Abstract: A composite substrate structure includes a circuit substrate, a first anisotropic conductive film, a first glass substrate, a dielectric layer, a patterned circuit layer and a conductive via. The first anisotropic conductive film is disposed on the circuit substrate. The first glass substrate is disposed on the first anisotropic conductive film and has a first surface and a second surface opposite to the first surface. The first glass substrate includes a first circuit layer, a second circuit layer and at least one first conductive via. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The first conductive via penetrates the first glass substrate and is electrically connected to the first circuit layer and the second circuit layer. The first glass substrate and the circuit substrate are respectively located on two opposite sides of the first anisotropic conductive film.

Abstract: A piezoelectric patch sensor for measuring muscle movement of contraction and extension is disclosed. The sensor is elongated and directly attached to a skin site of a user for the measuring via an interface circuit connected to a host processor. The piezoelectric patch sensor has an adhesive layer with an adhesive bottom surface for firmly attaching to the skin site. An elastic sheet is integrated on top of the adhesive layer. A piezoelectric thread is further integrated on top of the elastic sheet and has a bundle of aligned piezoelectric fibers. The thread is electrically coupled to the interface circuit via a pair of conductive wires, forming a piezoelectric measurement circuitry. Muscle movement under the skin site shrinks or extends the piezoelectric patch sensor in its entirety along the direction of muscle movement due to a corresponding shrinking or extending movement of the skin firmly attached to the adhesive layer.

Abstract: A piezoelectric patch sensor for measuring muscle movement of contraction and extension is disclosed. The sensor is elongated and directly attached to a skin site of a user for the measuring via an interface circuit connected to a host processor. The piezoelectric patch sensor has an adhesive layer with an adhesive bottom surface for firmly attaching to the skin site. An elastic sheet is integrated on top of the adhesive layer. A piezoelectric thread is further integrated on top of the elastic sheet and has a bundle of aligned piezoelectric fibers. The thread is electrically coupled to the interface circuit via a pair of conductive wires, forming a piezoelectric measurement circuitry. Muscle movement under the skin site shrinks or extends the piezoelectric patch sensor in its entirety along the direction of muscle movement due to a corresponding shrinking or extending movement of the skin firmly attached to the adhesive layer.

Abstract: An embedded chip package includes a circuit board, a chip, a dielectric material layer, and a build-up circuit structure. The circuit board includes a glass substrate and at least one conductive via. The glass substrate has a first surface, a second surface opposite the first surface, and a through-hole penetrating the glass substrate. The conductive via penetrates the glass substrate. The chip is disposed inside the through-hole. The dielectric material layer is filled inside the through-hole and covers the chip. The build-up circuit structure is disposed on the circuit board. The build-up circuit structure is electrically connected to the conductive via. A lower surface of the chip is exposed outside the dielectric material layer.

Abstract: The present invention discloses ventilation apparatus, comprising a casing with a first vent and a second vent, a fixed spacer disposed within the casing, and a movable spacer in operative connection with a power mechanism. Also discloses herein are methods for ventilating a subject, by synchronously providing a positive pressure ventilation and a negative pressure ventilation using the ventilation apparatus described herein.

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.

Abstract: An electronic device includes a display, a global positioning unit, a processor, and a memory. The global positioning unit establishes a location of the electronic device. The processor displays a user interface on the display, detects whether the user interface receives a predetermined gesture applied thereon, obtains a name of the location where the electronic device is located and a type of location corresponding to the name of the location when the predetermined gesture applied on the user interface is detected, and recommends relevant data on the user interface according to the type of location or the name of the location.

Abstract: A crimping tool is disclosed. The crimping tool includes a base, an operating member and a moving member. The base includes a pivot location, a sliding groove, and first and second fixing locations. The first and second fixing locations are respectively located on two ends of the sliding groove to fix a connector of a wire. The operating member includes a holding portion, a pivot hole and a gear. The pivot hole is pivotally connected to the pivot location of the base through a pivot shaft. The moving member includes a rack, and first and second crimping elements. When the operating member rotates, the gear drives the rack to enable the moving member to move simultaneously, so as to use the first or second crimping element to press fit the connector of the wire placed at the first or second fixing location.

Abstract: A stretchable and flexible sensing device includes a first elastic membrane, a first strain sensor and a processing unit. The first elastic membrane has a first surface, a second surface and a plurality of electrode contacts. The first surface and the second surface are disposed of opposite to each other and the electrode contacts are disposed on the first surface. One of the electrode contacts is as ground terminal. The first strain sensor is disposed on the first surface by printing technology so as to electrically connect to the electrode contacts. The processing unit is electrically connected to the electrode contacts. The processing unit operates according to a stretch resistance value of one of the first strain sensor.

