Abstract: A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.

Abstract: A semiconductor package is provided. The semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. The polymer layers cover a front surface of the semiconductor die. The redistribution elements and the passive filter are disposed in the stack of polymer layers. The passive filter includes a ground plane and conductive patches. The ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. The ground plane is electrically coupled to a reference voltage. The conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (DC) voltage.

Abstract: A semiconductor package includes a circuit board structure, a redistribution layer structure, a package structure, and a ring structure. The redistribution layer structure has a first region and a second region surrounding the first region. The redistribution layer structure is disposed over and electrically connected to the circuit board structure. A metal density in the second region is greater than a metal density in the first region. The package structure is disposed over the first region of the redistribution layer structure. The package structure is electrically connected to the redistribution layer structure. The ring structure is disposed over the second region of the redistribution layer structure.

Abstract: An apparatus for collecting information communicating with a server and a collecting device includes scanning a bar code and transmit identification information of the apparatus to the server; the bar code is configured to link to a webpage of the server; acquiring biological characteristic information of a user of the apparatus collected by the collecting device; acquiring the identification information and the biological characteristic information matched by the server; and displaying the identification information and the biological characteristic information synchronized with the server. A method and a server for collecting information are also disclosed.

Abstract: A semiconductor package is provided. The semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. The polymer layers cover a front surface of the semiconductor die. The redistribution elements and the passive filter are disposed in the stack of polymer layers. The passive filter includes a ground plane and conductive patches. The ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. The ground plane is electrically coupled to a reference voltage. The conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (DC) voltage.

Abstract: A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.

Abstract: A semiconductor package is provided. The semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. The polymer layers cover a front surface of the semiconductor die. The redistribution elements and the passive filter are disposed in the stack of polymer layers. The passive filter includes a ground plane and conductive patches. The ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. The ground plane is electrically coupled to a reference voltage. The conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (DC) voltage.

Abstract: A semiconductor package includes a circuit board structure, a redistribution layer structure, a package structure, and a ring structure. The redistribution layer structure has a first region and a second region surrounding the first region. The redistribution layer structure is disposed over and electrically connected to the circuit board structure. A metal density in the second region is greater than a metal density in the first region. The package structure is disposed over the first region of the redistribution layer structure. The package structure is electrically connected to the redistribution layer structure. The ring structure is disposed over the second region of the redistribution layer structure.

Abstract: A memory module includes a first redistribution structure, a second redistribution structure, first semiconductor dies, second semiconductor dies, an encapsulant, through insulator vias and thermally conductive material. Second redistribution structure is stacked over first redistribution structure. First semiconductor dies are sandwiched between first redistribution structure and second redistribution structure and disposed side by side. Second semiconductor dies are disposed on the second redistribution structure. The encapsulant laterally wraps the second semiconductor dies. The through insulator vias are disposed among the first semiconductor dies, extending from the first redistribution structure to the second redistribution structure. The through insulator vias are electrically connected to the first redistribution structure and the second redistribution structure.

Abstract: A memory module includes a first redistribution structure, a second redistribution structure, first semiconductor dies, second semiconductor dies, an encapsulant, through insulator vias and thermally conductive material. Second redistribution structure is stacked over first redistribution structure. First semiconductor dies are sandwiched between first redistribution structure and second redistribution structure and disposed side by side. Second semiconductor dies are disposed on the second redistribution structure. The encapsulant laterally wraps the second semiconductor dies. The through insulator vias are disposed among the first semiconductor dies, extending from the first redistribution structure to the second redistribution structure. The through insulator vias are electrically connected to the first redistribution structure and the second redistribution structure.

Abstract: A real-time video notification method for a transportation vehicle is executed by a real-time video notification system, and the real-time video notification method includes steps of: pairing an electronic device with a cloud server; capturing in-transportation-vehicle images; and transmitting the real-time video information and the position signal to the cloud server. The real-time video notification system includes a cloud server and an electronic device, wirelessly communicating with the cloud server. The electronic device includes a central processing unit (CPU), electrically connected to a camera module, a position module, an emergency button, and a wireless transmission circuit. The real-time video notification method and the real-time video notification system facilitate a driver or a passenger to seek help on their own as soon as possible in case of emergency.

