Abstract: A carrier for transmitting a high frequency signal and a carrier layout method thereof are provided. The carrier includes a substrate, conducting wires and reference planes both formed on the substrate. The carrier layout method includes defining impedance and thickness of the carrier according to the high frequency signal and defining layout parameters according to the impedance and the thickness. The layout parameters include a conducting layer formed on the conducting wires, a coplanar waveguide encompasses both the reference planes and the conducting wires as a part thereof, roughness portions formed on the conducting wires, recessed portions formed on the conducting wires, and the substrate being a high loss tangent substrate. The layout is performed according to the layout parameters defined thereabove, so as to increase loss of the high frequency signal in transmission.

Abstract: A semiconductor device includes a semiconductor substrate and a transistor formed in the substrate, the transistor having a gate stack that has an interfacial layer formed on the substrate, a high-k dielectric layer formed over the interfacial layer, a metal layer formed over the high-dielectric layer, a capping layer formed between the interfacial layer and high-k dielectric layer; and a doped layer formed on the metal layer, the doped layer including at least F.

Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a high-k dielectric layer over a semiconductor substrate, forming a capping layer over the high-k dielectric layer, forming a metal layer over the capping layer, forming a semiconductor layer over the metal layer, performing an implantation process on the semiconductor layer, the implantation process using a species including F, and forming a gate structure from the plurality of layers including the high-k dielectric layer, capping layer, metal layer, and semiconductor layer.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 81.76 to about 83.76, a value of a* in a range from about ?0.63 to about 0.37 and a value of b* in a range from about ?1.04 to about ?0.04 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes titanium. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 39.68 to about 41.68, a value of a* in a range from about 4.80 to about 5.80 and a value of b* in a range from about 6.88 to about 7.88 according to the Commission Internationale del'Eclairage, (CIE, International Commission on Illumination) LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and the color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 40.34 to about 42.34, a value of a* in a range from about 0.11 to about 1.11 and a value of b* in a range from about 2.24 to about 3.24 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 50.77 to about 52.77, a value of a* in a range from about ?0.93 to about 0.07 and a value of b* in a range from about ?1.26 to about ?0.26 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 36.54 to about 38.54, a value of a* in a range from about 0.04 to about 1.04 and a value of b* in a range from about 1.88 to about 2.88 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value for L* in a range from about 18.14 to about 19.14, a value for a* in a range from about 13.39 to about 14.39 and a value for b* in a range from about ?32.46 to about ?31.46 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 32.51 to about 34.51, a value of a* in a range from about ?8.74 to about ?7.74 and a value of b* in a range from about ?12.39 to about ?11.39 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 17.93 to about 19.93, a value of a* in a range from about 23.74 to about 24.74 and a value of b* in a range from about 2.20 to about 3.20 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and the color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 81.59 to about 83.59, a value of a* in a range from about ?0.55 to about 0.45 and a value of b* in a range from about ?0.60 to about 0.40 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 81.43 to about 83.43, a value of a* in a range from about 0.30 to about 1.30 and a value of b* in a range from about 2.11 to about 3.11 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and the color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 57.57 to about 59.57, a value of a* in a range from about 1.04 to about 2.04 and a value of b* in a range from about 6.64 to about 7.64 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region, and the color layer is located over the smooth region of the base. The color layer includes titanium, and has a value for L* in the range from 51.55 to 52.55, a value for a* in the range from 13.12 to 14.12 and a value for b* in the range from 6.27 to 7.27 according to the Commission Internationale del'Eclairage, (CIE, International Commission on Illumination) LAB system. The bonding layer is located between the substrate and the color layer, providing adhesion therebetween. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. A portion of the color layer corresponding to and located over the smooth region has a value for L* in a range from about 70.44 to about 72.44, a value for a* in a range from about ?7.84 to about ?6.84 and a value for b* in a range from about ?8.57 to about ?7.57 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. The color layer includes at least one metal layer. Portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 59.12 to about 61.12, a value of a* in a range from about 0.17 to about 1.17 and a value of b* in a range from about 2.40 to about 3.40 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 49.07 to about 51.07, a value of a* in a range from about 0.19 to about 1.19 and a value of b* in a range from about 1.94 to about 2.94 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 75.26 to about 77.26, a value of a* in a range from about 0.42 to about 1.42 and a value of b* in a range from about 9.36 to about 10.36 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.

Abstract: A colored device casing includes a base, a color layer and a bonding layer. The base has at least one smooth region. The bonding layer is positioned between the base and the color layer and bonds the base and color layer together. A portion of the color layer corresponding to and located over the smooth region has a value of L* in a range from about 51.00 to about 53.00, a value of a* in a range from about ?1.04 to about ?0.04 and a value of b* in a range from about 1.88 to about 2.88 according to the Commission Internationale del'Eclairage LAB system. A surface-treating method for fabricating the colored casing is also provided.