Abstract: An embedded component package structure including a dielectric structure and a component is provided. The component is embedded in the dielectric structure and is provided with a plurality of conductive pillars. The conductive pillars are exposed from an upper surface of the dielectric structure and have a first thickness and a second thickness, respectively, and the first thickness is not equal to the second thickness.

Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

Abstract: An embedded component package structure including a dielectric structure, a semiconductor chip, a first polymer layer, and a patterned conductive layer is provided. The semiconductor chip is embedded in the dielectric structure. The first polymer layer covers the semiconductor chip and has a first thickness, and the first thickness is greater than a second thickness of the dielectric structure above the first polymer layer. The patterned conductive layer covers an upper surface of the dielectric structure and extends over the first polymer layer, and the patterned conductive layer is electrically connected to the semiconductor chip.

Abstract: An embedded component package structure including a dielectric structure and a component is provided. The component is embedded in the dielectric structure and is provided with a plurality of conductive pillars. The conductive pillars are exposed from an upper surface of the dielectric structure and have a first thickness and a second thickness, respectively, and the first thickness is not equal to the second thickness.

Abstract: An embedded component package structure including a circuit substrate, an embedded component and a stress compensation layer is provided. The circuit substrate includes a core layer and an asymmetric circuit structure, and the core layer has a first thickness. The embedded component is disposed in the core layer. The stress compensation layer is disposed on one side of the core layer, and the stress compensation layer has a second thickness between 4 ?m and 351 ?m.

Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

Abstract: The fever epidemic detection system comprises a detection module, a control module and a communication module. The detection module measures and obtains a body-temperature measured value. The control module comprises a first operation unit, a determination unit and an alert unit. The first operation unit receives and calibrates the body-temperature measured value with a calibration factor, and generates a body-temperature calibrated value. The determination unit receives and determines whether the body-temperature calibrated value is within a preset normal body-temperature range and generates a determination result. The alert unit receives the determination result. The communication module transmits data to an external device. The alert unit generates a first alerting message, if the determination result shows that the body-temperature calibrated value is not within a preset normal body-temperature range.

Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.

Abstract: A vehicle information and environmental monitoring compound vehicle system is provided, including a sensor device used as a mobile sensor for collecting sensory data of roads, and the sensor device integrates various sensor modules and the second-generation on board computer diagnostic system serial port. The sensor device also integrates a long-distance low-power Internet of Things (LoRa) communication protocol, which can transmit data through the long-distance low-power Internet of Things gateway, and upload data to the cloud platform based on algorithm. The results of the analysis can establish a wide range of traffic congestion model through the detection information of traffic flow, and traffic density. The use of pixel-based measurement methods can quantify the urban road temperature, establish the urban heat island effect model, analyze the influence of temperature and humidity on the disease spread, establish the disease diffusion model, and display the sensor data in the graphical user interface.

Abstract: A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.

Abstract: A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.

Abstract: A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.

Abstract: A vehicle information and environmental monitoring compound vehicle system is provided, including a sensor device used as a mobile sensor for collecting sensory data of roads, and the sensor device integrates various sensor modules and the second-generation on board computer diagnostic system serial port. The sensor device also integrates a long-distance low-power Internet of Things (LoRa) communication protocol, which can transmit data through the long-distance low-power Internet of Things gateway, and upload data to the cloud platform based on algorithm. The results of the analysis can establish a wide range of traffic congestion model through the detection information of traffic flow, and traffic density. The use of pixel-based measurement methods can quantify the urban road temperature, establish the urban heat island effect model, analyze the influence of temperature and humidity on the disease spread, establish the disease diffusion model, and display the sensor data in the graphical user interface.

Abstract: A sensing device for power transmission line includes an induction coil device, a sensing circuit device, and a housing. A plurality of iron cores and a plurality of windings defined in the induction coil device. The windings are wound around the iron cores. A hole for power transmission line is defined in the induction coil device. The sensing circuit device detects operation status of a power transmission line and environmental parameters. The sensing circuit device includes a cover and a bottom plate. Multiple circuit boards are mounted on the bottom plate. The induction coil device is mounted on one side of the cover. Each of two ends of the housing has a streamline shape. The housing is hollow for receiving the sensing circuit device. The iron cores of the induction coil device includes at least one first iron core and at least one second iron core.

