Abstract: A toothbrush structure contains: a body, a movable brush, and a protective unit. The body includes a handle, a connecting neck, and a fixed head. The connecting neck is connected with the handle and the fixed head, the fixed head has multiple first orifices for receiving multiple first bristles, and a slot is formed on the fixed head and extends to the handle. The movable brush slides in the slot linearly and includes a push block, a slidable post, and a movable brushing portion. The push block is disposed on the slidable post, and the movable brushing portion is mounted on the slidable post opposite to the push block and has multiple second orifices for receiving multiple second bristles. The slidable post is received in the slot. The protective unit is configured to cover the slot so that the movable brush is limited to slide in the slot.

Abstract: A substrate structure includes a glass substrate, a first circuit layer, a second circuit layer, and at least one conductive region. The glass substrate has a first surface and a second surface opposing the first surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The conductive region includes a plurality of conductive micro vias. The conductive micro vias penetrate through the glass substrate. The conductive micro vias are electrically connected to the first circuit layer and the second circuit layer, and the conductive micro vias have a via size of 2 ?m to 10 ?m.

Abstract: A wearable physiologic state monitoring device includes a textile fabric, a flexible sensing unit, and a control unit. The textile fabric has a first surface and a second surface opposite to each other. The flexible sensing unit is joined to the first surface of the textile fabric and has a flexible substrate and a sensing element. The flexible substrate has a bearing surface, and a patterned conductive circuit is provided on the bearing surface. The sensing element is electrically connected to the patterned conductive circuit. The control unit is adjacent to the flexible sensing unit and is electrically connected to the patterned conductive circuit.

Abstract: Provided are nanopore devices that include a hafnium oxide coating on the pores of the devices. Such devices exhibit improved stability, especially when in a salt solution environment. Also provided are related methods.

Abstract: A crimping tool is disclosed. The crimping tool includes a base, an operating member and a moving member. The base includes a pivot location, a sliding groove, and first and second fixing locations. The first and second fixing locations are respectively located on two ends of the sliding groove to fix a connector of a wire. The operating member includes a holding portion, a pivot hole and a gear. The pivot hole is pivotally connected to the pivot location of the base through a pivot shaft. The moving member includes a rack, and first and second crimping elements. When the operating member rotates, the gear drives the rack to enable the moving member to move simultaneously, so as to use the first or second crimping element to press fit the connector of the wire placed at the first or second fixing location.

Abstract: A welding filler feed-forward maintaining device is provided with a sliding block on a sliding rail mechanism, wherein the sliding jail mechanism is an end shaft of a working space, which is suitable tor use of the end arm of a robot arm, and a main bracket is vertically erected to pivot on the sliding block via a pivoting seat, and the main bracket extends to a welding head at one end, and an end of a solder conduit for soldering is bent toward the soldering tip, and a discharge port for leading the solder is furnished, and a pivoting drive assembly coupled to the pivoting seat is further disposed on the sliding block and is configured to drive the pivoting seat to pivot the main bracket in order to keep the discharge port in front of the weld head along the varying welding direction.

Abstract: A method for processing three-dimensional point cloud data includes a data creation step, a layering step, a gridding step, a data processing step and a two-dimensional image generation step, so that the three-dimensional point cloud data can be converted into a two-dimensional image, and the two-dimensional image can correspond to, identify and store the axial depth and information point features of the point cloud data in three axes.

Abstract: A washable physiological state sensing device, including a flexible carrier, a flexible electrode and a flexible conductive circuit. The flexible carrier is made of elastic material and provided with a bonding surface; The flexible electrode is arranged on the bonding surface, and provided with a flexible substrate and a plurality of conductive particles; The conductive particles are doped in the flexible substrate, and the flexible substrate is made of elastic material. The flexible conductive circuit is arranged on the bonding surface and electrically connected with the flexible electrode.