Abstract: Semiconductor packages are provided. One of the semiconductor packages includes a first sub-package and a second sub-package. The first sub-package includes a first die, a graphite oxide layer on the first die and an encapsulant encapsulating the first die and the graphite oxide layer. The second sub-package is stacked on and electrically connected to the first sub-package, and includes a second die. The graphite oxide layer is disposed between the first die and the second die.

Abstract: Semiconductor packages are provided. One of the semiconductor packages includes a first sub-package and a second sub-package. The first sub-package includes a first die, a graphite oxide layer on the first die and an encapsulant encapsulating the first die and the graphite oxide layer. The second sub-package is stacked on and electrically connected to the first sub-package, and includes a second die. The graphite oxide layer is disposed between the first die and the second die.

Abstract: A soft start device for a power cutting machine tool, a control circuit group includes two end, one of which is connected with an input power source and the other is connected with each of two control switches. When the input power source provides a working voltage for the control circuit group, the control circuit group outputs a low-level signal to the control switches to enable a light emitting circuit group to lighting gradually from dark to light, whereby a resistance of a trigger circuit group decreases gradually to make motor setup the working voltage. Next, the control circuit group outputs a high-level signal after a period of time, to turn on the control switches for inputting voltage to the motor directly. The soft start device can not only decrease the noise during activation of the motor but effectively protect the internal components of an electronic device from damage.

Abstract: A soft start device for a power cutting machine tool, a control circuit group includes two end, one of which is connected with an input power source and the other is connected with each of two control switches. When the input power source provides a working voltage for the control circuit group, the control circuit group outputs a low-level signal to the control switches to enable a light emitting circuit group to lighting gradually from dark to light, whereby a resistance of a trigger circuit group decreases gradually to make motor setup the working voltage. Next, the control circuit group outputs a high-level signal after a period of time, to turn on the control switches for inputting voltage to the motor directly. The soft start device can not only decrease the noise during activation of the motor but effectively protect the internal components of an electronic device from damage.

Abstract: An image processing method of an image processing apparatus includes: determining static pixels and non-static pixels of a current image frame; dividing the current image frame into a plurality of blocks, wherein each block comprises a plurality of pixels; determining static blocks and non-static blocks of the current image frame by referring to at least the static pixels and the non-static pixels of the current image frame; and refining determination of the static pixels and the non-static pixels of the current image frame according to the static blocks and the non-static blocks.

Abstract: Frame data stored in an external memory is partitioned into a plurality of macroblocks, and a plurality of access units each comprising at least one macroblock are provided. A plurality of frames are fetched from the external memory by loading the plurality of access units in a predetermined sequence. A current data for decoding a macroblock of the first access unit and a reference data for decoding a macroblock of the second access unit are loaded from the first access unit, and respectively mapped to a first memory group and a second memory group of a circular cache according to the frame width.

Abstract: A method for reducing computational complexity of video compression standard is provided, and it includes an intra 4×4 macroblock (I4MB) search algorithm, an intra 16×16 macroblock (I16MB) search algorithm and a chroma search algorithm. The I4MB search algorithm and I16MB search algorithm accelerate the prediction process of the luma macroblock, and the chroma search algorithm accelerates the prediction process of chroma macroblock. The above algorithms can greatly reduce the computation of prediction mode of video compression standard.

Abstract: A memory management method includes fetching data corresponding to a plurality of image blocks, including at least two image blocks with different block sizes; and utilizing a memory device having a plurality of memory banks for storing the data corresponding to the plurality of image blocks. The memory management method and a related memory apparatus can make the memory device buffer motion blocks of variable sizes in an efficient way.