Abstract: A crimping tool is disclosed. The crimping tool comprises a first handle, a second handle, a crimping member, a first mechanism link and a second mechanism link. The first handle comprises a hole and a first shaft portion, wherein the first shaft portion is adjacent to a top end of the first handle. The second handle comprises a second shaft portion, wherein the first shaft portion and the second shaft portion are connected by a shaft member. The crimping member is disposed on the first handle. The first and the second mechanism links are respectively connected with the first handle, the second handle and the crimping member such that when the first handle and the second tool are rotated with respect to each other, the crimping member is pushed to move from a first position to a second position.

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

Abstract: A chip packaging structure includes a circuit redistribution structure, a chip, a sealing layer, and an antenna pattern. The circuit redistribution structure includes a first and a second circuit layer, and a conductive pad. The second circuit layer is disposed on and electrically connected to the first circuit layer. The conductive pad is electrically connected to the second circuit layer. The chip is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The sealing layer having an opening and a groove covers the chip and the circuit redistribution structure. The opening exposes the conductive pad. A portion of the groove communicates with the opening. The antenna pattern includes a first and a second portion. The first portion covers sidewalls of the opening and is electrically connected to the conductive pad. The second portion is filled in the groove and electrically connected to the first portion.

Abstract: A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.

Abstract: A washable physiological state sensing device, including a flexible carrier, a flexible electrode and a flexible conductive circuit. The flexible carrier is made of elastic material and provided with a bonding surface; The flexible electrode is arranged on the bonding surface, and provided with a flexible substrate and a plurality of conductive particles; The conductive particles are doped in the flexible substrate, and the flexible substrate is made of elastic material. The flexible conductive circuit is arranged on the bonding surface and electrically connected with the flexible electrode.

Abstract: An electronic device includes a communication port, a display, a processor, and a memory. The processor detects whether an external device plugs into the communication port, displays a user interface on the display when an external device plugs into the communication port, detects whether the user interface receives a predetermined user operation, recommends relevant data linked to the external device according to predetermined rules when the user interface receives the predetermined user operation, and displays the relevant data linked to the external device on the display.

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

Abstract: A chip packaging structure includes a circuit redistribution structure, a chip, a sealing layer, and an antenna pattern. The circuit redistribution structure includes a first and a second circuit layer, and a conductive pad. The second circuit layer is disposed on and electrically connected to the first circuit layer. The conductive pad is electrically connected to the second circuit layer. The chip is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The sealing layer having an opening and a groove covers the chip and the circuit redistribution structure. The opening exposes the conductive pad. A portion of the groove communicates with the opening. The antenna pattern includes a first and a second portion. The first portion covers sidewalls of the opening and is electrically connected to the conductive pad. The second portion is filled in the groove and electrically connected to the first portion.

Abstract: A photomask purging method includes opening a pod having a photomask therein, gripping the photomask by an end effector, moving the end effector from the opened pod to a destination where a gas exit is toward, exhausting a gas from the gas exit toward the gripped photomask, and rotating the end effector with respect to a horizontal plane when the end effector is at the destination where the gas exit is toward.

Abstract: A composite substrate structure includes a circuit substrate, a first anisotropic conductive film, a first glass substrate, a dielectric layer, a patterned circuit layer and a conductive via. The first anisotropic conductive film is disposed on the circuit substrate. The first glass substrate is disposed on the first anisotropic conductive film and has a first surface and a second surface opposite to the first surface. The first glass substrate includes a first circuit layer, a second circuit layer and at least one first conductive via. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The first conductive via penetrates the first glass substrate and is electrically connected to the first circuit layer and the second circuit layer. The first glass substrate and the circuit substrate are respectively located on two opposite sides of the first anisotropic conductive film.

Abstract: A piezoelectric patch sensor for measuring muscle movement of contraction and extension is disclosed. The sensor is elongated and directly attached to a skin site of a user for the measuring via an interface circuit connected to a host processor. The piezoelectric patch sensor has an adhesive layer with an adhesive bottom surface for firmly attaching to the skin site. An elastic sheet is integrated on top of the adhesive layer. A piezoelectric thread is further integrated on top of the elastic sheet and has a bundle of aligned piezoelectric fibers. The thread is electrically coupled to the interface circuit via a pair of conductive wires, forming a piezoelectric measurement circuitry. Muscle movement under the skin site shrinks or extends the piezoelectric patch sensor in its entirety along the direction of muscle movement due to a corresponding shrinking or extending movement of the skin firmly attached to the adhesive layer.