Abstract: A bee-keeping equipment includes a container, and a temperature adjusting device including conductive elements, a hive frame, a temperature adjusting circuit and two conductive films. Each conductive element is configured at an upper edge of each sidewall of the container. Metal through holes are arranged at the inner side of the hive frame. The temperature adjusting circuit includes heating elements. One end of each heating element is inserted into one metal through hole, and the other end of each heating element is inserted into another metal through hole to form a net-structure for supporting a hive. The conductive films are electrically connected to the metal through holes. The hive frame has two extending portions. The conductive films are respectively configured under the extending portions.

Abstract: The fever epidemic detection system comprises a detection module, a control module and a communication module. The detection module measures and obtains a body-temperature measured value. The control module comprises a first operation unit, a determination unit and an alert unit. The first operation unit receives and calibrates the body-temperature measured value with a calibration factor, and generates a body-temperature calibrated value. The determination unit receives and determines whether the body-temperature calibrated value is within a preset normal body-temperature range and generates a determination result. The alert unit receives the determination result. The communication module transmits data to an external device. The alert unit generates a first alerting message, if the determination result shows that the body-temperature calibrated value is not within a preset normal body-temperature range.

Abstract: A sensing device for power transmission line includes an induction coil device, a sensing circuit device, and a housing. A plurality of iron cores and a plurality of windings defined in the induction coil device. The windings are wound around the iron cores. A hole for power transmission line is defined in the induction coil device. The sensing circuit device detects operation status of a power transmission line and environmental parameters. The sensing circuit device includes a cover and a bottom plate. Multiple circuit boards are mounted on the bottom plate. The induction coil device is mounted on one side of the cover. Each of two ends of the housing has a streamline shape. The housing is hollow for receiving the sensing circuit device. The iron cores of the induction coil device includes at least one first iron core and at least one second iron core.

Abstract: A grid gateway and a transmission tower management system having a plurality of the grid gateways are disclosed. The grid gateways are connected with one another to form a mesh network. A plurality of sensors are provided within a wireless transmission range of the grid gateways. The sensors collect and send environmental parameters to the corresponding grid gateway within the wireless transmission range, in order to choose an optimal transmission path in the mesh network through grid gateways to transmit. The environmental parameters are transmitted through the optimal transmission path to a server for storage and analysis. A grid gateway and a transmission tower management system having a plurality of the grid gateways have broad and local area wireless transmission ability, so as to overcome restrictions of topography and communication to execute broad area management and monitor tasks.

Abstract: A grid gateway and a transmission tower management system having a plurality of the grid gateways are disclosed. The grid gateways are connected with one another to form a mesh network. A plurality of sensors are provided within a wireless transmission range of the grid gateways. The sensors collect and send environmental parameters to the corresponding grid gateway within the wireless transmission range, in order to choose an optimal transmission path in the mesh network through grid gateways to transmit. The environmental parameters are transmitted through the optimal transmission path to a server for storage and analysis. A grid gateway and a transmission tower management system having a plurality of the grid gateways have broad and local area wireless transmission ability, so as to overcome restrictions of topography and communication to execute broad area management and monitor tasks.

Abstract: A honeybee behavior monitoring system, including a honeybee behavior monitoring device positioned in a beehive for counting and recording the in-and-out activity of honeybees near a beehive, wherein the honeybee behavior monitoring device includes a first sensing unit and a second sensing unit for generating sensing signals; a counting unit for recording and determining whether honeybees are entering or departing from the beehive; a transmission unit for transmitting the in-and-out activity count to an external device, wherein each honeybee behavior monitoring device transfers data therebetween via a wireless sensing network, and finally data is transmitted to a rear-end server for storage and subsequent analysis of honeybee behaviors according to the status of counting and recording in each honeybee behavior monitoring device and ambient beehive environmental data or meteorological data, thereby providing accurate in-and-out activity counts to facilitate honeybee behavior studies.