum well structure. The multiple quantum well structure is located between the first semiconductor layer and the second semiconductor layer, and includes well layers and barrier layers. The well layers include a first well layer, a second well layer and third well layers different in indium concentrations. The first well layer has the largest indium concentration, and the third well layers have the smallest indium concentration.

Abstract: A driving circuit, configured to drive a venting device, includes a first node, a second node, and an amplifying circuit. The venting device, configured to be controlled to open a vent or seal the vent, includes a film structure, which includes a first flap and a second flap, and an actuator, which includes a first actuating portion disposed on the first flap and a second actuating portion disposed on the second flap. When the venting device is controlled to open the vent, the driving circuit generates a first voltage at the first node and generates a second voltage at the second node. When the venting device is controlled to seal the vent, the driving circuit generates a third voltage at both the first node and the second node. The first voltage is larger than the third voltage, and the third voltage is larger than the second voltage.

Abstract: A liquid cooling head includes a chassis, an inlet channel, a thermally-conducting structure, a liquid gathering structure, a drain channel and a pump set. The chassis includes a lower chamber and an upper chamber communicated with the lower chamber through a connection opening. The inlet channel is disposed on one side of the chassis, and communicated with the upper chamber for radiating the heat of the working fluid away. The thermally-conducting structure is disposed in the lower chamber for gathering the working fluid passed through the thermally-conducting structure. The drain channel is disposed on one side of the chassis to be communicated with the lower chamber. The pump set for pushing the working fluid in the lower chamber to discharge the working fluid outwards from the drain channel.

Abstract: The present invention provides a double parallelogram vertical lifting device comprising a linkage mechanism and a pushing device. The linkage mechanism comprises a first shaft seat, a second shaft seat, a third shaft seat, an upper support unit movably coupled to the first shaft seat and the second shaft seat on both ends, and a lower support unit movably coupled to the second shaft seat and the third shaft seat on both ends. The upper support unit is provided with a first gear, and the lower support unit is provided with a second gear that meshes with the first gear. The pushing device has one end set on the upper support unit and the other end set on the lower support unit. The invention utilizes the interaction of the first gear and the second gear to generate a reaction force, which enables the lower support unit to cooperate with the upper support unit to move up and down synchronously, and achieves the effect of simple structure and large load capacity.

Abstract: In an embodiment, a device includes: an integrated circuit die including a die connector; a first through via adjacent the integrated circuit die; an encapsulant encapsulating the first through via and the integrated circuit die; and a redistribution structure on the encapsulant, the redistribution structure including a redistribution line, the redistribution line physically and electrically coupled to the die connector of the integrated circuit die, the redistribution line electrically isolated from the first through via, the redistribution line crossing over the first through via.

Abstract: A faucet assembly for rapid assembly of dual water sources includes a main body, a socket, a positioning member and a water pipe, wherein the main body includes a base and an extending pipe. The socket is arranged inside the base, the positioning member restricts the axial displacement of the socket, and the water pipe enters the extending pipe through the socket and the base. The water pipe includes an outer pipe, an inner pipe, and a water inlet structure, wherein the inner pipe is arranged inside the outer pipe, the outer pipe and the inner pipe are respectively connected to the water inlet structure, and the water inlet structure is laterally embedded in the water inlet structure. Water from different water sources enters the outer and inner pipes through the water inlet structure respectively.

Abstract: A coupling segment includes a coupling body, the coupling body defining a first end and an opposite second end, the coupling body further defining a first axial end and an opposite second axial end; a leg extending from the first end, the leg defining a proximal end proximate the first end and a distal end distal from the first end, the leg angling from the first axial end to the second axial end, the distal end defining a bearing member, the bearing member defining a planar bearing surface; and a fastener pad extending from the second end.

Abstract: A package structure is provided. The package structure includes a substrate and a chip-containing structure over the substrate. The package structure also includes a protective lid attached to the substrate through a first adhesive element and a second adhesive element. The first adhesive element has a first electrical resistivity, and the second adhesive element has a second electrical resistivity. The second electrical resistivity is greater than the first electrical resistivity. The second adhesive element is closer to a corner edge of the substrate than the first adhesive element, and a portion of the second adhesive element is between the first adhesive element and the chip-containing structure.

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a sensor chip and a package cover. The substrate has first and second substrate surfaces that are opposite to each other. The sensing chip is disposed on the first substrate surface and has a sensing area. The package cover includes a molding layer, a supporting layer and a light-transmitting layer. The molding layer surrounds the sensing area and is disposed on the first board surface. The supporting layer surrounds the sensing area and is disposed on the molding layer. The light-transmitting layer is disposed on the supporting layer and covers the substrate, the sensor chip, the molding layer and the supporting layer. The light-transmitting layer, the supporting layer, and the molding layer are formed to surround an enclosed space, and the sensing area is located in the enclosed space.

Abstract: An air brake electric control valve includes a valve body, a force balance unit including a guide member, and an electromagnetic urge unit including a movable column operable to move between an urging position and a retracted position. When the movable column is at the urging position, the movable column pushes the air guide member such that a through hole of the air guide member is blocked. When the movable column is at the retracted position, a gap is formed between the movable column and the air guide member such that an intermediate section and a second passage of the valve body are in fluid communication via the through hole of the air guide member and the gap.

Abstract: A Chip on Film (COF) package and a display device including the same are provided. The COF package includes: a film substrate; a chip arranged within a chip region on the film substrate; outer leads; and inner leads. The outer leads are arranged on the same side of the chip region and arranged as at least two rows of outer leads. The inner leads are arranged on a first side and a second side of the chip and connected with the chip. The at least two rows of outer leads include a first row and a second row of outer leads, the first row of outer leads are between the second row of outer leads and the chip, and wirings between at least part of leads among the second row of outer leads and the inner leads on the second side of the chip adopt a closed-loop like connection mode.

Abstract: A cold plate is provided and includes a casing, a guiding baffle, a base, a first inlet passage, an outlet passage and a pump. The guiding baffle is disposed in the casing and defines a fluid storage chamber together with the casing. The fluid storage chamber is filled with a working medium. The guiding baffle includes a communication opening. The base, the casing and guiding baffle together define a working space. The working medium flows into the working space through the communication opening, and the base is used for absorbing thermal energy and transfers the thermal energy to the working medium. The first inlet passage communicates with the fluid storage chamber and allows the cooled working medium to flow into the fluid storage chamber. The outlet passage communicates with the working space to allow the heated working medium to be discharged from the working space.

Abstract: Provided is a method of reducing a behavioral abnormality associated with a neurodevelopmental disorder in a subject, including administering to the subject an effective amount of Lactobacillus plantarum subsp. plantarum PS128. Also provided is a composition for preventing or treating a behavioral abnormality associated with a neurodevelopmental disorder in a subject in need thereof.

Abstract: A method of operating a memory device is provided. A clock signal is received. Each clock cycle of the clock signal initiates a write operation or a read operation in a memory device. A power nap period is then determined. The power nap period is compared with a clock cycle period to determine that the power nap period is less than the clock cycle period of the clock signal. A header control signal is generated in response to determining that the power nap period is less than the clock cycle period. The header control signal turns off a header of a component of the memory device.

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof. The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 ?m. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.