Abstract: The present disclosure relates to a cap assembly for a medicament delivery device, having a cap containing a tubular body provided with a distal opening, the cap being configured to be mounted to a proximal end of a medicament delivery device, a tubular remover configured to be received in the distal opening of the cap, the remover having flexible radially inwards extending grippers configured to engage with a delivery member shield, and a tubular remover insert configured to be received by the remover and configured to be fixedly attached to the cap to prevent axial displacement of the remover insert relative to the cap, wherein the remover is axially displaceable relative to the cap and relative to the remover insert, from a first position in which the grippers are pressed radially outwards by an outer surface of the remover insert, to a second position located distally relative to the first position, in which second position the grippers are arranged distally beyond the outer surface of the remover insert,

Abstract: A crimping tool is disclosed. The crimping tool comprises a first handle, a second handle, a crimping member, a first mechanism link and a second mechanism link. The first handle comprises a hole and a first shaft portion, wherein the first shaft portion is adjacent to a top end of the first handle. The second handle comprises a second shaft portion, wherein the first shaft portion and the second shaft portion are connected by a shaft member. The crimping member is disposed on the first handle. The first and the second mechanism links are respectively connected with the first handle, the second handle and the crimping member such that when the first handle and the second tool are rotated with respect to each other, the crimping member is pushed to move from a first position to a second position.

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

Abstract: A chip packaging structure includes a circuit redistribution structure, a chip, a sealing layer, and an antenna pattern. The circuit redistribution structure includes a first and a second circuit layer, and a conductive pad. The second circuit layer is disposed on and electrically connected to the first circuit layer. The conductive pad is electrically connected to the second circuit layer. The chip is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The sealing layer having an opening and a groove covers the chip and the circuit redistribution structure. The opening exposes the conductive pad. A portion of the groove communicates with the opening. The antenna pattern includes a first and a second portion. The first portion covers sidewalls of the opening and is electrically connected to the conductive pad. The second portion is filled in the groove and electrically connected to the first portion.

Abstract: A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.

Abstract: A washable physiological state sensing device, including a flexible carrier, a flexible electrode and a flexible conductive circuit. The flexible carrier is made of elastic material and provided with a bonding surface; The flexible electrode is arranged on the bonding surface, and provided with a flexible substrate and a plurality of conductive particles; The conductive particles are doped in the flexible substrate, and the flexible substrate is made of elastic material. The flexible conductive circuit is arranged on the bonding surface and electrically connected with the flexible electrode.

Abstract: An electronic device includes a communication port, a display, a processor, and a memory. The processor detects whether an external device plugs into the communication port, displays a user interface on the display when an external device plugs into the communication port, detects whether the user interface receives a predetermined user operation, recommends relevant data linked to the external device according to predetermined rules when the user interface receives the predetermined user operation, and displays the relevant data linked to the external device on the display.

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

Abstract: A chip packaging structure includes a circuit redistribution structure, a chip, a sealing layer, and an antenna pattern. The circuit redistribution structure includes a first and a second circuit layer, and a conductive pad. The second circuit layer is disposed on and electrically connected to the first circuit layer. The conductive pad is electrically connected to the second circuit layer. The chip is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The sealing layer having an opening and a groove covers the chip and the circuit redistribution structure. The opening exposes the conductive pad. A portion of the groove communicates with the opening. The antenna pattern includes a first and a second portion. The first portion covers sidewalls of the opening and is electrically connected to the conductive pad. The second portion is filled in the groove and electrically connected to the first portion.

Abstract: A photomask purging method includes opening a pod having a photomask therein, gripping the photomask by an end effector, moving the end effector from the opened pod to a destination where a gas exit is toward, exhausting a gas from the gas exit toward the gripped photomask, and rotating the end effector with respect to a horizontal plane when the end effector is at the destination where the gas exit is toward.

Abstract: A composite substrate structure includes a circuit substrate, a first anisotropic conductive film, a first glass substrate, a dielectric layer, a patterned circuit layer and a conductive via. The first anisotropic conductive film is disposed on the circuit substrate. The first glass substrate is disposed on the first anisotropic conductive film and has a first surface and a second surface opposite to the first surface. The first glass substrate includes a first circuit layer, a second circuit layer and at least one first conductive via. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The first conductive via penetrates the first glass substrate and is electrically connected to the first circuit layer and the second circuit layer. The first glass substrate and the circuit substrate are respectively located on two opposite sides of the first anisotropic conductive film.