Abstract: An electronic device includes a display, a global positioning unit, a processor, and a memory. The global positioning unit establishes a location of the electronic device. The processor displays a user interface on the display, detects whether the user interface receives a predetermined gesture applied thereon, obtains a name of the location where the electronic device is located and a type of location corresponding to the name of the location when the predetermined gesture applied on the user interface is detected, and recommends relevant data on the user interface according to the type of location or the name of the location.

Abstract: A hierarchical wireless power management system using a remote control device to control multiple slave controllers is disclosed. The control module of the remote control device comprises a processing circuit, a wireless signal transmission circuit, and a storage unit. The wireless signal transmission circuit is adapted for transmitting a control signal to a corresponding slave controller. The storage unit is storing settings related to the slave controllers. The remote control device manage the operations of slave controllers with a capability of doing a group controlling under the hierarchical architecture, based upon settings comprising a hierarchical grouping distribution architecture changeably set by a managing user and respective corresponding identification codes of the slave controllers set by the managing user.

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.

Abstract: A composite substrate structure includes a circuit substrate, a first anisotropic conductive film, a first glass substrate, a dielectric layer, a patterned circuit layer and a conductive via. The first anisotropic conductive film is disposed on the circuit substrate. The first glass substrate is disposed on the first anisotropic conductive film and has a first surface and a second surface opposite to the first surface. The first glass substrate includes a first circuit layer, a second circuit layer and at least one first conductive via. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The first conductive via penetrates the first glass substrate and is electrically connected to the first circuit layer and the second circuit layer. The first glass substrate and the circuit substrate are respectively located on two opposite sides of the first anisotropic conductive film.

Abstract: A substrate structure includes a glass substrate, a first circuit layer, a second circuit layer, and at least one conductive region. The glass substrate has a first surface and a second surface opposing the first surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The conductive region includes a plurality of conductive micro vias. The conductive micro vias penetrate through the glass substrate. The conductive micro vias are electrically connected to the first circuit layer and the second circuit layer, and the conductive micro vias have a via size of 2 ?m to 10 ?m.

Abstract: A data input method is implemented by an electronic device that includes a storage component, a display device and a processor. The storage component stores an application to be executed by the processor, in response to user-input selection of the application, to implement the data input method for entering data in an input field displayed on the display device. The data input method includes controlling the display device to display at least one hotkey that is associated with pre-stored data, and in response to user-input interaction associated with the at least one hotkey, entering the pre-stored data in the input field.

Abstract: A carrier structure including a glass substrate, a buffer layer, and an inner circuit layer is provided. The glass substrate has a first surface, a second surface opposite to the first surface, and at least one through hole penetrating through the glass substrate. The buffer layer is disposed on the first surface and the second surface of the glass substrate. The inner circuit layer is disposed on the buffer layer and in the through hole of the glass substrate. The inner circuit layer exposes a part of the buffer layer.

Abstract: A light-emitting diode package including a carrier structure, a patterned conductive layer, at least one chip, a dielectric layer, at least one first conductive via, a build-up circuit structure, and at least one light-emitting diode is provided. The patterned conductive layer is disposed on the carrier structure. The chip is disposed on the carrier structure. The dielectric layer is disposed on the carrier structure and encapsulates the chip and the patterned conductive layer. The first conductive via penetrates the dielectric layer and is electrically connected to the patterned conductive layer. The build-up circuit structure is disposed on the dielectric layer and electrically connected to the first conductive via. The light-emitting diode is disposed on the build-up circuit structure.

Abstract: An adapter is provided and having a circuit board, primary components and secondary components installed on the circuit board, a shielding plate disposed between the primary components and the secondary components, and a transformer installed on the circuit board. The transformer has a bobbin, an iron core set assembled with the bobbin, at least one movable pin, at least one first winding, and at least one second winding. The movable pin is able to be positioned at an upper position for allowing the iron core set to be assembled with the bobbin or for allowing the first winding and the second winding to be wound onto the winding portion, and the movable pin is able to be positioned at a lower position when the transformer is installed onto the circuit board. Thereby, the adapter can be assembled in an automated process with improved assembly efficiency and high production yields.

Abstract: A carrier structure including a glass substrate, a buffer layer, and an inner circuit layer is provided. The glass substrate has a first surface, a second surface opposite to the first surface, and at least one through hole penetrating through the glass substrate. The buffer layer is disposed on the first surface and the second surface of the glass substrate. The inner circuit layer is disposed on the buffer layer and in the through hole of the glass substrate. The inner circuit layer exposes a part of the buffer layer.