Abstract: A correction control module for a power factor correction circuit comprises a current sampling unit, an adjustment unit and a control unit. The current sampling unit generates a sampling current based on the operation of a power factor correction circuit. The adjustment unit is connected to the current sampling unit and receives the sampling current. The adjustment unit is composed of a fixed resistance branch and a variable resistance branch connected in parallel with the fixed resistance branch, and the variable resistance and fixed resistance branches receive the sampling current to generate a node voltage. The control unit controls a resistance of the variable resistance branch based on an input voltage and an output voltage of the power factor correction circuit. Thus, an equivalent resistance of the variable resistance branch and the fixed resistance branch is changed according to an operating state of the power factor correction circuit.

Abstract: An electronic device includes a display, a global positioning unit, a processor, and a memory. The global positioning unit establishes a location of the electronic device. The processor displays a user interface on the display, detects whether the user interface receives a predetermined gesture applied thereon, obtains a name of the location where the electronic device is located and a type of location corresponding to the name of the location when the predetermined gesture applied on the user interface is detected, and recommends relevant data on the user interface according to the type of location or the name of the location.

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.

Abstract: A hierarchical wireless power management system using a remote control device to control multiple slave controllers is disclosed. The control module of the remote control device comprises a processing circuit, a wireless signal transmission circuit, and a storage unit. The wireless signal transmission circuit is adapted for transmitting a control signal to a corresponding slave controller. The storage unit is storing settings related to the slave controllers. The remote control device manage the operations of slave controllers with a capability of doing a group controlling under the hierarchical architecture, based upon settings comprising a hierarchical grouping distribution architecture changeably set by a managing user and respective corresponding identification codes of the slave controllers set by the managing user.

Abstract: A composite substrate structure includes a circuit substrate, a first anisotropic conductive film, a first glass substrate, a dielectric layer, a patterned circuit layer and a conductive via. The first anisotropic conductive film is disposed on the circuit substrate. The first glass substrate is disposed on the first anisotropic conductive film and has a first surface and a second surface opposite to the first surface. The first glass substrate includes a first circuit layer, a second circuit layer and at least one first conductive via. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The first conductive via penetrates the first glass substrate and is electrically connected to the first circuit layer and the second circuit layer. The first glass substrate and the circuit substrate are respectively located on two opposite sides of the first anisotropic conductive film.

Abstract: A substrate structure includes a glass substrate, a first circuit layer, a second circuit layer, and at least one conductive region. The glass substrate has a first surface and a second surface opposing the first surface. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The conductive region includes a plurality of conductive micro vias. The conductive micro vias penetrate through the glass substrate. The conductive micro vias are electrically connected to the first circuit layer and the second circuit layer, and the conductive micro vias have a via size of 2 ?m to 10 ?m.

Abstract: A data input method is implemented by an electronic device that includes a storage component, a display device and a processor. The storage component stores an application to be executed by the processor, in response to user-input selection of the application, to implement the data input method for entering data in an input field displayed on the display device. The data input method includes controlling the display device to display at least one hotkey that is associated with pre-stored data, and in response to user-input interaction associated with the at least one hotkey, entering the pre-stored data in the input field.

Abstract: An adapter is provided and having a circuit board, primary components and secondary components installed on the circuit board, a shielding plate disposed between the primary components and the secondary components, and a transformer installed on the circuit board. The transformer has a bobbin, an iron core set assembled with the bobbin, at least one movable pin, at least one first winding, and at least one second winding. The movable pin is able to be positioned at an upper position for allowing the iron core set to be assembled with the bobbin or for allowing the first winding and the second winding to be wound onto the winding portion, and the movable pin is able to be positioned at a lower position when the transformer is installed onto the circuit board. Thereby, the adapter can be assembled in an automated process with improved assembly efficiency and high production yields.

Abstract: A light-emitting diode package including a carrier structure, a patterned conductive layer, at least one chip, a dielectric layer, at least one first conductive via, a build-up circuit structure, and at least one light-emitting diode is provided. The patterned conductive layer is disposed on the carrier structure. The chip is disposed on the carrier structure. The dielectric layer is disposed on the carrier structure and encapsulates the chip and the patterned conductive layer. The first conductive via penetrates the dielectric layer and is electrically connected to the patterned conductive layer. The build-up circuit structure is disposed on the dielectric layer and electrically connected to the first conductive via. The light-emitting diode is disposed on the build-up circuit structure.

Abstract: A carrier structure including a glass substrate, a buffer layer, and an inner circuit layer is provided. The glass substrate has a first surface, a second surface opposite to the first surface, and at least one through hole penetrating through the glass substrate. The buffer layer is disposed on the first surface and the second surface of the glass substrate. The inner circuit layer is disposed on the buffer layer and in the through hole of the glass substrate. The inner circuit layer exposes a part of the buffer layer.

Abstract: A carrier structure including a glass substrate, a buffer layer, and an inner circuit layer is provided. The glass substrate has a first surface, a second surface opposite to the first surface, and at least one through hole penetrating through the glass substrate. The buffer layer is disposed on the first surface and the second surface of the glass substrate. The inner circuit layer is disposed on the buffer layer and in the through hole of the glass substrate. The inner circuit layer exposes a part of the buffer layer.