Abstract: A piezoelectric patch sensor for measuring muscle movement of contraction and extension is disclosed. The sensor is elongated and directly attached to a skin site of a user for the measuring via an interface circuit connected to a host processor. The piezoelectric patch sensor has an adhesive layer with an adhesive bottom surface for firmly attaching to the skin site. An elastic sheet is integrated on top of the adhesive layer. A piezoelectric thread is further integrated on top of the elastic sheet and has a bundle of aligned piezoelectric fibers. The thread is electrically coupled to the interface circuit via a pair of conductive wires, forming a piezoelectric measurement circuitry. Muscle movement under the skin site shrinks or extends the piezoelectric patch sensor in its entirety along the direction of muscle movement due to a corresponding shrinking or extending movement of the skin firmly attached to the adhesive layer.

Abstract: An embedded chip package includes a circuit board, a chip, a dielectric material layer, and a build-up circuit structure. The circuit board includes a glass substrate and at least one conductive via. The glass substrate has a first surface, a second surface opposite the first surface, and a through-hole penetrating the glass substrate. The conductive via penetrates the glass substrate. The chip is disposed inside the through-hole. The dielectric material layer is filled inside the through-hole and covers the chip. The build-up circuit structure is disposed on the circuit board. The build-up circuit structure is electrically connected to the conductive via. A lower surface of the chip is exposed outside the dielectric material layer.

Abstract: The present invention discloses ventilation apparatus, comprising a casing with a first vent and a second vent, a fixed spacer disposed within the casing, and a movable spacer in operative connection with a power mechanism. Also discloses herein are methods for ventilating a subject, by synchronously providing a positive pressure ventilation and a negative pressure ventilation using the ventilation apparatus described herein.

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.

Abstract: An electronic device includes a display, a global positioning unit, a processor, and a memory. The global positioning unit establishes a location of the electronic device. The processor displays a user interface on the display, detects whether the user interface receives a predetermined gesture applied thereon, obtains a name of the location where the electronic device is located and a type of location corresponding to the name of the location when the predetermined gesture applied on the user interface is detected, and recommends relevant data on the user interface according to the type of location or the name of the location.

Abstract: A crimping tool is disclosed. The crimping tool includes a base, an operating member and a moving member. The base includes a pivot location, a sliding groove, and first and second fixing locations. The first and second fixing locations are respectively located on two ends of the sliding groove to fix a connector of a wire. The operating member includes a holding portion, a pivot hole and a gear. The pivot hole is pivotally connected to the pivot location of the base through a pivot shaft. The moving member includes a rack, and first and second crimping elements. When the operating member rotates, the gear drives the rack to enable the moving member to move simultaneously, so as to use the first or second crimping element to press fit the connector of the wire placed at the first or second fixing location.

Abstract: A stretchable and flexible sensing device includes a first elastic membrane, a first strain sensor and a processing unit. The first elastic membrane has a first surface, a second surface and a plurality of electrode contacts. The first surface and the second surface are disposed of opposite to each other and the electrode contacts are disposed on the first surface. One of the electrode contacts is as ground terminal. The first strain sensor is disposed on the first surface by printing technology so as to electrically connect to the electrode contacts. The processing unit is electrically connected to the electrode contacts. The processing unit operates according to a stretch resistance value of one of the first strain sensor.

Abstract: A correction control module for a power factor correction circuit comprises a current sampling unit, an adjustment unit and a control unit. The current sampling unit generates a sampling current based on the operation of a power factor correction circuit. The adjustment unit is connected to the current sampling unit and receives the sampling current. The adjustment unit is composed of a fixed resistance branch and a variable resistance branch connected in parallel with the fixed resistance branch, and the variable resistance and fixed resistance branches receive the sampling current to generate a node voltage. The control unit controls a resistance of the variable resistance branch based on an input voltage and an output voltage of the power factor correction circuit. Thus, an equivalent resistance of the variable resistance branch and the fixed resistance branch is changed according to an operating state of the power factor correction circuit.