Abstract: A chip packaging structure includes a circuit redistribution structure, a chip, a sealing layer, and an antenna pattern. The circuit redistribution structure includes a first and a second circuit layer, and a conductive pad. The second circuit layer is disposed on and electrically connected to the first circuit layer. The conductive pad is electrically connected to the second circuit layer. The chip is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The sealing layer having an opening and a groove covers the chip and the circuit redistribution structure. The opening exposes the conductive pad. A portion of the groove communicates with the opening. The antenna pattern includes a first and a second portion. The first portion covers sidewalls of the opening and is electrically connected to the conductive pad. The second portion is filled in the groove and electrically connected to the first portion.

Abstract: A display driving apparatus including a receiver circuit, a detection circuit and a driving circuit is provided. The receiver circuit receives the video image data at a first rate. The detection circuit is coupled to the receiver circuit. The detection circuit detects whether the video image data is a static image, and determines whether the display driving apparatus enters a power saving mode based on a detecting result. The driving circuit is coupled to the receiver circuit. The driving circuit drives the display panel. In the power saving mode, the receiver circuit continuously receives the video image data at the first rate, and periodically masks a part of the video image data according to the detecting result and outputs an unmasked part of the video image data to the driving circuit. Furthermore, a display driving method adapted for the foregoing display driving apparatus is also provided.

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.

Abstract: A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.

Abstract: A crimping tool is disclosed. The crimping tool comprises a first tool, a second tool, a crimping member, a first connecting rod and a second connecting rod. The first tool comprises a hole and a first shaft portion, wherein the first shaft portion is adjacent to a top end of the first tool. The second tool comprises a second shaft portion, wherein the first shaft portion and the second shaft portion are connected by a shaft member. The crimping member is disposed on the first tool. The first and the second connecting rods are respectively connected with the first tool, the second tool and the crimping member such that when the first tool and the second tool are rotated with respect to each other, the crimping member is pushed to move from a first position to a second position.

Abstract: A cable stripping tool used for stripping an outer layer of a cable includes a first plier, a second plier, a cable receiving hole, a blade, a first clamping area, and a second clamping area. The second plier is pivotally connected to the first plier by a rotating shaft. The cable receiving hole is disposed on the second plier for receiving the cable. The blade is disposed on the first plier and opposite to the cable receiving hole. The first clamping area and the second clamping area are disposed on the first plier, and the blade is disposed between the first clamping area and the second clamping area; the cable receiving hole, the first clamping area and the second clamping area together clamp the cable such that the blade is able to cut the outer layer of the cable.

Abstract: The present invention provides an ATX specification power supply comprising redundant power supply architecture. A casing where the ATX specification power supply is located includes an ATX specification housing and a frame provided in the ATX specification housing. The frame is defined with a plurality of power module assembly regions and a modulation module assembly region in the ATX specification housing. The power module assembly regions are for a plurality of power modules to be provided therein, and the modulation module assembly region is for a power modulation module to be provided therein. The plurality of power modules and the power modulation module are further connected to a power integration backplate provided in the ATX specification housing, enabling the ATX specification power supply to construct redundant power supply architecture.

Abstract: The present disclosure relates to a cap assembly for a medicament delivery device, having a cap containing a tubular body provided with a distal opening, the cap being configured to be mounted to a proximal end of a medicament delivery device, a tubular remover configured to be received in the distal opening of the cap, the remover having flexible radially inwards extending grippers configured to engage with a delivery member shield, and a tubular remover insert configured to be received by the remover and configured to be fixedly attached to the cap to prevent axial displacement of the remover insert relative to the cap, wherein the remover is axially displaceable relative to the cap and relative to the remover insert, from a first position in which the grippers are pressed radially outwards by an outer surface of the remover insert, to a second position located distally relative to the first position, in which second position the grippers are arranged distally beyond the outer surface of the remover insert,

Abstract: A photomask purging method includes opening a pod having a photomask therein, gripping the photomask by an end effector, moving the end effector from the opened pod to a destination where a gas exit is toward, exhausting a gas from the gas exit toward the gripped photomask, and rotating the end effector with respect to a horizontal plane when the end effector is at the destination where the gas exit is toward.

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.